Patents by Inventor Doron NAVEH
Doron NAVEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11963309Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.Type: GrantFiled: July 1, 2021Date of Patent: April 16, 2024Assignees: MELLANOX TECHNOLOGIES, LTD., BAR-ILAN UNIVERSITY, PCB TECHNOLOGIES LTD.Inventors: Boaz Atias, Elad Mentovich, Yaniv Rotem, Doron Naveh, Adi Levi, Yosi Ben-Naim, Yaad Eliya, Shlomo Danino, Eran Lipp, Alon Rubinstein, Ran Hasson Ruso
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Publication number: 20230357044Abstract: The present disclosure relates to layered 2D MoS2 nanostructures wherein light-matter interactions are enhanced by intercalation with transition metal atoms and/or post-transition metal atoms, specifically Cu and/or Sn. Photodetectors comprising Cu and/or Sn intercalated 2D MoS2 nanostructures amplify the response in the near-infrared for devices based on 2D MoS2.Type: ApplicationFiled: May 5, 2023Publication date: November 9, 2023Inventors: Kristie Koski, Doron Naveh, Chen Stern, Avraham Twitto
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Publication number: 20230170670Abstract: A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.Type: ApplicationFiled: December 2, 2021Publication date: June 1, 2023Inventors: Dimitrios Kalavrouziotis, Paraskevas Bakopoulos, Elad Mentovich, Anna Sandomirsky, Boaz Atias, Doron Naveh, Eilam Zigi Ben Smolinsky, Adi Levi, Rana Darweesh
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Publication number: 20230002906Abstract: A continuous-feed chemical vapor deposition system and an associated method are provided. An example of the continuous-feed chemical vapor deposition system includes a first chamber configured to receive a substrate. The continuous-feed chemical vapor deposition system includes a second chamber downstream from the first chamber and configured to receive the substrate from the first chamber. The second chamber is configured to perform a chemical vapor deposition process on the substrate. The continuous-feed chemical vapor deposition system includes a third chamber downstream from the second chamber that is configured to receive the substrate from the second chamber upon completion of the chemical vapor deposition process. The second chamber can be environmentally isolated from the first chamber and the third chamber. The first chamber is further configured to receive a subsequent substrate when the chemical vapor deposition process is occurring in the second chamber.Type: ApplicationFiled: July 1, 2021Publication date: January 5, 2023Inventors: Elad MENTOVICH, Yaniv ROTEM, Yaakov GRIDISH, Doron NAVEH, Chen STERN, Yosi BEN-NAIM, Ariel ISMACH, Eran BAR-RABI, Tal KAUFMAN
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Publication number: 20230007789Abstract: Processes for creating a two-dimensional-target structure are disclosed. An example process to create a two-dimensional-target structure may include the process of providing two-dimensional material grown on an initial substrate to create a two-dimensional-substrate structure; applying the two-dimensional-substrate structure to a target substrate via an adhesion promoter to create a lamination stack; applying a lamination process to the lamination stack; and then removing the initial substrate from the lamination stack, post-lamination, to create the two-dimensional-target structure. The two-dimensional-target structure may then be used in such rigid or flexible electronic devices and/or non-standard devices as the target substrate may be rigid or flexible and/or translucent in contrast to the initial substrate first used to grow the two-dimensional material.Type: ApplicationFiled: July 1, 2021Publication date: January 5, 2023Inventors: Elad MENTOVICH, Boaz Atias, Doron Naveh, Adi Levi
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Publication number: 20230007788Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.Type: ApplicationFiled: July 1, 2021Publication date: January 5, 2023Inventors: Boaz ATIAS, Elad Mentovich, Yaniv Rotem, Doron Naveh, Adi Levi, Yosi Ben-Naim, Yaad Eliya, Shlomo Danino, Eran Lipp, Alon Rubinsten
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Publication number: 20220380901Abstract: A system and method for performing is laser induced forward transfer (LIFT) of 2D materials is disclosed. The method includes generating a receiver substrate, generating a donor substrate, wherein the donor substrate comprises a back surface and a front surface, applying a coating to the front surface, wherein the coating includes donor material, aligning the front surface of the donor substrate to be parallel to and facing the receiver substrate, wherein the donor material is disposed adjacent to the target layer, and irradiating the coating through the back surface of the donor substrate with one or more laser pulses produced by a laser to transfer a portion of the donor material to the target layer. The donor material may include Bi2S3-xSx, MoS2, hexagonal boron nitride (h-BN) or graphene. The method may be used to create touch sensors and other electronic components.Type: ApplicationFiled: April 20, 2022Publication date: December 1, 2022Inventors: Ioanna Zergioti, Symeon Papazoglou, Filimon Zacharatos, Adamantia Logotheti, Amaia Pesquera, Amaia Zurutuza, Doron Naveh
