Patents by Inventor Doug Li

Doug Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma-enhanced atomic layers deposition of conductive material over dielectric layers
    Patent number: 8557702
    Abstract: Methods of forming a conductive metal layer over a dielectric layer using plasma enhanced atomic layer deposition (PEALD) are provided, along with related compositions and structures. A plasma barrier layer is deposited over the dielectric layer by a non-plasma atomic layer deposition (ALD) process prior to depositing the conductive layer by PEALD. The plasma barrier layer reduces or prevents deleterious effects of the plasma reactant in the PEALD process on the dielectric layer and can enhance adhesion. The same metal reactant can be used in both the non-plasma ALD process and the PEALD process.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: October 15, 2013
    Assignee: ASM America, Inc.
    Inventors: Robert B. Milligan, Doug Li, Steven Marcus