Patents by Inventor Dorab Bhagwagar

Dorab Bhagwagar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141112
    Abstract: Curable polyolefin composition comprising: (A) polyolefin having at least two aliphatic unsaturated bonds per molecule; (B) wax with melting point of 30 to 100° C.; (C) organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) catalytic amount of hydrosilylation reaction catalyst, wherein content of component (A) is 20 to 80 mass %, content of component (B) is 10 to 75 mass %, and content of component (C) is 1 to 20 mass %, each based on the total mass of components (A) to (D). The composition can be cured to form a cured product capable of storing and releasing thermal energy, and preventing the wax leaking/pumping out during heat cycling.
    Type: Application
    Filed: March 3, 2021
    Publication date: May 2, 2024
    Inventors: Chao HE, Peng WEI, Jiguang ZHANG, Hongyu CHEN, Yan ZHENG, Chen CHEN, Dorab BHAGWAGAR
  • Publication number: 20240059946
    Abstract: A thermal interface material is provided. The thermal interface material comprises: (A) a polyolefin having at least two hydroxy groups per molecule; (B) at least one thermally conductive filler; (C) a phase change material with a melting point of 25 to 150° C.; and (D) a coupling agent. A content of component (B) is at least 80 mass %, a content of component (C) is 0.01 to 1 mass %, and a content of component (D) is 0.1 to 1 mass %, each based on a total mass of the thermal interface material. The thermal interface material becomes softer as its temperature increases. Meanwhile, the thermal interface material generally does not exhibit pumping-out in electronic devices during power cycling.
    Type: Application
    Filed: December 24, 2020
    Publication date: February 22, 2024
    Applicants: DOW GLOBAL TECHNOLOGIES LLC, DOW SILICONES CORPORATION
    Inventors: Chao HE, Dorab BHAGWAGAR, Jiguang ZHANG, Ling LING, Hongyu CHEN, Peng WEI, Yan ZHENG, Chen CHEN
  • Patent number: 11851603
    Abstract: A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 ?m, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 ?m, (D-3) boron nitride having a mean size of from 20 to 200 ?m.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: December 26, 2023
    Assignees: DOW SILICONES CORPORATION, DOW GLOBAL TECHNOLOGIES LLC (DGTL)
    Inventors: Xiaolian Hu, Jiguang Zhang, Yan Zheng, Hongyu Chen, Chen Chen, Dorab Bhagwagar, Darren Hansen
  • Publication number: 20230313016
    Abstract: A composition contains: (a) curable silicone composition including: (i) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane with a viscosity of 30 to 400 mPa*s; (ii) a SiH functional crosslinker; and (iii) a hydrosilylation catalyst; where the molar ratio of crosslinker SiH functionality to vinyl functionality is 0.5:1 to 1:1; (b) alkyl trialkoxysilane and/or a mono-trialkoxysiloxy terminated dimethylpolysiloxane treating agent; (c) filler mix containing: (i) 40 wt % or more of spherical and irregular shaped AlN particles, both having an average size of 30 micrometers or more, the spherical AlN fillers are 40-60 wt % of the weight of the AlN fillers; (ii) 25-35 wt % spherical Al2O3 particles with an average size of 1-5 micrometers; (iii) 10-15 wt % of additional thermally conductive filler with a 0.1-0.
    Type: Application
    Filed: November 10, 2020
    Publication date: October 5, 2023
    Inventors: Yan Zheng, Dorab Bhagwagar, Darren Hansen, Peng Wei, Han Guang Wu
  • Publication number: 20230295431
    Abstract: A composition contains: (a) a vinyl-functional polysiloxane; (b) a silyl hydride functional polysiloxane having on average at least two silyl hydride groups per molecule; (c) 60 to 92 weight-percent thermally conductive filler; (d) a platinum hydrosilylation catalyst; and (e) 0.05 to 2.0 weight-percent of a trialkoxy-functional polysiloxane; where the trialkoxy-functional polysiloxane has two or more trialkoxy functionalities per molecule and a number average molecular weight of 1200 or more and where weight-percents are relative to the composition weight.
    Type: Application
    Filed: May 6, 2020
    Publication date: September 21, 2023
    Inventors: Yan Huang, Dorab Bhagwagar, Zhongwei Cao
  • Patent number: 11732175
    Abstract: A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: August 22, 2023
    Assignee: DOW SILICONES CORPORATION
    Inventors: Dorab Bhagwagar, Cassie Hale, Peng Wei, Qianqing Ge, Yan Zheng, Zhanjie Li
  • Publication number: 20230257582
    Abstract: Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.
    Type: Application
    Filed: September 23, 2020
    Publication date: August 17, 2023
    Inventors: Jiguang Zhang, Yan Zheng, Chao He, Xuedong Gao, Qianqing Ge, Dorab Bhagwagar, Peng Wei, Chen Chen, Hongyu Chen
  • Publication number: 20230212447
    Abstract: A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.
