Patents by Inventor Dorota Temple
Dorota Temple has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240127954Abstract: Disclosed herein are systems, methods, and devices of detecting illness in presymptomatic and asymptomatic infected persons using wearable sensor technology. In a first embodiment, a method is implemented on a computing device, the method includes receiving first sensor data associated with the person over a first period of time and applying the first sensor data to a multi-variate detection model. The method further includes receiving second sensor data associated with the person over a second period of time and applying the second sensor data to the multi-variate detection model. Further the method includes determining a probability value of the illness in the person using the multi-variate detection model and transmitting the probability value to a user interface (UI).Type: ApplicationFiled: December 28, 2023Publication date: April 18, 2024Inventors: Kristin Hedgepath Gilchrist, Meghan Sarah Hegarty-Craver, Dorota Temple, Robert Furberg
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Patent number: 10845297Abstract: A corrosion sensor system includes one or more corrosion sensors embedded in a coating material such as an anti-corrosion coating material. Each corrosion sensor may include a resonator disposed on a dielectric substrate, and has a resonant frequency in a radio frequency (RF) range or an infrared (IR) range, and is configured for interacting with an RF or IR excitation signal to produce an RF or IR measurement signal. The corrosion sensor system may be applied to an object for which corrosion is to be monitored. A corrosion detection system includes a data acquisition system that transmits the excitation signal to the corrosion sensor, and receives the measurement signal from the corrosion sensor for analysis to determine whether corrosion has occurred.Type: GrantFiled: February 15, 2019Date of Patent: November 24, 2020Assignee: MICROSS ADVANCED INTERCONNECT TECHNOLOGY, LLCInventors: Scott Goodwin, Mark Roberson, John Lewis, Dorota Temple
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Patent number: 10418344Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.Type: GrantFiled: January 26, 2018Date of Patent: September 17, 2019Assignee: Micross Advanced Interconnect Technology LLCInventors: Erik Paul Vick, Dorota Temple
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Publication number: 20190178784Abstract: A corrosion sensor system includes one or more corrosion sensors embedded in a coating material such as an anti-corrosion coating material. Each corrosion sensor may include a resonator disposed on a dielectric substrate, and has a resonant frequency in a radio frequency (RF) range or an infrared (IR) range, and is configured for interacting with an RF or IR excitation signal to produce an RF or IR measurement signal. The corrosion sensor system may be applied to an object for which corrosion is to be monitored. A corrosion detection system includes a data acquisition system that transmits the excitation signal to the corrosion sensor, and receives the measurement signal from the corrosion sensor for analysis to determine whether corrosion has occurred.Type: ApplicationFiled: February 15, 2019Publication date: June 13, 2019Inventors: Scott Goodwin, Mark Roberson, John Lewis, Dorota Temple
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Patent number: 10264669Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.Type: GrantFiled: April 28, 2016Date of Patent: April 16, 2019Assignee: Research Triangle InstituteInventors: Jay Lewis, Dorota Temple, Erik Vick, Ethan Klem
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Patent number: 10209175Abstract: A corrosion sensor system includes one or more corrosion sensors embedded in a coating material such as an anti-corrosion coating material. Each corrosion sensor may include a resonator disposed on a dielectric substrate, and has a resonant frequency in a radio frequency (RF) range or an infrared (IR) range, and is configured for interacting with an RF or IR excitation signal to produce an RF or IR measurement signal. The corrosion sensor system may be applied to an object for which corrosion is to be monitored. A corrosion detection system includes a data acquisition system that transmits the excitation signal to the corrosion sensor, and receives the measurement signal from the corrosion sensor for analysis to determine whether corrosion has occurred.Type: GrantFiled: July 29, 2016Date of Patent: February 19, 2019Assignee: Micross Advanced Interconnect Technology LLCInventors: Scott Goodwin, Mark Roberson, John Lewis, Dorota Temple
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Publication number: 20180151542Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.Type: ApplicationFiled: January 26, 2018Publication date: May 31, 2018Inventors: Erik Paul Vick, Dorota Temple
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Patent number: 9881905Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.Type: GrantFiled: April 20, 2015Date of Patent: January 30, 2018Assignee: Research Triangle InstituteInventors: Eric Paul Vick, Dorota Temple
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Publication number: 20170207198Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.Type: ApplicationFiled: April 20, 2015Publication date: July 20, 2017Inventors: Eric Paul VICK, Dorota TEMPLE
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Publication number: 20170064810Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.Type: ApplicationFiled: April 28, 2016Publication date: March 2, 2017Inventors: Jay Lewis, Dorota Temple, Erik Vick, Ethan Klem
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Publication number: 20170030825Abstract: A corrosion sensor system includes one or more corrosion sensors embedded in a coating material such as an anti-corrosion coating material. Each corrosion sensor may include a resonator disposed on a dielectric substrate, and has a resonant frequency in a radio frequency (RF) range or an infrared (IR) range, and is configured for interacting with an RF or IR excitation signal to produce an RF or IR measurement signal. The corrosion sensor system may be applied to an object for which corrosion is to be monitored. A corrosion detection system includes a data acquisition system that transmits the excitation signal to the corrosion sensor, and receives the measurement signal from the corrosion sensor for analysis to determine whether corrosion has occurred.Type: ApplicationFiled: July 29, 2016Publication date: February 2, 2017Inventors: Scott Goodwin, Mark Roberson, John Lewis, Dorota Temple
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Patent number: 9257335Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).Type: GrantFiled: September 4, 2013Date of Patent: February 9, 2016Assignee: Research Triangle InstituteInventors: Erik Vick, Garry Brian Cunningham, Dorota Temple
