Abstract: A chemical sensor has a substrate, a first metallization plane on the substrate, an electrode structure formed in the first metallization plane, a passivation layer applied to the first metallization plane and formed with contact holes, a sensitive ceramic layer on the passivation layer and in the contact holes, and a bond-promoting layer configured as a second metallization plane and between the passivation layer and the ceramic layer.

Abstract: The invention relates to a sensor comprising a first metallization plane located on a substrate (1), a passivation layer (6) that is structured by contact holes (7) and is applied to said substrate and a sensitive ceramic layer (9) formed by thick-film technology on the passivation layer and in the contact holes (7). The aim of the invention is to improve the adhesion of the ceramic layer (9). To achieve this, the sensor is provided with an adhesion promoter layer (8) that is configured as a second metallization plane and is located between the passivation layer (6) and the ceramic layer (9).

Abstract: A method of micromechanically manufacturing fixed and movable layer-like electrodes of a semiconductor element, for example, a capacitive acceleration sensor, which are exposed over a substrate over a certain area is provided. A sacrificial layer may be arranged between the substrate and the fixed and movable electrodes being removed in an etching step in order to expose the electrodes with respect to the substrate. The thickness of the sacrificial layer located in the area of the fixed electrodes may be less than the thickness of the sacrificial layer located in the area of the movable electrodes.