    Type: Application
    Filed: October 28, 2020
    Publication date: July 6, 2023
    Inventors: Dorab Bhagwagar, Cassie Hale, Peng Wei, Qianqing Ge, Yan Zheng, Zhanjie Li
  • Patent number: 11655369
    Abstract: A composition contains an organopolysiloxane having the average chemical structure (I): [R?R2SiO—(R2SiO)m]3—Si—[OSiR2]n—Y—Si(OR)3??(I) where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R? is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X—(R2SiO)pSiR2—X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: May 23, 2023
    Assignee: DOW SILICONES CORPORATION
    Inventors: Dorab Bhagwagar, Peng Wei, Qianqing Ge, Yan Zheng, Zhanjie Li
  • Publication number: 20230090031
    Abstract: A composition contains an organopolysiloxane having the average chemical structure (I): [R?R2SiO—(R2SiO)m]3—Si—[OSiR2]n—Y—Si(OR)3??(I) where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R? is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X—(R2SiO)pSiR2—X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.
    Type: Application
    Filed: October 28, 2020
    Publication date: March 23, 2023
    Inventors: Dorab Bhagwagar, Peng Wei, Qianqing Ge, Yan Zheng, Zhanjie Li
  • Publication number: 20220372244
    Abstract: A composition contains (a) a polysiloxane; and (b) 0.15 weight-percent or more and 85 weight-percent of less, relative to composition weight dispersed in the polysiloxane, of zinc oxide particles having an average particle size of less than one micrometer and greater than one nanometer as determined as the volume weighted median value of particle diameter distribution using a laser diffraction particle size analyzer.
    Type: Application
    Filed: November 25, 2019
    Publication date: November 24, 2022
    Inventors: Yan Huang, Dorab Bhagwagar, Zhongwei Cao
  • Patent number: 11485861
    Abstract: A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: November 1, 2022
    Assignee: Dow Silicones Corporation
    Inventors: Peng Wei, Fengyi Su, Yan Zheng, Dorab Bhagwagar, Debo Hong, Danhuan Ma, Junmin Zhu
  • Publication number: 20220289936
    Abstract: A composition contains: (a) a polyorganosiloxane component comprising one or a combination of more than one poly-organosiloxane; (b) a filler treating agent comprising alkyltrialkoxysilane and trialkoxysiloxy-terminated diorganopolysiloxane; (c) 90-98 weight-percent of a combination of thermally conductive fillers comprising: (i) 25-40 weight-percent of thermally conductive filler particles having an average particle size of 70-150 micrometers and selected from one or a combination of aluminum oxide and aluminum nitride particles; (ii) 15-30 weight-percent thermally conductive filler particles having an average particle size in a range of 30-45 micrometers selected from one or a combination of aluminum oxide and aluminum nitride particles; (iii) 25-32 weight-percent aluminum oxide particles having an average particle size in a range of 1-5 micrometers; and (iv) 10-15 weight-percent thermally conductive filler particles having an average particle size in a range of 0.1 to 0.
    Type: Application
    Filed: December 5, 2019
    Publication date: September 15, 2022
    Inventors: Yan Zheng, Chen Chen, Dorab Bhagwagar, Peng Wei, Qianqing Ge
  • Publication number: 20210403716
    Abstract: A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 ?m, (D-2) middle-sized filler having a mean size of from 1 to 10 ?m, (D-3) large filler having a mean size of larger than 30 ?m and comprising at least magnesium oxide.
    Type: Application
    Filed: December 29, 2018
    Publication date: December 30, 2021
    Inventors: Xiaolian Hu, Jiguang Zhang, Yan Zheng, Hongyu Chen, Chen Chen, Dorab Bhagwagar, Darren Hansen
  • Publication number: 20210332280
    Abstract: A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 ?m, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 ?m, (D-3) boron nitride having a mean size of from 20 to 200 ?m.
    Type: Application
    Filed: November 7, 2018
    Publication date: October 28, 2021
    Inventors: Xiaolian Hu, Jiguang Zhang, Yan Zheng, Hongyu Chen, Chen Chen, Dorab Bhagwagar, Darren Hansen
  • Publication number: 20200354574
    Abstract: A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component
    Type: Application
    Filed: January 11, 2018
    Publication date: November 12, 2020
    Applicant: Dow Silicones Corporation
    Inventors: Peng Wei, Fengyi Su, Yan Zhang, Dorab Bhagwagar, Debo Hong, Danhuan Ma, Junmin Zhu
  • Publication number: 20190100650
    Abstract: Metal-polyorganosiloxane materials, methods of making and using them, and manufactured articles and devices containing them are disclosed. The metal-polyorganosiloxane materials have improved thermal stability and comprises a metal-polyorganosiloxane mixture that is free of condensation-curable polyorganosiloxane and solid particles other than metal particles and ceramic particles, the metal-organosiloxane mixture otherwise comprising: (A) a polyorganosiloxane that is free of silicon-bonded organoheteryl groups; (B) a hydrocarbylene-based multipodal silane; and (C) metal particles.
    Type: Application
    Filed: March 23, 2017
    Publication date: April 4, 2019
    Inventors: Dorab Bhagwagar, Cameron J. Kadleck, Adriana P. Zambova
  • Patent number: 10000680
    Abstract: Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: June 19, 2018
    Assignee: DOW SILICONES CORPORATION
    Inventors: Dorab Bhagwagar, Kelly Messing, Elizabeth Wood
  • Publication number: 20170158937
    Abstract: Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
    Type: Application
    Filed: February 22, 2017
    Publication date: June 8, 2017
    Applicant: Dow Corning Corporation
    Inventors: Dorab Bhagwagar, Kelly Messing, Elizabeth Wood
  • Patent number: 9598575
    Abstract: Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: March 21, 2017
    Assignee: DOW CORNING CORPORATION
    Inventors: Dorab Bhagwagar, Kelly Messing, Elizabeth Wood