Abstract: A MEMS (Microelectromechanical System) INU (Inertial Navigation Unit) chip comprises a compact autonomous device undergoing motion tracks and analyzes its definite movement relative to local Earth coordinates with optimal accuracy and repeatability of lmm over distances of greater than two meters. The MEMS INU includes an Inertial Motion Tracking Device (IMTD) comprises a gyroscope, accelerometer, magnetometer, and digital processor programmed with a general purpose Inertial Measurement Engine (IME), an application specific Motion Analysis and Adaptation (MAA) program and a low power radio. The IMTD tracks its motion with optimum accuracy using compact practical sensors that may have noise and drift by periodically and autonomously checking its velocity changes at an optimum interval, computing a linear acceleration therefrom and determining a no-motion or motion condition relative to a threshold and correcting its velocity, position and acceleration errors when there is no motion.

Abstract: A compact Inertial Wave Angle Gyroscope (IWAG) is operated using a phase lock loop to track resonator phase and a baseband regulator to null quadrature. The resonator velocity or its components computed from precession angle are first determined at baseband and then applied to gain matrices in order to generate the feedback control forces for self-precession, cancellation of damping and compensation of anisodamping. The inertial rotation input is determined from the measured total precession angle by removing the computed or calibrated self-precession angle. The resonator energy can be regulated to a fixed magnitude and the baseband feedback force for self-precession at a fixed rate determined from components computed from precession angle such that the total force is in phase with baseband velocity but has fixed magnitude. The IWAG inertial rotation input can be determined from the measured total precession rate by removing the computed self-precession rate.

Abstract: A compact Inertial Wave Angle Gyroscope (IWAG) is disclosed without zero rate drift due to residual asymmetry comprises antisymmetric velocity feedback of sufficient magnitude to produce a continual self-precession of its vibration pattern to overcome any rate threshold and average the effects of its residual asymmetry on zero rate drift to zero over each revolution of the precession pattern in the case. The inertial rotation input is determined from the measured total precession rate by removing the computed self-precession rate.

Abstract: A compact autonomous device undergoing motion tracks and analyzes its definite movement relative to local Earth coordinates with optimal accuracy and repeatability of 1 mm over distances of greater than two meters. The Inertial Motion Tracking Device (IMTD) comprises a gyroscope, accelerometer, magnetometer, and digital processor programmed with a general purpose Inertial Measurement Engine (IME), an application specific Motion Analysis and Adaptation (MAA) program and a low power radio. The IMTD tracks its motion with optimum accuracy using compact practical sensors that may have noise and drift by periodically and autonomously checking its velocity changes at an optimum interval, computing a linear acceleration therefrom and determining a no-motion or motion condition relative to a threshold and correcting its velocity, position and acceleration errors when there is no motion.

Abstract: A gyroscope system may include a disc resonator gyroscope including a plurality of electrodes embedded in the disc resonator gyroscope. The electrodes may be configured for at least applying a drive voltage and a tuning voltage to the disc resonator gyroscope and for sensing operating parameters of the disc resonator gyroscope. The gyroscope system may also include a quadrature stabilization circuit configured to measure a quadrature error and generate a quadrature regulating voltage based on the quadrature error. The tuning voltage may be adjusted by the quadrature regulating voltage to cancel an effect of voltage flicker before being applied to a tuning electrode of the disc resonator gyroscope.

Abstract: A method for compensating for bias of a gyroscope. In one embodiment, bias measurements for a plurality of drive angles are generated using the gyroscope. A set of equations for the bias of the gyroscope is identified using a model for motion of the gyroscope. The set of equations includes a set of parameters for the bias of the gyroscope. A set of values for the set of parameters is identified using the bias measurements and the set of equations.

