Patents by Inventor Doug Lee
Doug Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11944105Abstract: The technology as disclosed herein includes a method and apparatus for deboning a meat item, and more particular for deboning a poultry item including performing an initial shoulder cut for removing boneless breast meat from the poultry carcass or frame. The technology as disclosed and claimed further includes a method and apparatus for removing a tender meat portion from a poultry item. The method and apparatus disclosed and claimed herein is a combination of a robotic arm including an ultrasonic knife implement and/or an annular blade knife implement and a vision system for varying the cut path based on the shape and size of the poultry item. The combination as claimed including the ultrasonic knife can perform a meat cut while penetrating the meat with less force than the typical penetration that occurs when using a traditional knife. The combination as claimed including the annular blade knife implement can remove the tender meat portion for the keel bone and posterior sheath.Type: GrantFiled: December 5, 2021Date of Patent: April 2, 2024Assignee: Tyson Foods, Inc.Inventors: Doug Foreman, Douglas Martin Linn, Gilbert Ray Mitchell, Travis Lee Scarrow, Arifa Sultana, Toni Kinsey
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Patent number: 11935175Abstract: There is described a method of shading a group of pixels in a fragment shader in a raster graphics pipeline. At least one first pilot pixel of the group of pixels is shaded under a first precision. At least one second pilot pixel of the group of pixels is shaded under a second precision. An error value representing a difference between the first and second pilot pixels is calculated. At least one other pixel of the group of pixels is shaded under the first precision if the error value is greater than an error threshold. The at least one other pixel is shaded under the second precision if the error value is smaller than the error threshold.Type: GrantFiled: April 7, 2022Date of Patent: March 19, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Andrew Siu Doug Lee, Tyler Bryce Nowicki, Guansong Zhang, Yan Luo
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Publication number: 20230326117Abstract: There is described a method of shading a group of pixels in a fragment shader in a raster graphics pipeline. At least one first pilot pixel of the group of pixels is shaded under a first precision. At least one second pilot pixel of the group of pixels is shaded under a second precision. An error value representing a difference between the first and second pilot pixels is calculated. At least one other pixel of the group of pixels is shaded under the first precision if the error value is greater than an error threshold. The at least one other pixel is shaded under the second precision if the error value is smaller than the error threshold.Type: ApplicationFiled: April 7, 2022Publication date: October 12, 2023Inventors: Andrew Siu Doug LEE, Tyler Bryce NOWICKI, Guansong ZHANG, Yan LUO
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Patent number: 11327760Abstract: A method for grouping computer instructions includes receiving a set of computer instructions, grouping the set of computer instructions by register dependencies, identifying a plurality of single-definition-use flow (SDF) bundles based on a burstization criteria and a chaining criteria; and based on the SDF bundles, transforming the set of computer instructions. The transformation may include splitting one of the set of computer instructions and setting a burst parameter for the one of the set of computer instruction. The transformation may include grouping a plurality of the set of computer instructions and replacing a pair of register file accesses with a pair of temporary register accesses.Type: GrantFiled: April 9, 2020Date of Patent: May 10, 2022Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Andrew Siu Doug Lee, Ahmed Mohammed Elshafiey Mohammed Eltantawy
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Publication number: 20220005095Abstract: Disclosed herein is an augmented reality (AR) system that provides information about purchasing alternatives to a user who is about to purchase an item or product (e.g., a target product) in a physical retail location. In some variations, offers to purchase the product and/or an alternative product are provided by the merchant and/or competitors via the AR system. An offer negotiation server (ONS) aggregates offer data provided various external parties (EPs) and displays these offers to the user as the user is considering the purchase of a target product. In some variations, an AR system may be configured to facilitate the process of purchasing items at a retail location.Type: ApplicationFiled: September 21, 2021Publication date: January 6, 2022Inventors: Adrian KAEHLER, Gary BRADSKI, Prasanna KRISHNASAMY, Doug LEE
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Patent number: 11164227Abstract: Disclosed herein is an augmented reality (AR) system that provides information about purchasing alternatives to a user who is about to purchase an item or product (e.g., a target product) in a physical retail location. In some variations, offers to purchase the product and/or an alternative product are provided by the merchant and/or competitors via the AR system. An offer negotiation server (ONS) aggregates offer data provided various external parties (EPs) and displays these offers to the user as the user is considering the purchase of a target product. In some variations, an AR system may be configured to facilitate the process of purchasing items at a retail location.Type: GrantFiled: June 24, 2016Date of Patent: November 2, 2021Assignee: Magic Leap, Inc.Inventors: Adrian Kaehler, Gary Bradski, Prasanna Krishnasamy, Doug Lee
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Publication number: 20210318875Abstract: A method for grouping computer instructions includes receiving a set of computer instructions, grouping the set of computer instructions by register dependencies, identifying a plurality of single-definition-use flow (SDF) bundles based on a burstization criteria and a chaining criteria; and based on the SDF bundles, transforming the set of computer instructions. The transformation may include splitting one of the set of computer instructions and setting a burst parameter for the one of the set of computer instruction. The transformation may include grouping a plurality of the set of computer instructions and replacing a pair of register file accesses with a pair of temporary register accesses.Type: ApplicationFiled: April 9, 2020Publication date: October 14, 2021Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Andrew Siu Doug LEE, Ahmed Mohammed Elshafiey Mohammed ELTANTAWY
