Abstract: A thermal conductive silicone composition is provided. The composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) an organopolysiloxane having at most two silicon atom-bonded hydrogen atoms per molecule; (D) an aluminum hydroxide powder, such as a mixture of an aluminum hydroxide powder having an average particle size of at least 0.1 ?m and less than 5 ?m and an aluminum hydroxide powder having an average particle size of 5 ?m to 50 ?m; and (E) a hydrosilylation reaction catalyst. The composition cures to form a thermal conductive soft material. The material generally has little to no change in hardness even if the composition is cured after long-term storage.

Abstract: A hardcoat comprising a host matrix, a nanoporous filler in which the dispersed phase is a gas, and nonporous nanoparticles. Also, coating and curable compositions useful for preparing the hardcoat, methods of preparing the hardcoat and compositions, articles comprising the hardcoat or composition, and uses thereof.

Abstract: A composition comprises (A) a condensation reaction catalyst, (B) a polyorganosiloxane having an average, per molecule, of at least two hydrolyzable substituents, (C) a crosslinker, and (D) a thermally conductive filler. The polyorganosiloxane may be silanol terminated, and the crosslinker may be an alkoxysilylhydrocarbylene functional polyorganosiloxane. The composition is capable of reacting via condensation reaction to form a thermally conductive product. The composition and product are useful for thermal management in (opto)electronics applications.

Abstract: A silicone composition contains I) a shrink additive and II) a curable polyorganosiloxane composition. A method for fabricating an electronic device includes the steps of: 1) interposing the silicone composition between an IHS and a substrate, 2) curing the curable polyorganosiloxane composition to form a cured silicone product, and 3) removing the shrink additive during and/or after step 2), thereby compressing the IHS to the substrate. Compressing occurs as thickness of the cured silicone product decreases, as compared to thickness of the silicone composition interposed in step 1).

Abstract: The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.

Abstract: The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.

Abstract: A composition comprises (A) a condensation reaction catalyst, (B) a polyorganosiloxane having an average, per molecule, of at least two hydrolyzable substituents, (C) a crosslinker, and (D) a thermally conductive filler. The polyorganosiloxane may be silanol terminated, and the crosslinker may be an alkoxysilylhydrocarbylene functional polyorganosiloxane. The composition is capable of reacting via condensation reaction to form a thermally conductive product. The composition and product are useful for thermal management in (opto)electronics applications.

Abstract: A thermally conductive grease includes 2 vol % to 15 vol % of a combination of three polyorganosiloxanes and 65 vol % to 98 vol % of a thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from (opto)electronic devices, in both TIM1 and TIM2 applications.

Abstract: A thermally conductive grease includes 2 vol % to 15 vol % of a combination of three polyorganosiloxanes and 65 vol % to 98 vol % of a thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from (opto)electronic devices, in both TIM1 and TIM2 applications.

Abstract: This invention relates to silicone compositions suitable for forining pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties.

Abstract: A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which component B) commences softening is less than the curing temperature of component A). A thermal interface material is prepared by: 1) interposing the composition between an electronic component and a heat spreader to form a bondline, 2) heating the composition to a temperature higher than the temperature at which component B) commences softening but less than the curing temperature of component A) and optionally applying pressure to the composition, and 3) heating the composition to a temperature greater than or equal to the curing temperature of component A). The average particle size of component B) is greater than or equal to the bondline thickness.

Abstract: A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.

Abstract: A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.

Abstract: A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which component B) commences softening is less than the curing temperature of component A). A thermal interface material is prepared by: 1) interposing the composition between an electronic component and a heat spreader to form a bondline, 2) heating the composition to a temperature higher than the temperature at which component B) commences softening but less than the curing temperature of component A) and optionally applying pressure to the composition, and 3) heating the composition to a temperature greater than or equal to the curing temperature of component A). The average particle size of component B) is greater than or equal to the bondline thickness.

Abstract: A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: A silicone composition, comprising (A) 10 to 50 parts by weight of a polydiorganosiloxane having the formula R13SiO(R12SiO)nSiR13 wherein each R1 is independently a monovalent aliphatic hydrocarbon group or a monovalent halogenated aliphatic hydrocarbon group, n has a value such that the polydiorganosiloxane has a viscosity from 0.1 to 200 Pa·s at 25° C., and the polydiorganosiloxane contains an average of at least two alkenyl groups per molecule; (B) 50 to 90 parts by weight of an organopolysiloxane resin consisting essentially of R23SiO1/2 siloxane units and SiO4/2 siloxane units wherein each R2 is independently alkyl or alkenyl, the mole ratio of R23SiO1/2 units to SiO4/2 units is from 0.65 to 1.