Patents by Inventor Doug Jachowski

Doug Jachowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240213955
    Abstract: An acoustic resonator is fabricated by bonding a first piezoelectric plate to a substrate and spans locations for a first and second cavity in the substrate. A top surface of the first piezoelectric plate is planarized to a first thickness. A bonding layer is formed on the first piezoelectric plate and spans the first and second cavity locations. A second piezoelectric plate is bonded to the bonding layer and spans the first and second cavity locations. A portion of the second piezoelectric plate spanning the second cavity location is etched away to form a first membrane over the first cavity location and a second membrane over the second cavity location. Interdigital transducers are formed on the first and second membranes over the first and second cavity location to form a first and second resonator on the same die.
    Type: Application
    Filed: February 8, 2024
    Publication date: June 27, 2024
    Inventors: Patrick TURNER, Doug JACHOWSKI, Bryant GARCIA
  • Publication number: 20240154597
    Abstract: An acoustic resonator is provided that includes a substrate; a piezoelectric layer having a portion that forms a diaphragm over a cavity; and IDT on the piezoelectric layer that includes a first conductor level including first and second busbars disposed on respective portions of the piezoelectric layer, a first set of elongated fingers extending from the first bus bar onto the diaphragm, and a second set of elongated fingers extending from the second bus bar onto the diaphragm, the second set of elongated fingers interleaved with the first set of elongated fingers. The acoustic resonator also includes a second conductor level over the piezoelectric layer and covering at least portions of the first and second busbars.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Inventors: Greg DYER, Bryant GARCIA, Doug JACHOWSKI, Robert HAMMOND, Neal FENZI, Ryo WAKABAYASHI
  • Patent number: 11949402
    Abstract: An acoustic resonator is fabricated by bonding a first piezoelectric plate to a substrate and spans locations for a first and second cavity in the substrate. A top surface of the first piezoelectric plate is planarized to a first thickness. A bonding layer is formed on the first piezoelectric plate and spans the first and second cavity locations. A second piezoelectric plate is bonded to the bonding layer and spans the first and second cavity locations. A portion of the second piezoelectric plate spanning the second cavity location is etched away to form a first membrane over the first cavity location and a second membrane over the second cavity location. Interdigital transducers are formed on the first and second membranes over the first and second cavity location to form a first and second resonator on the same die.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 2, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Patrick Turner, Doug Jachowski, Bryant Garcia
  • Patent number: 11916539
    Abstract: Band N77 bandpass filters include a first plurality of transversely-excited film bulk acoustic resonators (XBARs) on a first chip comprising a first rotated YX-cut lithium niobate piezoelectric plate having a thickness less than or equal to 535 nm, and a second plurality of XBARs on a second chip comprising a second rotated YX-cut lithium niobate piezoelectric plate having a thickness greater than or equal to 556 nm. A circuit card is coupled to the first chip and the second chip. The circuit card includes conductors for making electrical connections between the first chip and the second chip.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: February 27, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Doug Jachowski, Ventsislav Yantchev, Bryant Garcia, Patrick Turner
  • Patent number: 11909374
    Abstract: Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: February 20, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Greg Dyer, Bryant Garcia, Doug Jachowski, Robert Hammond, Neal Fenzi, Ryo Wakabayashi
  • Publication number: 20230006633
    Abstract: Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.
    Type: Application
    Filed: September 1, 2022
    Publication date: January 5, 2023
    Inventors: Greg Dyer, Bryant Garcia, Doug Jachowski, Robert Hammond, Neal Fenzi, Ryo Wakabayashi
  • Patent number: 11469733
    Abstract: Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: October 11, 2022
    Assignee: Resonant Inc.
    Inventors: Greg Dyer, Bryant Garcia, Doug Jachowski, Robert Hammond, Neal Fenzi, Ryo Wakabayashi
  • Publication number: 20220103160
    Abstract: A filter includes first and second shunt resonators, at least one series resonator connected to the first and second shunt resonators in a ladder filter circuit, and a first ground contact pad. The first shunt resonator has two or more first sub-resonators and the second shunt resonator has two or more second sub-resonators. At least one first sub-resonator and at least one, but less than all, of the two or more second sub-resonators are connected to the first ground contact pad.
    Type: Application
    Filed: December 9, 2021
    Publication date: March 31, 2022
    Inventors: Doug Jachowski, Ventsislav Yantchev, Bryant Garcia, Patrick Turner
  • Publication number: 20220069801
    Abstract: An acoustic resonator is fabricated by bonding a first piezoelectric plate to a substrate and spans locations for a first and second cavity in the substrate. A top surface of the first piezoelectric plate is planarized to a first thickness. A bonding layer is formed on the first piezoelectric plate and spans the first and second cavity locations. A second piezoelectric plate is bonded to the bonding layer and spans the first and second cavity locations. A portion of the second piezoelectric plate spanning the second cavity location is etched away to form a first membrane over the first cavity location and a second membrane over the second cavity location. Interdigital transducers are formed on the first and second membranes over the first and second cavity location to form a first and second resonator on the same die.
    Type: Application
    Filed: December 17, 2020
    Publication date: March 3, 2022
    Inventors: Patrick Turner, Doug Jachowski, Bryant Garcia
  • Publication number: 20210351762
    Abstract: Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.
    Type: Application
    Filed: December 1, 2020
    Publication date: November 11, 2021
    Inventors: Greg Dyer, Bryant Garcia, Doug Jachowski, Robert Hammond, Neal Fenzi, Ryo Wakabayashi
  • Publication number: 20210273631
    Abstract: Band N77 bandpass filters include a first plurality of transversely-excited film bulk acoustic resonators (XBARs) on a first chip comprising a first rotated YX-cut lithium niobate piezoelectric plate having a thickness less than or equal to 535 nm, and a second plurality of XBARs on a second chip comprising a second rotated YX-cut lithium niobate piezoelectric plate having a thickness greater than or equal to 556 nm. A circuit card is coupled to the first chip and the second chip. The circuit card includes conductors for making electrical connections between the first chip and the second chip.
    Type: Application
    Filed: March 1, 2021
    Publication date: September 2, 2021
    Inventors: Doug Jachowski, Ventsislav Yantchev, Bryant Garcia, Patrick Turner