Abstract: The invention provides a method for imaging and thickness determination of coatings on coated contact lenses. The method comprises selectively staining a negatively-charged-groups-containing coating over the lens body of a coated contact lens by immersing the coated contact lens in an aqueous solution comprising a fluorescently-labeled polycationic polymer and having a pH of from about 6.5 to 8.0; orthogonally cutting the selectively-stained coated contact lens; and determining the thickness of the coating on the coated contact lens. In addition, the invention provides a method for selecting a candidate coating material comprising negatively charged groups for applying a coating with a desired thickness onto silicone hydrogel contact lenses and for optimizing a coating process for producing coated silicone hydrogel contact lenses with a desired thickness coating thereon.

Abstract: A lead-free piezoelectric ceramic sensor material and a preparation method thereof and relates to the technical field of piezoelectric ceramic processing. The main raw materials of the lead-free piezoelectric ceramic sensor material disclosed in the present disclosure are a barium carbonate, a calcium carbonate, a zirconia, a titanium dioxide, a strontium carbonate, an erbium oxide, and a bismuth oxide. The preparation method is prepared through the steps of preparing ingredients, ball milling, granulating and tableting, debinding, and sintering, and the lead-free piezoelectric ceramic sensor material can be made into a lead-free piezoelectric sensor through applying an electrode and electrode polarizing. The present disclosure has an excellent compactness and a good chemical stability. And the piezoelectric sensor made of the lead-free piezoelectric ceramic sensor material has a high sensitivity, a strong working stability, an excellent piezoelectric and has a high Curie temperature.

Abstract: A lead-free piezoelectric ceramic sensor material and a preparation method thereof, and relates to the technical field of piezoelectric ceramic processing. The main raw materials of the lead-free piezoelectric ceramic sensor material disclosed in the present disclosure are a barium carbonate, a calcium carbonate, a zirconia, a titanium dioxide, a strontium carbonate, an oxidation bait, a bismuth oxide, a composite binder and a dispersant agent. The preparation method is prepared through the steps of preparing ingredients, ball milling, granulating and tableting, debinding, and sintering, and the lead-free piezoelectric ceramic sensor material can be made into a lead-free piezoelectric sensor through applying an electrode and electrode polarizing. The present disclosure has an excellent compactness and a good chemical stability.

Abstract: Embodiments of semiconductor fabrication methods are disclosed. In an example, a method for forming a mark for locating patterns in semiconductor fabrication is disclosed. A wafer is divided into a plurality of shots. Each of the plurality of shots includes a semiconductor chip die. Four quarters of a locking corner mark are subsequently patterned, respectively, at four corners of four adjacent shots of the plurality of shots. Each quarter of the locking corner mark is symmetric to adjacent quarters of the locking corner mark and is separated from the adjacent quarters of the locking corner mark by a nominally same distance. The locking corner mark is set as an origin for locating patterns in at least one of the four adjacent shots in semiconductor fabrication.

Abstract: Embodiments of semiconductor fabrication methods are disclosed. In an example, a method for forming a mark for locating patterns in semiconductor fabrication is disclosed. A wafer is divided into a plurality of shots. Each of the plurality of shots includes a semiconductor chip die. Four quarters of a locking corner mark are subsequently patterned, respectively, at four corners of four adjacent shots of the plurality of shots. Each quarter of the locking corner mark is symmetric to adjacent quarters of the locking corner mark and is separated from the adjacent quarters of the locking corner mark by a nominally same distance. The locking corner mark is set as an origin for locating patterns in at least one of the four adjacent shots in semiconductor fabrication.

Abstract: The present invention provides a method for producing a composite material comprising an array of piezoelectric fibres, the method comprising: (a) providing: (a1) a plurality of first strips comprising a piezoelectric material or a precursor to a piezoelectric material, and a first carrier, and (a2) a plurality of second strips comprising a decomposable material, and a second carrier; (b) placing said pluralities of said first and second strips alternately on top of one another to form a stack in which at least a portion of said first strips is separated from adjacent first strips by a second strip; (c) a heating step comprising heating said stack to remove said first and second carriers and said decomposable material; (d) impregnating said stack with a filler material to form a composite stack of piezoelectric strips; and (e) cutting said stack to form a composite material comprising an array of piezoelectric fibres. In an alternative method the cutting (e) is performed before the heating step (c).