Patents by Inventor Doreen Heppner

Doreen Heppner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation for an organic electronic device
    Patent number: 9601721
    Abstract: An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: March 21, 2017
    Assignee: OSRAM OLED GmbH
    Inventors: Erwin Lang, Richard Baisl, Tilman Schlenker, Doreen Heppner, Michael Popp, Evelyn Trummer-Sailer
  • Encapsulation structure for an opto-electronic component
    Patent number: 9172057
    Abstract: An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: October 27, 2015
    Assignee: OSRAM OLED GmbH
    Inventors: Richard Baisl, Dirk Becker, Thomas Dobbertin, Doreen Heppner, Benjamin Krummacher, Erwin Lang, Tilman Schlenker, Christian Schmid
  • ENCAPSULATION STRUCTURE FOR AN OPTO-ELECTRONIC COMPONENT, AND METHOD FOR ENCAPSULATING AN OPTOELECTRONIC COMPONENT
    Publication number: 20140252406
    Abstract: An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.
    Type: Application
    Filed: June 20, 2012
    Publication date: September 11, 2014
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Richard Baisl, Dirk Becker, Thomas Dobbertin, Doreen Heppner, Benjamin Krummacher, Erwin Lang, Tilman Schlenker, Christian Schmid