Patents by Inventor Dooseok CHOI
Dooseok CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240356208Abstract: An antenna module is provided. The antenna module includes: antenna module including: a ground layer; and an antenna structure on the ground layer and including: a plurality of layers including a first layer, a second layer and a third layer, wherein the second layer and the third layer are between the ground layer and the first layer; one or more vias extending through at least a portion of the plurality of layers; a radiating element in the first layer, a first stub in the second layer and extending from the one or more vias; and a second stub in the third layer and extending from the one or more vias.Type: ApplicationFiled: September 21, 2023Publication date: October 24, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Doohyun Yang, Dooseok Choi, Youngki Lee, Seungyoon Jung, Woncheol Jeong, Dongkwon Choi, Joonhoi Hur
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Publication number: 20240347931Abstract: An electronic device includes: a first housing including a first surface and a second surface connected to the first surface and having an area that is smaller than an area of the first surface; a second housing including a third surface and a fourth surface connected to the third surface and having an area that is smaller than an area of the third surface; a hinge structure connecting the first housing and the second housing to be foldable relative to each other at a folding axis between a folded state of the electronic device and an unfolded state of the electronic device; a first antenna array provided at the first surface; and a second antenna array provided at the fourth surface; and a flexible board connecting the first antenna array and the second antenna array, wherein the first antenna array and the second antenna array are configured to form a third antenna array and to form a fourth antenna array, according to whether the electronic device is in the unfolded state or in the folded state.Type: ApplicationFiled: November 16, 2023Publication date: October 17, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok CHOI, Kyeol KWON, Youngki LEE, Dongkwon CHOI
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Patent number: 12040844Abstract: A wireless communications device may include a controller configured to, in a calibration mode, obtain a first output value of a first power detector after setting a first power amplifier to a first gain and obtain a second output value of the first power detector after setting the first power amplifier to a second gain, wherein the controller may estimate, in a normal mode, output power of a first antenna from an output value of the first power detector, based on a correction coefficient calculated using the first output value and the second output value.Type: GrantFiled: November 16, 2022Date of Patent: July 16, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok Choi, Youngki Lee, Joonhoi Hur
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Patent number: 11955997Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.Type: GrantFiled: July 19, 2021Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngmin Kim, Hongjong Park, Daeyoung Yoon, Sunwoo Lee, Youngki Lee, Dooseok Choi
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Publication number: 20240072446Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngki LEE, Sunwoo LEE, Dooseok CHOI, Seungchan HEO
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Publication number: 20240069184Abstract: An electronic device is provided. The electronic device includes: a transceiver configured to transmit or receive a wireless signal; and a processor configured to: control a first detector to detect whether an object is within a first distance range, based on a transmission/reception power ratio of the wireless signal; control a second detector to detect, based on the object not being detected within the first distance range, whether the object is within a second distance range outside the first distance range, based on a chirp pulse, which is obtained by frequency-modulating the wireless signal; and control transmission power of the wireless signal, based on whether the object is detected by the first detector or the second detector.Type: ApplicationFiled: July 18, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyungwoo YOO, Hyung Sun LIM, Dooseok CHOI, Joonhoi HUR
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Publication number: 20240072833Abstract: An electronic device is provided. The electronic device includes: a transceiver configured to transmit and receive a wireless signal; and a processor configured to: control a measurement circuit to identify a transmission/reception power ratio of the wireless signal; control a converter to transform the transmission/reception power ratio into frequency domain data; detect whether an object is adjacent the electronic device, based on the frequency domain data and an adjustable threshold; and control the transceiver based on whether the object is detected adjacent the electronic device.Type: ApplicationFiled: July 18, 2023Publication date: February 29, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: KYUNGWOO YOO, DOOSEOK CHOI, HYUNG SUN LIM, JOONHOI HUR
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Patent number: 11855357Abstract: An antenna device includes an antenna space, a barrier, a signal processing device, and a feed space. The antenna space includes first and second antennas that transmit/receive first and second radio frequency (RF) signals in different bands. The barrier includes a penetration region, is disposed adjacent to the antenna space, and reflects the first and second RF signals. The signal processing device adjacent to the barrier, includes first and second RF circuits that process the RF signals. The feed space includes first and second feed layers and is disposed adjacent to and stacked on the signal processing device, and adjacent to the barrier. A first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region.Type: GrantFiled: August 4, 2022Date of Patent: December 26, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngki Lee, Sunwoo Lee, Dooseok Choi
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Patent number: 11843190Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.Type: GrantFiled: June 6, 2022Date of Patent: December 12, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngki Lee, Sunwoo Lee, Dooseok Choi, Seungchan Heo
