Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.

Abstract: A semiconductor device includes a substrate, first and second active patterns extending in a first horizontal direction on the substrate, first and second gate electrodes extending in a second horizontal direction on the first and second active patterns, respectively, a first trench extending in the second horizontal direction between the first and second gate electrodes and separating the first and second active patterns, at least part of the first trench is in the substrate, an active cut extending along sidewalls and a bottom surface of the first trench and contacting each of the first and second active patterns, a second trench on the active cut in the first trench, and a flowable material layer in at least part of the second trench, the flowable material layer including a flowable insulating material and not being in contact with each of the substrate and the first and second active patterns.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Abstract: A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.

Abstract: The present disclosure relates to a plurality of host materials comprising a first host material comprising a compound represented by formula 1, and a second host material comprising a compound represented by formula 2, and an organic electroluminescent device comprising the same. By comprising a specific combination of compounds as host materials, it is possible to provide an organic electroluminescent device having lower driving voltage, higher luminous efficiency, higher power efficiency, and/or superior lifespan characteristics compared to conventional organic electroluminescent devices.

Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.

Abstract: A drying device for manufacturing an electrode comprises a dryer and a transfer part. The dryer is configured to dry a coated portion of an electrode base material when an electrode slurry is applied to the coated portion on at least one surface and not applied to an uncoated portion. The transfer part includes a floating part and a traveling part coupled to an outlet of the dryer. The floating part includes an air floating plate and is configured to float the electrode base material using air. The traveling part is configured to move the electrode base material in a process direction. A method for manufacturing an electrode includes drying an electrode base material in which electrode slurry is applied on a least one surface of the electrode base material at a high temperature, and floating and transferring the electrode base material using air.

Abstract: A semiconductor device includes an active pattern that extends in a first direction; a plurality of gate structures that are spaced apart in the first direction, and include a gate electrode that extends in a second direction; a source/drain recess between adjacent gate structures; a source/drain pattern in the source/drain recess; a source/drain contact connected to the source/drain pattern and that includes a lower part on the source/drain pattern and an upper par; and a contact silicide film disposed along the lower part of the source/drain contact and between the source/drain contact and the source/drain region. The source/drain pattern includes a semiconductor liner film that extends along the source/drain recess and includes silicon germanium, a semiconductor filling film on the semiconductor liner film and that includes silicon germanium, and a semiconductor insertion film that extends along side walls of the lower part of the source/drain contact and includes silicon germanium.

Abstract: The present disclosure relates to a detonation connector having an electric wire mounting structure, the detonation connector includes: an electrically conductive wire-connecting bracket member having a plurality of electric wire mounting gloves to which a leg line or a leading line is mounted; a lower casing member at which the wire-connecting bracket member is positioned; and an upper casing member covering the lower casing member, wherein the lower casing member may be provided with an opening through which a leg line passes, and the lower casing member is provided with a leg line mounting part therein. Accordingly, a stable connection state in the connector is maintained by fixing a double coated electric wire or a single coated electric wire in a state of being mounted to an opening of the detonation connector and the connection stability and the connection reliability of the leg line and the leading line are secured.

Abstract: A display device includes a first substrate including a display area and a non-display area adjacent to the display area, a first voltage line disposed on the first substrate and supplying a first voltage, a second substrate disposed on the first voltage line, and a thin film transistor layer disposed on the second substrate and comprising a plurality of thin film transistors and a second voltage line disposed in the non-display area and electrically connected to the first voltage line through a first contact hole penetrating the second substrate.

Abstract: A method for treating or preempting pain including postoperative pain following a soft or hard tissue surgery is disclosed. Also disclosed is a method for reducing an postoperative analgesic need, including administering a compound of Formula (I) or a salt thereof.

Abstract: The present disclosure relates to an electronic detonation device for a blasting system. The electronic detonation device include: an electronic detonator; a wireless communication module; an electric wire connecting the electronic detonator to the wireless communication module; and a communication module support in which the electric wire is stored in a wound state, with the wireless communication module positioned on an upper surface of the communication module support. The communication module support is provided with a pile part configured to be driven into a ground for fixation, so that the electronic detonation device enables stable communication reliability to be secured by orienting the wireless communication module toward the sky, thereby preventing malfunction during blasting and improving blasting accuracy.

