Abstract: An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Abstract: A universal transmit-receive (UTR) module for phased array systems comprises an antenna element shared for both transmitting and receiving; a transmit path that includes a transmit-path phase shifter, a driver, a switch-mode power amplifier (SMPA) that is configured to be driven by the driver, and a dynamic power supply (DPS) that generates and supplies a DPS voltage to the power supply port of the SMPA; and a receive path that includes a TX/RX switch that determines whether the receive path is electrically connected to or electrically isolated from the antenna element, a bandpass filter (BPF) that aligns with the intended receive frequency and serves to suppress reflected transmit signals and reverse signals, an adjustable-gain low-noise amplifier (LNA), and a receive-path phase shifter. The UTR module is specially designed for operation in phased array systems.

Abstract: A universal transmit-receive (UTR) module for phased array systems comprises an antenna element shared for both transmitting and receiving; a transmit path that includes a transmit-path phase shifter, a driver, a switch-mode power amplifier (SMPA) that is configured to be driven by the driver, and a dynamic power supply (DPS) that generates and supplies a DPS voltage to the power supply port of the SMPA; and a receive path that includes a TX/RX switch that determines whether the receive path is electrically connected to or electrically isolated from the antenna element, a bandpass filter (BPF) that aligns with the intended receive frequency and serves to suppress reflected transmit signals and reverse signals, an adjustable-gain low-noise amplifier (LNA), and a receive-path phase shifter. The UTR module is specially designed for operation in phased array systems.

Abstract: A universal transmit-receive (UTR) module for phased array systems comprises an antenna element shared for both transmitting and receiving; a transmit path that includes a transmit-path phase shifter, a driver, a switch-mode power amplifier (SMPA) that is configured to be driven by the driver, and a dynamic power supply (DPS) that generates and supplies a DPS voltage to the power supply port of the SMPA; and a receive path that includes a TX/RX switch that determines whether the receive path is electrically connected to or electrically isolated from the antenna element, a bandpass filter (BPF) that aligns with the intended receive frequency and serves to suppress reflected transmit signals and reverse signals, an adjustable-gain low-noise amplifier (LNA), and a receive-path phase shifter. The UTR module is specially designed for operation in phased array systems.

Abstract: An integrated circuit printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Abstract: An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Abstract: An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Abstract: A universal transmit-receive (UTR) module for phased array systems comprises an antenna element shared for both transmitting and receiving; a transmit path that includes a transmit-path phase shifter, a driver, a switch-mode power amplifier (SMPA) that is configured to be driven by the driver, and a dynamic power supply (DPS) that generates and supplies a DPS voltage to the power supply port of the SMPA; and a receive path that includes a TX/RX switch that determines whether the receive path is electrically connected to or electrically isolated from the antenna element, a bandpass filter (BPF) that aligns with the intended receive frequency and serves to suppress reflected transmit signals and reverse signals, an adjustable-gain low-noise amplifier (LNA), and a receive-path phase shifter. The UTR module is specially designed for operation in phased array systems.

Abstract: A universal transmit-receive (UTR) module for phased array systems comprises an antenna element shared for both transmitting and receiving; a transmit path that includes a transmit-path phase shifter, a driver, a switch-mode power amplifier (SMPA) that is configured to be driven by the driver, and a dynamic power supply (DPS) that generates and supplies a DPS voltage to the power supply port of the SMPA; and a receive path that includes a TX/RX switch that determines whether the receive path is electrically connected to or electrically isolated from the antenna element, a bandpass filter (BPF) that aligns with the intended receive frequency and serves to suppress reflected transmit signals and reverse signals, an adjustable-gain low-noise amplifier (LNA), and a receive-path phase shifter. The UTR module is specially designed for operation in phased array systems.

Abstract: A universal transmit-receive (UTR) module for phased array systems comprises an antenna element shared for both transmitting and receiving; a transmit path that includes a transmit-path phase shifter, a driver, a switch-mode power amplifier (SMPA) that is configured to be driven by the driver, and a dynamic power supply (DPS) that generates and supplies a DPS voltage to the power supply port of the SMPA; and a receive path that includes a TX/RX switch that determines whether the receive path is electrically connected to or electrically isolated from the antenna element, a bandpass filter (BPF) that aligns with the intended receive frequency and serves to suppress reflected transmit signals and reverse signals, an adjustable-gain low-noise amplifier (LNA), and a receive-path phase shifter. The UTR module is specially designed for operation in phased array systems.