Abstract: A method for simultaneously identifying an inertial rate of a gyroscope and a bias for a gyroscope. A set of equations for an output of the gyroscope is identified using a model for motion of the gyroscope. The set of equations includes a set of parameters for the bias of the gyroscope. The inertial rate of the gyroscope and a set of values for the set of parameters for the bias of the gyroscope are identified using the set of equations and measurements generated by the gyroscope for a plurality of drive angles.

Abstract: A gyroscope system may include a disc resonator gyroscope including a plurality of electrodes embedded in the disc resonator gyroscope. The electrodes may be configured for at least applying a drive voltage and a tuning voltage to the disc resonator gyroscope and for sensing operating parameters of the disc resonator gyroscope. The gyroscope system may also include a quadrature stabilization circuit configured to measure a quadrature error and generate a quadrature regulating voltage based on the quadrature error. The tuning voltage may be adjusted by the quadrature regulating voltage to cancel an effect of voltage flicker before being applied to a tuning electrode of the disc resonator gyroscope.

Abstract: A method for compensating for bias of a gyroscope. In one embodiment, bias measurements for a plurality of drive angles are generated using the gyroscope. A set of equations for the bias of the gyroscope is identified using a model for motion of the gyroscope. The set of equations includes a set of parameters for the bias of the gyroscope. A set of values for the set of parameters is identified using the bias measurements and the set of equations.

Abstract: Micromachined disc resonator gyroscopes (DRGs) are disclosed designed to be virtually immune to external temperature and stress effects. The DRG is a vibratory gyroscope that measures angular rate which is designed to have reduced sensitivity to external thermal and mechanical stress. The DRG features an integrated isolator that may be fabricated on the same wafer as the electrode wafer forming a plurality of integrated isolator beams. In addition, the DRG may include a wafer level hermetical vacuum seal, flip chip ball grid array (BGA), and vertical electrical feedthrough to improve reliability and to reduce manufacturing cost. An additional carrier layer may be used with shock stops, vertical electrical feedthrough, and the flip chip BGA. A pyrex or quartz cap with embedded getter and shock stops can be employed.

Abstract: Techniques for reducing the frequency split between the Coriolis-coupled modes in disc resonator gyroscopes (DRGs) by perturbing the mass distribution on the disc resonator based on an identified model are disclosed. A model-identification method of tuning a resonator comprises perturbing the mass and measuring a frequency response matrix of the resonator. The frequency response matrix includes a plurality of inputs and a plurality of outputs and the resonator has a plurality of coupled resonance modes. A reduced structural mechanics matrix model of the resonator in sensor and actuator coordinates is identified from the measured frequency response matrix and analyzed to determine generalized eigenvectors of the structural mechanics model and their variations due to selected mass perturbations which is then estimated to improve degeneracy of the plurality of coupled resonance modes based on the generalized eigenvectors of the mass and the stiffness.

Abstract: The present disclosure provides a small size hand-held device for aligning two or more structures by attaching the device to master and slave structures and providing real-time position/orientation data to enable the accurate alignment of the structures. The handheld device includes a sensor box containing at least one inertial sensor, such as for example, a gyroscope (such as a disc resonator gyroscope) or an accelerometer. The handheld device further includes an alignment socket designed to mate with an alignment key that may be fixed to the structures to be aligned, and a display for showing a position data output received from the at least one inertial sensor. The handheld device may further include a processor for processing and outputting data to the display and/or the handheld device may include a transmitter for transmitting the data to a central processing unit.

Abstract: A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems.

Abstract: A single layer micromachined thermal and mechanical isolator may be bonded between a microelectromechanical system (MEMS) die and package. Small bond pads of the isolator are attached to the periphery of the die. The isolator material may be chosen to match that of the die, reducing CTE mismatch. Long thin isolation beams can be used to provide thermal isolation against external temperature changes, which may be conducted through the package. Weak and flexible beams can be used to tolerate large displacements with very little resistance. Thus, excessive stress or distortion to the package, from either CTE mismatch or external stress, may be absorbed by the isolator and will not be transmitted to the MEMS die. Beam rigidity may be designed to attenuate vibration of particular frequency range. The isolator can be readily inserted into an existing disc resonator gyroscope package in one thermal compression bond step.

