Patents by Inventor Doreen Jane Ossenkop

Doreen Jane Ossenkop has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through substrate via including variable sidewall profile
    Patent number: 8643190
    Abstract: A microelectronic structure, such as a semiconductor structure, and a method for fabricating the microelectronic structure, include an aperture within a substrate. Into the aperture is located and formed a via. The via may include a through substrate via. The aperture includes, progressing sequentially contiguously at least partially through the substrate: (1) a first comparatively wide region at a surface of the substrate; (2) a constricted region contiguous with the first comparatively wide region; (3) a second comparatively wide region contiguous with the constricted region; and (4) a tapered region contiguous with the second comparatively wide region. The structure of the aperture provides for ease in filling the aperture, as well as void isolation within the via that is filled into the aperture.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: February 4, 2014
    Assignee: Ultratech, Inc.
    Inventors: Edward Crandal Cooney, III, Peter James Lindgren, Doreen Jane Ossenkop, Anthony Kendall Stamper
  • THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE
    Publication number: 20110068477
    Abstract: A microelectronic structure, such as a semiconductor structure, and a method for fabricating the microelectronic structure, include an aperture within a substrate. Into the aperture is located and formed a via. The via may include a through substrate via. The aperture includes, progressing sequentially contiguously at least partially through the substrate: (1) a first comparatively wide region at a surface of the substrate; (2) a constricted region contiguous with the first comparatively wide region; (3) a second comparatively wide region contiguous with the constricted region; and (4) a tapered region contiguous with the second comparatively wide region. The structure of the aperture provides for ease in filling the aperture, as well as void isolation within the via that is filled into the aperture.
    Type: Application
    Filed: November 29, 2010
    Publication date: March 24, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Edward Crandal Cooney, III, Peter James Lindgren, Doreen Jane Ossenkop, Anthony Kendall Stamper