Patents by Inventor Doug Mathews

Doug Mathews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shielded semiconductor package with single-sided substrate and method for making the same
    Patent number: 6707168
    Abstract: A semiconductor chip package is disclosed. The package includes a substrate, a metallization layer formed on one side of the substrate and a semiconductor die mounted on the substrate. The semiconductor die is electrically connected to a portion of the metallization layer. A shield element is mounted on the substrate and electrically connected to a portion of the metallization layer.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: March 16, 2004
    Assignee: Amkor Technology, Inc.
    Inventors: Paul Hoffman, Doug Mathews
  • Shielded semiconductor leadframe package
    Patent number: 6614102
    Abstract: A semiconductor chip package includes a plurality of leadframe portions and a semiconductor die mounted on at least one of the leadframe portions. A shield element is attached to at least one of the leadframe portions. A package mold surrounds the semiconductor die and the shield element. Radiation shielding is thereby provided in a practical manner for a leadframe-based semiconductor chip package.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: September 2, 2003
    Assignee: Amkor Technology, Inc.
    Inventors: Paul Hoffman, Doug Mathews