Abstract: Tuning an axisymmetric resonator such as in a disc resonator gyroscope (DRG) is disclosed. Frequency tuning a DRG in a single step informed by a systematic physical model of the resonator structure, sensing and actuation elements, such as a finite element model, is provided. The sensitivity of selected trimming positions on the resonator to reducing asymmetry terms is determined via perturbations of the systematic model. As well, the dependence of the parameters of model transfer functions between actuation and sensing elements on resonator asymmetry are systematically determined. One or two measured transfer functions may then be analyzed according to the systematic model to fully determine the needed asymmetry correction components of the DRG. One or two of four groups of four electrostatic bias electrodes or four groups of four laser trimming locations for the DRG are utilized to correct the asymmetry components which can give rise to mistuning.

Abstract: A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems.

Abstract: Sensing motion of multiple degrees of freedom for an integral inertial measurement unit provided through the operation of a single centrally mounted planar disc resonator having a single driven mode in a single vacuum enclosure is disclosed. The resonator comprises a circumferentially slotted disc having multiple internal capacitive electrodes within the slots in order to excite a single in-plane driven vibration and sense in-plane vibration modes or motion of the resonator. In addition, vertical electrodes disposed below and/or above the resonator may also be used to sense out-of-plane vibration or motion. Acceleration sensing in three orthogonal axes can be obtained by sensing two lateral modes of the disc resonator in the plane of the disc from the internal electrodes and a vertical mode from the vertical electrodes.

Abstract: Micromachined disc resonator gyroscopes (DRGs) are disclosed designed to be virtually immune to external temperature and stress effects. The DRG is a vibratory gyroscope that measures angular rate which is designed to have reduced sensitivity to external thermal and mechanical stress. The DRG features an integrated isolator that may be fabricated on the same wafer as the electrode wafer forming a plurality of integrated isolator beams. In addition, the DRG may include a wafer level hermetical vacuum seal, flip chip ball grid array (BGA), and vertical electrical feedthrough to improve reliability and to reduce manufacturing cost. An additional carrier layer may be used with shock stops, vertical electrical feedthrough, and the flip chip BGA. A pyrex or quartz cap with embedded getter and shock stops can be employed.

Abstract: A single layer micromachined thermal and mechanical isolator may be bonded between a microelectromechanical system (MEMS) die and package. Small bond pads of the isolator are attached to the periphery of the die. The isolator material may be chosen to match that of the die, reducing CTE mismatch. Long thin isolation beams can be used to provide thermal isolation against external temperature changes, which may be conducted through the package. Weak and flexible beams can be used to tolerate large displacements with very little resistance. Thus, excessive stress or distortion to the package, from either CTE mismatch or external stress, may be absorbed by the isolator and will not be transmitted to the MEMS die. Beam rigidity may be designed to attenuate vibration of particular frequency range. The isolator can be readily inserted into an existing disc resonator gyroscope package in one thermal compression bond step.

Abstract: Packaging techniques for planar resonator gyroscopes, such as disc resonator gyroscopes (DRGs) are disclosed. A gyroscope die may be attached to its package substrate on a central disc area that is inboard of its embedded electrodes. This configuration eliminates contact of the die with the package substrate beneath the embedded electrodes allowing the internal electrode support structure to expand or contract freely without stress as its temperature changes. The central attachment can also be used diminish the package temperature gradients on the periphery of the die, if the thermal conductivity of the central disc attachment material is higher than the package substrate. Temperature gradients across the resonator also lead to thermoelastic damping asymmetry and rate drift. In addition, the electrical connections to the die may be formed by vertical vias within the central disc attachment area or by thin wirebonds to peripheral I/O pads on the gyro chip.