Abstract: The invention concerns a method for exposing a substrate (1) equipped with an n-layer photoresist system (2), an electrically conductive connection being created between a ground potential and the substrate (1) and/or at least one of the layers S1 through Sn of the photoresist system (2). The invention furthermore concerns an arrangement for carrying out said method. According to the present invention, what is achieved in a single process step is that by way of spring elements E1 through E4, a contact tip K1 is advanced as far as the layer S1, a contact tip K2 is advanced through the layer S1 as far as the layer S2, a contact tip K3 is advanced through the layer S1 and S2 as far as the layer S3, and so forth. The electrical charges from the layer S1 are dissipated to the ground potential via the contact tip K1, the charges from the layer S2 via the contact tip K2, etc., and/or and from the substrate (1) via a contact tip K4.