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Publication number: 20170039613Abstract: Disclosed herein is an augmented reality (AR) system that provides information about purchasing alternatives to a user who is about to purchase an item or product (e.g., a target product) in a physical retail location. In some variations, offers to purchase the product and/or an alternative product are provided by the merchant and/or competitors via the AR system. An offer negotiation server (ONS) aggregates offer data provided various external parties (EPs) and displays these offers to the user as the user is considering the purchase of a target product. In some variations, an AR system may be configured to facilitate the process of purchasing items at a retail location.Type: ApplicationFiled: June 24, 2016Publication date: February 9, 2017Inventors: Adrian KAEHLER, Gary BRADSKI, Prasanna KRISHNASAMY, Doug LEE
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Publication number: 20100072623Abstract: Semiconductor device structures and related fabrication methods are provided herein. One fabrication method relates to the formation of conductive contact plugs for a semiconductor device. The method begins by providing a semiconductor device structure having a conductive contact region, a layer of insulating material overlying the conductive contact region, and a via formed in the layer of insulating material and terminating at the conductive contact region. The fabrication process then deposits a first electrically conductive material on the semiconductor device structure such that the first electrically conductive material at least partially fills the via. Then, the process anisotropically etches a portion of the first electrically conductive material located in the filled via, resulting in a lined via. Thereafter, the process deposits a second electrically conductive material on the semiconductor device structure such that the second electrically conductive material at least partially fills the lined via.Type: ApplicationFiled: September 19, 2008Publication date: March 25, 2010Applicant: ADVANCED MICRO DEVICES, INC.Inventors: Christopher M. PRINDLE, Richard J. CARTER, Doug LEE, Man Fai NG
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Patent number: 4935843Abstract: A method of manufacturing a ceramic capacitor of the lead filled type includes coating the ends of the ceramic monolith with a terminating paste incorporating oxidizable metal particles characterized in that the lead will not wet to oxides of the metals but will wet to unoxidized or lightly oxidized increments of the metals. The paste is fused in an oxidizing environment or is fused in an inert environment and thereafter heated in an oxidizing environment with the result that the metal increments adjacent the exterior of the fused coating are oxidized whereas the metal at the interior portions of the paste are unoxidized or only slightly oxidized. Upon metal injection, the lead will wet to the interior portions of the fused paste but will not wet to the exterior of the paste whereby injected chips may be readily separated and whereby the size of the chip is rendered predictable due to the absence of adherent lead.Type: GrantFiled: November 20, 1989Date of Patent: June 19, 1990Assignee: AVX CorporationInventors: William McLaughlin, Doug Lee, Ricardo Garcia
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Patent number: 4881308Abstract: A method of manufacturing a ceramic capacitor of the lead filled type includes coating the ends of the ceramic monolith with a terminating paste incorporating oxidizable metal particles characterized in that the lead will not wet to oxides of the metals but will wet to unoxidized or lightly oxidized increments of the metals. The paste is fused in an oxidizing environment or is fused in an inert environment and thereafter heated in an oxidizing environment with the result that the metal increments adjacent the exterior of the fused coating are oxidized whereas the metal at the interior portions of the paste are unoxidized or only slightly oxidized. Upon metal injection, the lead will wet to the interior portions of the fused paste but will not wet to the exterior of the paste whereby injected chips may be readily separated and whereby the size of the chip is rendered predictable due to the absence of adherent lead.Type: GrantFiled: July 1, 1988Date of Patent: November 21, 1989Assignee: AVX CorporationInventors: William McLaughlin, Doug Lee, Ricardo Garcia
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Patent number: D543692Type: GrantFiled: August 1, 2006Date of Patent: June 5, 2007Assignee: Frank Lee Imports, Ltd.Inventor: Doug Lee
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Patent number: D543823Type: GrantFiled: August 1, 2006Date of Patent: June 5, 2007Assignee: Frank Lee Imports, Ltd.Inventor: Doug Lee
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Patent number: D543824Type: GrantFiled: August 1, 2006Date of Patent: June 5, 2007Assignee: Frank Lee Imports, Ltd.Inventor: Doug Lee
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Patent number: D550550Type: GrantFiled: August 1, 2006Date of Patent: September 11, 2007Assignee: Frank Lee Imports, Ltd.Inventor: Doug Lee
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Patent number: D567056Type: GrantFiled: January 16, 2007Date of Patent: April 22, 2008Inventor: Doug Lee
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Patent number: D586645Type: GrantFiled: January 16, 2007Date of Patent: February 17, 2009Inventor: Doug Lee
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Patent number: D591581Type: GrantFiled: January 16, 2007Date of Patent: May 5, 2009Inventor: Doug Lee
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Patent number: D699710Type: GrantFiled: March 12, 2013Date of Patent: February 18, 2014Inventor: Doug Lee