Abstract: Disclosed herein is an augmented reality (AR) system that provides information about purchasing alternatives to a user who is about to purchase an item or product (e.g., a target product) in a physical retail location. In some variations, offers to purchase the product and/or an alternative product are provided by the merchant and/or competitors via the AR system. An offer negotiation server (ONS) aggregates offer data provided various external parties (EPs) and displays these offers to the user as the user is considering the purchase of a target product. In some variations, an AR system may be configured to facilitate the process of purchasing items at a retail location.

Abstract: Disclosed herein is an augmented reality (AR) system that provides information about purchasing alternatives to a user who is about to purchase an item or product (e.g., a target product) in a physical retail location. In some variations, offers to purchase the product and/or an alternative product are provided by the merchant and/or competitors via the AR system. An offer negotiation server (ONS) aggregates offer data provided various external parties (EPs) and displays these offers to the user as the user is considering the purchase of a target product. In some variations, an AR system may be configured to facilitate the process of purchasing items at a retail location.

Abstract: Disclosed herein is an augmented reality (AR) system that provides information about purchasing alternatives to a user who is about to purchase an item or product (e.g., a target product) in a physical retail location. In some variations, offers to purchase the product and/or an alternative product are provided by the merchant and/or competitors via the AR system. An offer negotiation server (ONS) aggregates offer data provided various external parties (EPs) and displays these offers to the user as the user is considering the purchase of a target product. In some variations, an AR system may be configured to facilitate the process of purchasing items at a retail location.

Abstract: Disclosed herein is an augmented reality (AR) system that provides information about purchasing alternatives to a user who is about to purchase an item or product (e.g., a target product) in a physical retail location. In some variations, offers to purchase the product and/or an alternative product are provided by the merchant and/or competitors via the AR system. An offer negotiation server (ONS) aggregates offer data provided various external parties (EPs) and displays these offers to the user as the user is considering the purchase of a target product. In some variations, an AR system may be configured to facilitate the process of purchasing items at a retail location.

Abstract: Disclosed herein is an augmented reality (AR) system that provides information about purchasing alternatives to a user who is about to purchase an item or product (e.g., a target product) in a physical retail location. In some variations, offers to purchase the product and/or an alternative product are provided by the merchant and/or competitors via the AR system. An offer negotiation server (ONS) aggregates offer data provided various external parties (EPs) and displays these offers to the user as the user is considering the purchase of a target product. In some variations, an AR system may be configured to facilitate the process of purchasing items at a retail location.

Abstract: Semiconductor device structures and related fabrication methods are provided herein. One fabrication method relates to the formation of conductive contact plugs for a semiconductor device. The method begins by providing a semiconductor device structure having a conductive contact region, a layer of insulating material overlying the conductive contact region, and a via formed in the layer of insulating material and terminating at the conductive contact region. The fabrication process then deposits a first electrically conductive material on the semiconductor device structure such that the first electrically conductive material at least partially fills the via. Then, the process anisotropically etches a portion of the first electrically conductive material located in the filled via, resulting in a lined via. Thereafter, the process deposits a second electrically conductive material on the semiconductor device structure such that the second electrically conductive material at least partially fills the lined via.

Abstract: A method of manufacturing a ceramic capacitor of the lead filled type includes coating the ends of the ceramic monolith with a terminating paste incorporating oxidizable metal particles characterized in that the lead will not wet to oxides of the metals but will wet to unoxidized or lightly oxidized increments of the metals. The paste is fused in an oxidizing environment or is fused in an inert environment and thereafter heated in an oxidizing environment with the result that the metal increments adjacent the exterior of the fused coating are oxidized whereas the metal at the interior portions of the paste are unoxidized or only slightly oxidized. Upon metal injection, the lead will wet to the interior portions of the fused paste but will not wet to the exterior of the paste whereby injected chips may be readily separated and whereby the size of the chip is rendered predictable due to the absence of adherent lead.

Abstract: A method of manufacturing a ceramic capacitor of the lead filled type includes coating the ends of the ceramic monolith with a terminating paste incorporating oxidizable metal particles characterized in that the lead will not wet to oxides of the metals but will wet to unoxidized or lightly oxidized increments of the metals. The paste is fused in an oxidizing environment or is fused in an inert environment and thereafter heated in an oxidizing environment with the result that the metal increments adjacent the exterior of the fused coating are oxidized whereas the metal at the interior portions of the paste are unoxidized or only slightly oxidized. Upon metal injection, the lead will wet to the interior portions of the fused paste but will not wet to the exterior of the paste whereby injected chips may be readily separated and whereby the size of the chip is rendered predictable due to the absence of adherent lead.