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Publication number: 20150235898Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).Type: ApplicationFiled: September 4, 2013Publication date: August 20, 2015Applicant: Research Triangle InstituteInventors: Erik Vick, Garry Brian Cunningham, Dorota Temple
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Patent number: 8975753Abstract: A three-dimensional interconnect includes a first substrate bonded to a second substrate, the first substrate including a device layer and a bulk semiconductor layer, a metal pad disposed on the second substrate, an electrically insulating layer disposed between the first and second substrates. The structure has a via-hole extending through the device layer, the bulk semiconductor layer and the electrically insulating layer to the metal pad on the second substrate. The structure has a dielectric coating on a sidewall of the via-hole, and a plasma-treated region of the metal pad disposed on the second substrate. The structure includes a via metal monolithically extending from the plasma-treated region of the metal pad through the via-hole and electrically interconnecting the device layer of the first substrate to the metal pad of the second substrate.Type: GrantFiled: March 3, 2010Date of Patent: March 10, 2015Assignee: Research Triangle InstituteInventors: Charles Kenneth Williams, Christopher A. Bower, Dean Michael Malta, Dorota Temple
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Patent number: 8866080Abstract: A detector array and method for making the detector array. The array includes a substrate including a plurality of trenches formed therein, and includes a plurality of collectors electrically isolated from each other, formed on the walls of the trenches, and configured to collect charge particles incident on respective ones of the collectors and to output from said collectors signals indicative of charged particle collection. The array includes a plurality of readout circuits disposed on a side of the substrate opposite openings to the collectors. The readout circuits are configured to read charge collection signals from respective ones of the plurality of collectors.Type: GrantFiled: February 27, 2009Date of Patent: October 21, 2014Assignee: Research Triangle InstituteInventors: Christopher A. Bower, Kristin Hedgepath Gilchrist, Brian R. Stoner, Dorota Temple
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Patent number: 8361901Abstract: An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bonded to the first substrate, metallizations formed in the through-holes of the first substrate to connect to components of the first electronic device, and a patternable substance disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate together in regions apart from the metallizations.Type: GrantFiled: April 5, 2010Date of Patent: January 29, 2013Assignee: Research Triangle InstituteInventors: Erik P Vick, Dean M. Malta, Matthew R. Lueck, Dorota Temple
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Publication number: 20110298134Abstract: A three-dimensional interconnect includes a first substrate bonded to a second substrate, the first substrate including a device layer and a bulk semiconductor layer, a metal pad disposed on the second substrate, an electrically insulating layer disposed between the first and second substrates. The structure has a via-hole extending through the device layer, the bulk semi-conductor layer and the electrically insulating layer to the metal pad on the second substrate. The structure has a dielectric coating on a sidewall of the via-hole, and a plasma-treated region of the metal pad disposed on the second substrate. The structure includes a via metal monolithically extending from the plasma-treated region of the metal pad through the via-hole and electrically interconnecting the device layer of the first substrate to the metal pad of the second substrate.Type: ApplicationFiled: March 3, 2010Publication date: December 8, 2011Applicant: Research Triangle InstituteInventors: Charles Kenneth Williams, Christopher A. Bower, Dean Michael Malta, Dorota Temple
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Publication number: 20110031388Abstract: A detector array and method for making the detector array. The array includes a substrate including a plurality of trenches formed therein, and includes a plurality of collectors electrically isolated from each other, formed on the walls of the trenches, and configured to collect charge particles incident on respective ones of the collectors and to output from said collectors signals indicative of charged particle collection. The array includes a plurality of readout circuits disposed on a side of the substrate opposite openings to the collectors. The readout circuits are configured to read charge collection signals from respective ones of the plurality of collectors.Type: ApplicationFiled: February 27, 2009Publication date: February 10, 2011Applicant: Research Triangle InstituteInventors: Christopher A. Bower, Kristin Hedgepath Gilchrist, Brian R. Stoner, Dorota Temple
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Publication number: 20110017703Abstract: A method and system for treating a surface structure of a workpiece. The method provides a carrier-gel to the surface structure of the workpiece. The carrier-gel includes an etchant for selectively etching a first material of the surface structure and has a gel particle size larger than the surface structure. The method etches the first material from the surface structure by a reaction of the etchant included in the carrier-gel with the first material of the surface structure in order to remove a part of the first material from the surface structure for subsequent device fabrication. The system includes a chemical reactor supporting the workpiece. The chemical reactor is configured to flow the carrier-gel noted to the surface structure of the workpiece in order to remove the first material from the surface structure.Type: ApplicationFiled: February 13, 2009Publication date: January 27, 2011Applicant: Research Triangle InstituteInventors: Dorota Temple, Dean Michael Malta, Christopher A. Bower
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Publication number: 20100270685Abstract: An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bonded to the first substrate, metallizations formed in the through-holes of the first substrate to connect to components of the first electronic device, and a patternable substance disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate together in regions apart from the metallizations.Type: ApplicationFiled: April 5, 2010Publication date: October 28, 2010Applicant: Research Triangle InstituteInventors: Erik P. VICK, Dean M. Malta, Matthew R. Lueck, Dorota Temple