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Publication number: 20230170601Abstract: An electronic device includes a Radio Frequency Integrated Circuit (RFIC) chip, a first antenna module including a plurality of feed points electrically connected to the RFIC chip through a first feed line, and a second antenna module apart from the first antenna module. The second antenna module includes a plurality of feed points electrically connected to the RFIC chip through a second feed line, and a number of the plurality of feed points of the first antenna module is different from a number of the plurality of feed points of the second antenna module.Type: ApplicationFiled: August 12, 2022Publication date: June 1, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Dooseok CHOI, Young Min KIM, Min Young YOON, Young Ki LEE
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Publication number: 20230062464Abstract: Provided is an antenna array structure including a plurality of first antenna elements for transmitting and receiving a signal at a first frequency and a plurality of second antenna elements for transmitting and receiving a signal at a second frequency, wherein the plurality of first antenna elements are disposed in a first layer and aligned to a line extending in a first direction and the plurality of second antenna elements are disposed in a second layer and aligned to the line.Type: ApplicationFiled: August 23, 2022Publication date: March 2, 2023Inventors: Youngmin Kim, Dooseok Choi, Minyoung Yoon
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Publication number: 20230024260Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.Type: ApplicationFiled: October 3, 2022Publication date: January 26, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok CHOI, Youngki LEE, Sunwoo LEE, Thomas Byunghak CHO
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Publication number: 20220376406Abstract: An antenna device includes an antenna space, a barrier, a signal processing device, and a feed space. The antenna space includes first and second antennas that transmit/receive first and second radio frequency (RF) signals in different bands. The barrier includes a penetration region, is disposed adjacent to the antenna space, and reflects the first and second RF signals. The signal processing device adjacent to the barrier, includes first and second RF circuits that process the RF signals. The feed space includes first and second feed layers and is disposed adjacent to and stacked on the signal processing device, and adjacent to the barrier. A first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region.Type: ApplicationFiled: August 4, 2022Publication date: November 24, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngki LEE, Sunwoo LEE, Dooseok CHOI
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Patent number: 11462831Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.Type: GrantFiled: July 3, 2019Date of Patent: October 4, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok Choi, Youngki Lee, Sunwoo Lee, Thomas Byunghak Cho
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Publication number: 20220302592Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.Type: ApplicationFiled: June 6, 2022Publication date: September 22, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngki LEE, Sunwoo LEE, Dooseok CHOI, Seungchan HEO
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Patent number: 11437733Abstract: An antenna device includes a first antenna, a second antenna, a barrier, and a signal processing device. The first antenna transceives a first radio frequency (RF) signal in a first communication band, and the second antenna transceives a second RF signal in a second communication band. The first antenna includes a first radiator and a second radiator having a shape symmetrical to a shape of the first radiator. The second antenna includes third and fourth radiators having shape identical to those of the first and second radiators but having a size corresponding to the second communication band. The barrier includes a penetration region, and reflects the first and second RF signals. A center frequency of the second communication band is higher than a center frequency of the first communication band, and the first and second antennas are connected with the signal processing device through the penetration region of the barrier.Type: GrantFiled: September 30, 2020Date of Patent: September 6, 2022Assignee: SAMSUNG ELECTRONICS CO., LTDInventors: Youngki Lee, Sunwoo Lee, Dooseok Choi
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Patent number: 11355850Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.Type: GrantFiled: December 31, 2019Date of Patent: June 7, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngki Lee, Sunwoo Lee, Dooseok Choi, Seungchan Heo
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Patent number: 11329381Abstract: An antenna includes a first dielectric substrate and a first feeding element. The first dielectric substrate includes a first insulating layer, and a first radiation plate including a first opening that exposes an upper surface of the first insulating layer. The first feeding element is disposed in the first opening to penetrate the first insulating layer in a direction extending toward a lower surface of the first dielectric substrate. The first feeding element is insulated from the first radiation plate by the first insulating layer. The first feeding element includes a first conductive plate having an upper surface located on a same plane as an upper surface of the first radiation plate.Type: GrantFiled: September 10, 2020Date of Patent: May 10, 2022Assignee: SAMSUNG ELECTRONICS CO.. LTD.Inventors: Young Ki Lee, Sun Woo Lee, Dooseok Choi
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Patent number: 11177550Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.Type: GrantFiled: November 6, 2018Date of Patent: November 16, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok Choi, Thomas Byunghak Cho, Seung-chan Heo
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Publication number: 20210351797Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.Type: ApplicationFiled: July 19, 2021Publication date: November 11, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngmin Kim, Hongjong Park, Daeyoung Yoon, Sunwoo Lee, Youngki Lee, Dooseok Choi