Abstract: The present disclosure relates to a detonation connector having an exposure part for tagging, the detonation connector includes: an electrically conductive wire-connecting bracket member having a plurality of electric wire mounting grooves to which a leg line or a leading line is mounted; a lower casing member at which the wire-connecting bracket member is positioned; and an upper casing member covering the lower casing member, wherein the upper casing member or the lower casing member is provided with a tagging exposure part that exposes a part of the wire-connecting bracket member wire-connecting the leg line and the leading line, so that the tagging work of charging initialization time to a detonator can be performed without opening the upper casing member, and the convenience and the efficiency of the tagging work can be improved.

Abstract: The present disclosure relates to a detonation connector having an exposure part for tagging, the detonation connector includes: an electrically conductive wire-connecting bracket member having a plurality of electric wire mounting grooves to which a leg line or a leading line is mounted; a lower casing member at which the wire-connecting bracket member is positioned; and an upper casing member covering the lower casing member, wherein the upper casing member or the lower casing member is provided with a tagging exposure part that exposes a part of the wire-connecting bracket member wire-connecting the leg line and the leading line, so that the tagging work of charging initialization time to a detonator can be performed without opening the upper casing member, and the convenience and the efficiency of the tagging work can be improved.

Abstract: The present disclosure relates to an electronic detonation device for a blasting system. The electronic detonation device include: an electronic detonator; a wireless communication module; an electric wire connecting the electronic detonator to the wireless communication module; and a communication module support in which the electric wire is stored in a wound state, with the wireless communication module positioned on an upper surface of the communication module support. The communication module support is provided with a pile part configured to be driven into a ground for fixation, so that the electronic detonation device enables stable communication reliability to be secured by orienting the wireless communication module toward the sky, thereby preventing malfunction during blasting and improving blasting accuracy.

Abstract: Provided is an operator terminal for a blasting system. The terminal includes a logging unit that acquires detonation information on a detonator using a logging scheme, a scanning unit that acquires the detonation information using a scanning scheme, and a control unit that receives the detonation information, matches the detonation information and design information to each other, and transfers setting information corresponding to the detonation information to the detonator. The logging scheme is a scheme of acquiring the detonation information through a detonation wire connected to the detonator, and the scanning scheme is a scheme of capturing an identification image and thus acquiring the detonation information.

Abstract: The present disclosure relates to a detonation connector having an electric wire mounting structure, the detonation connector includes: an electrically conductive wire-connecting bracket member having a plurality of electric wire mounting gloves to which a leg line or a leading line is mounted; a lower casing member at which the wire-connecting bracket member is positioned and an upper casing member covering the lower casing member, wherein the lower casing member may be provided with an opening through which a leg line passes, and the lower casing member is provided with a leg line mounting part therein. Accordingly, a stable connection state in the connector is maintained by fixing a double coated electric wire or a single coated electric wire in a state of being mounted to an opening of the detonation connector and the connection stability and the connection reliability of the leg line and the leading line are secured.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the semiconductor device including a substrate including an active fin extending in a first direction; a gate structure extending in a second direction to intersect the active fin; a source/drain region on the active fin; a metal silicide layer on the source/drain region; a filling insulating portion on the metal silicide layer, the filling insulating portion having a contact hole connected to a portion of the metal silicide layer; a protective barrier layer between the metal silicide layer and the filing insulating portion; and a contact plug in the contact hole and electrically connected to the portion of the metal silicide layer.

Abstract: The present invention generally relates to polymeric surface coatings, and in particular polymeric coatings which are readily peelable and provide a surface protection function from contamination and physical scratching, as well as providing easy identifiability.

Abstract: Disclosed are a combination of active components inducing synergistic effects of multi-targeting and a use thereof. More particularly, disclosed are a functional food composition, a cosmetic composition, a pain-suppressive composition, and a composition for treatment or prevention of pruritus or atopic dermatitis, which comprise as active components, two or more components selected from a group consisting of (a) a 5-hydroxytryptamine subtype 2 (5-HT2) receptor antagonist; (b) a P2X receptor antagonist; and (c) any one of a glycine receptor agonist, a glycine transporter (GlyT) antagonist, a gamma-aminobutyric acid (GABA) receptor agonist, and a GABA transporter 1 (GAT1) antagonist.