Patents by Inventor Doris Sommer

Doris Sommer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10199372
    Abstract: An integrated circuit device including a chip die having a first area with a first thickness surrounding a second area with a second thickness, the first thickness is greater than the second thickness, the chip die having a front-side and a back-side, at least one passive electrical component provided at least one of in or over the chip die in the first area on the front-side, and at least one active electrical component provided at least one of in or over the chip die in the second area on the front-side.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: February 5, 2019
    Assignee: Infineon Technologies AG
    Inventors: Ingo Muri, Iris Moder, Oliver Hellmund, Johannes Baumgartl, Annette Saenger, Barbara Eichinger, Doris Sommer, Jacob Tillmann Ludwig
  • Publication number: 20180374843
    Abstract: An integrated circuit device including a chip die having a first area with a first thickness surrounding a second area with a second thickness, the first thickness is greater than the second thickness, the chip die having a front-side and a back-side, at least one passive electrical component provided at least one of in or over the chip die in the first area on the front-side, and at least one active electrical component provided at least one of in or over the chip die in the second area on the front-side.
    Type: Application
    Filed: June 23, 2017
    Publication date: December 27, 2018
    Inventors: Ingo Muri, Iris Moder, Oliver Hellmund, Johannes Baumgartl, Annette Saenger, Barbara Eichinger, Doris Sommer, Jacob Tillmann Ludwig