Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided.

Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided.

Abstract: A MEMS gyroscope includes a proof mass of a suspended spring mass system that is driven at a drive frequency. The proof mass moves relative to a sense electrode such that an overlap of the proof mass and sense electrode changes during the drive motion. A Coriolis force causes the proof mass to move relative to the sense electrode. The overlap and the movement due to the Coriolis force are sensed, and angular velocity is determined based on the magnitude of a signal generated due to a change in overlap and the Coriolis force.

Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.

Abstract: The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.

Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.

Abstract: Microelectromechanical systems (MEMS) gyroscopes and related measurement and calibration techniques are described. Various embodiments facilitate phase estimation of an ideal phase for a demodulator mixer associated with an exemplary MEMS gyroscope using quadrature tuning, which can improve offset performance over life time for exemplary MEMS gyroscopes. Exemplary embodiments can comprise adjusting a quadrature component of an exemplary MEMS gyroscope sense signal, measuring a change in offset of the exemplary MEMS gyroscope at an output of a demodulator mixer associated with the exemplary MEMS gyroscope, estimating a phase error between the quadrature component and a demodulation phase angle of the demodulator mixer based on the change in the offset, and periodically adjusting the demodulation phase angle of the demodulator mixer based on the phase error.

Abstract: A MEMS gyroscope includes a proof mass of a suspended spring mass system that is driven at a drive frequency. The proof mass moves relative to a sense electrode such that an overlap of the proof mass and sense electrode changes during the drive motion. A Coriolis force causes the proof mass to move relative to the sense electrode. The overlap and the movement due to the Coriolis force are sensed, and angular velocity is determined based on the magnitude of a signal generated due to a change in overlap and the Coriolis force.

Abstract: A device for reducing package stress sensitivity of a sensor includes one or more anchor points for attaching to a substrate; a rigid frame structure configured to at least partially support the sensor; and a compliant element between each anchor point and the rigid frame structure. Also disclosed is a device for supporting a micro-electro-mechanical (MEMS) sensor comprising four anchor points for attaching to a substrate; a rigid frame structure configured to support the MEMS sensor; and a crab-leg suspension element between each anchor point and the rigid frame structure, wherein the crab-leg suspension element is compliant. A method for reducing package stress sensitivity of a sensor is provided as well.

Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.

Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.

Abstract: The improvement includes an outer proof mass having a corresponding center of mass; and an inner proof mass having a corresponding center of mass, where the corresponding centers of mass of the outer proof mass and the inner proof mass are approximately co-located. Thus, a double Foucault pendulum is essentially provided in a micromachined gyroscope.

Abstract: A toroidal ring gyroscope with a robust outer perimeter anchor and a distributed suspension system. The vibrational energy in the design is concentrated towards the innermost ring, and the device is anchored at the outer perimeter. The distributed support structure prevents vibrational motion propagating to the outer anchor, which helps trap the vibrational energy within the gyroscope and provides a Q-factor of >100,000 at a compact size of 1760 ?m. Due to the parametric pumping effect, energy added to each mode is proportional to the existing amplitude of the respective mode. As a result, errors associated with finding the orientation of the standing wave and x-y drive gain drift are bypassed. The toroidal ring gyroscope can be fabricated using any standard silicon on insulator process. Due to the high Q-factor and robust support structure, the device can potentially be instrumented in high-g environments that require high angular rate sensitivity.

Abstract: An apparatus and method for wafer-level hermetic packaging of MicroElectroMechanical Systems (MEMS) devices of different shapes and form factors is presented in this disclosure. The method is based on bonding a glass cap wafer with fabricated micro-glassblown “bubble-shaped” structures to the substrate glass/Si wafer. Metal traces fabricated on the substrate wafer serve to transfer signals from the sealed cavity of the bubble to the outside world. Furthermore, the method provides for chip-level packaging of MEMS three dimensional structures. The packaging method utilizes a micro glass-blowing process to create “bubbleshaped” glass lids. This new type of lids is used for vacuum packaging of three dimensional MEMS devices, using a standard commercially available type of package.

Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided.

Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.

Abstract: An apparatus and method for wafer-level hermetic packaging of MicroElectroMechanical Systems (MEMS) devices of different shapes and form factors is presented in this disclosure. The method is based on bonding a glass cap wafer with fabricated micro-glassblown “bubble-shaped” structures to the substrate glass/Si wafer. Metal traces fabricated on the substrate wafer serve to transfer signals from the sealed cavity of the bubble to the outside world. Furthermore, the method provides for chip-level packaging of MEMS three dimensional structures. The packaging method utilizes a micro glass-blowing process to create “bubbleshaped” glass lids. This new type of lids is used for vacuum packaging of three dimensional MEMS devices, using a standard commercially available type of package.

Abstract: A method of making a Coriolis vibratory gyroscope with a three dimensional mushroom resonator element includes defining a cavity in a substrate wafer; bonding a cap wafer onto the substrate over the cavity from which cap wafer the resonator element will be formed; heating the substrate and cap wafer to generate a pressure build-up within the cavity; plastically deforming the cap wafer by the pressure build-up to form the mushroom resonator element having a perimeter around the mushroom resonator element; releasing the three dimensional mushroom resonator element at the perimeter by selectively removing material so that the perimeter of mushroom resonator element is free to vibrate; and disposing a layer of conductive material on the mushroom resonator element to form electrodes thereon for use in driving and sensing vibrations of the mushroom resonator element and its perimeter. A microgyroscope made by such a method is also included within the embodiments.

Abstract: A method of making a Coriolis vibratory gyroscope with a three dimensional mushroom resonator element includes defining a cavity in a substrate wafer; bonding a cap wafer onto the substrate over the cavity from which cap wafer the resonator element will be formed; heating the substrate and cap wafer to generate a pressure build-up within the cavity; plastically deforming the cap wafer by the pressure build-up to form the mushroom resonator element having a perimeter around the mushroom resonator element; releasing the three dimensional mushroom resonator element at the perimeter by selectively removing material so that the perimeter of mushroom resonator element is free to vibrate; and disposing a layer of conductive material on the mushroom resonator element to form electrodes thereon for use in driving and sensing vibrations of the mushroom resonator element and its perimeter. A microgyroscope made by such a method is also included within the embodiments.

Abstract: A method for fabricating an environmentally robust micro-wineglass gyroscope includes the steps of stacking and bonding of at least an inner glass layer and an outer glass layer to a substrate wafer; plastically deforming the inner glass layer into a mushroom-shaped structure and deforming the outer glass layer into a shield capable of extending over the inner glass layer, while leaving the inner and outer glass layers connectable at a central post location; removing the substrate layer and a portion of the inner glass layer so that a perimeter of the inner glass layer is free; and bonding the deformed inner and outer glass layers to a handle wafer. The resulting structure is an environmentally robust micro-wineglass gyroscope which has a double ended supported central post location for the mushroom-shaped structure of the inner glass layer.