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Publication number: 20220372621Abstract: A substrate carrier and a mechanism for moving the substrate carrier through a chemical vapor deposition system are provided. The substrate carrier includes a cylindrical housing having an interior surface. A plurality of plurality of shelves fixed to the interior surface, each shelf configured to support at least one substrate. The substrate carrier may include a connector configured to engage the substrate carrier with the mechanism. The mechanism may include a moveable arm and a motor configured to actuate the moveable arm. The moveable arm may include an actuating member connected to the motor and configured to move the moveable arm between a retracted state and an extended state. The moveable arm may be configured to operate in a chamber having a first pressure and a first temperature and the motor may be configured to operate in an environment having a second pressure.Type: ApplicationFiled: July 1, 2021Publication date: November 24, 2022Inventors: Elad MENTOVICH, Yaniv ROTEM, Yaakov GRIDISH, Doron NAVEH, Chen STERN, Yosi BEN-NAIM, Ariel ISMACH, Eran BAR-RABI, Tal KAUFMAN
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Publication number: 20220372622Abstract: A first and a second flange assembly configured for facilitating uniform and laminar flow in a system are provided. The first flange assembly includes a first flange body configured to introduce a gas into a chamber. The first flange assembly includes a plurality of outlet tubes disposed on an interior surface of the first flange body and a plurality of inlet tubes disposed on an exterior surface of the first flange body and in fluid communication with the plurality of outlet tubes. The second flange assembly includes a second flange body configured to remove the gas from the chamber. The second flange assembly includes a plurality of through holes extending from an interior surface to an exterior surface of the second flange body and a plurality of exit tubes extending from the exterior surface of the second flange body and in fluid communication with the plurality of through holes.Type: ApplicationFiled: July 1, 2021Publication date: November 24, 2022Inventors: Elad Mentovich, Yaniv ROTEM, Yaakov GRIDISH, Doron NAVEH, Chen STERN, Yosi BEN-NAIM, Ariel ISMACH, Eran BAR-RABI, Tal KAUFMAN
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Publication number: 20220377907Abstract: Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.Type: ApplicationFiled: July 1, 2021Publication date: November 24, 2022Inventors: Elad MENTOVICH, Boaz ATIAS, Doron NAVEH, Eilam Zigi Ben SMOLINSKY, Adi LEVI
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Publication number: 20220377912Abstract: Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.Type: ApplicationFiled: July 1, 2021Publication date: November 24, 2022Inventors: Boaz ATIAS, Elad MENTOVICH, Yaniv ROTEM, Doron NAVEH, Adi LEVI, Yosi BEN-NAIM, Yaad ELIYA, Shlomo DANINO, Eran LIPP
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Patent number: 10841709Abstract: A membrane hetero-structure includes a polymer layer and a single-layer or multi-layer graphene sheet disposed on the polymer layer. The membrane hetero-structure is tensioned across a frame having an opening such that both the polymer layer and the graphene sheet extend across the opening. An optional rigid member is provided in a center of the membrane to be spaced apart from edges of the opening. The assembly of the frame and membrane hetero-structure forms an electrostatically driven micro-electro-mechanical system (MEMS) or sound generation and recording apparatus. In one instance, when a voltage signal is applied between an electrode layer parallel to the membrane and contacts on the frame that are electrically connected to the graphene sheet, the membrane hetero-structure is actuated.Type: GrantFiled: December 6, 2018Date of Patent: November 17, 2020Assignees: WAVES AUDIO LTD., VIRGINIA TECH INTELLECTUAL PROPERTIES, INC., BAR-ILAN UNIVERSITYInventors: Gabriel Zeltzer, Gavriel Speyer, Meir Shaashua, Vlada Artel, Adi Levi, Doron Naveh, Assad U. Khan, Yi Chen Guo, Guoliang Liu
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Publication number: 20200186938Abstract: A membrane hetero-structure includes a polymer layer and a single-layer or multi-layer graphene sheet disposed on the polymer layer. The membrane hetero-structure is tensioned across a frame having an opening such that both the polymer layer and the graphene sheet extend across the opening. An optional rigid member is provided in a center of the membrane to be spaced apart from edges of the opening. The assembly of the frame and membrane hetero-structure forms an electrostatically driven micro-electro-mechanical system (MEMS) or sound generation and recording apparatus. In one instance, when a voltage signal is applied between an electrode layer parallel to the membrane and contacts on the frame that are electrically connected to the graphene sheet, the membrane hetero-structure is actuated.Type: ApplicationFiled: December 6, 2018Publication date: June 11, 2020Inventors: Gabriel ZELTZER, Gavriel SPEYER, Meir SHAASHUA, Vlada ARTEL, Adi LEVI, Doron NAVEH, Assad U. KHAN, Yi Chen GUO, Guoliang LIU