Abstract: Radio frequency (RF) transmitters and methods of their operation are disclosed. An exemplary RF transmitter includes an RF power amplifier (RFPA), a dynamic power supply (DPS), and a baseband processing unit. The baseband processing unit generates an amplitude modulation (AM) signal that the DPS follows to generate a DPS voltage VDD(t). The DPS voltage VDD(t) serves as a power supply for an output stage of the RFPA. Under most operating conditions the output stage is configured to operate in a compressed mode (C-mode), but is reconfigured to operate in a product mode (or “P-mode) during times low-magnitude events in the AM signal are conveyed to the DPS and become present in the DPS voltage VDD(t) produced by the DPS. Operating the output stage in P-mode overcomes the inability of C-mode operation to reproduce low-magnitude events contained in the AM signal at the RF output of the RFPA.

Abstract: Radio frequency (RF) transmitters and methods of their operation are disclosed. An exemplary RF transmitter includes an RF power amplifier (RFPA), a dynamic power supply (DPS), and a baseband processing unit. The baseband processing unit generates an amplitude modulation (AM) signal that the DPS follows to generate a DPS voltage VDD(t). The DPS voltage VDD(t) serves as a power supply for an output stage of the RFPA. Under most operating conditions the output stage is configured to operate in a compressed mode (C-mode), but is reconfigured to operate in a product mode (or “P-mode) during times low-magnitude events in the AM signal are conveyed to the DPS and become present in the DPS voltage VDD(t) produced by the DPS. Operating the output stage in P-mode overcomes the inability of C-mode operation to reproduce low-magnitude events contained in the AM signal at the RF output of the RFPA.

Abstract: An oscillator includes an amplifier having an input and an output, a feedback network connected between the input of the amplifier and the output of the amplifier, the feedback network being configured to provide suitable positive feedback from the output of the amplifier to the input of the amplifier to initiate and sustain an oscillating condition, and a tuning circuit connected to the input of the amplifier, wherein the tuning circuit is continuously variable and consists of solid state electrical components with no mechanically adjustable devices including a pair of diodes connected to each other at their respective cathodes with a control voltage connected at the junction of the diodes.

Abstract: A discharge lamp bulb includes a light transmissive envelope and at least one conductive fiber disposed on a wall of the envelope, where the fiber has a thickness of less than 100 microns. The lamp may be either electrodeless or may include internal electrodes. Suitable materials for the fiber(s) include but are not limited to carbon, silicon carbide, aluminum, tantalum, molybdenum, platinum, and tungsten. Silicon carbide whiskers and platinum coated silicon carbide fibers may also be used. The fiber(s) may be aligned with the electrical field, at least during starting. The lamp preferably further includes a protective material covering the fiber(s). For example the protective material may be a sol gel deposited silica coating. Noble gases inside the bulb at pressures in excess of 300 Torr can be reliably ignited at applied electric field strengths of less than 4×105 V/m. Over 2000 Torr xenon, krypton, and argon respectively achieve breakdown with an applied field of less than 3×105 V/m.

Abstract: An electrodeless microwave discharge lamp includes a source of microwave energy, a microwave cavity, a structure configured to transmit the microwave energy from the source to the microwave cavity, a bulb disposed within the microwave cavity, the bulb including a discharge forming fill which emits light when excited by the microwave energy, and a reflector disposed within the microwave cavity, wherein the reflector defines a reflective cavity which encompasses the bulb within its volume and has an inside surface area which is sufficiently less than an inside surface area of the microwave cavity. A portion of the reflector may define a light emitting aperture which extends from a position closely spaced to the bulb to a light transmissive end of the microwave cavity. Preferably, at least a portion of the reflector is spaced from a wall of the microwave cavity. The lamp may be substantially sealed from environmental contamination.

Abstract: An oscillator includes a solid state active device having an input and an output, a feedback circuit connected from the output of the active device to the input of the active device, the feedback circuit providing suitable positive feedback to initiate and sustain an oscillating condition at a fundamental frequency, and a waveform modifying circuit connected to the output of the active device, wherein the waveform modifying circuit is adapted to modify the waveform on the output in a manner which increases an efficiency of the oscillator. For example, the waveform modifying circuit comprises transmission lines and optionally components which provide a high impedance for odd harmonics of the fundamental frequency. The waveform modifying circuit may further include transmission lines and optionally components which provide a low impedance for even harmonics of the fundamental frequency.

Abstract: A biosensor for detecting a bioeffecting substance in a test sample includes a cell network of at least one electrically excitable cell provided on a substrate in a predetermined geometry with a predefined axonal/dendritic polarity. The at least one cell is capable of producing a signal in response to the presence of the bioeffecting substance. At least one signal transducer is provided with the substrate in a predetermined geometry and is capable of detecting the signal produced by the cell. A culture medium capable of supporting metabolism of the cell is also provided.

Abstract: An electrodeless discharge lamp includes an electrodeless lamp bulb enclosing a fill which emits light when excited, an excitation structure positioned near the bulb and adapted to excite the fill, a rotation assembly connected to the bulb and adapted to rotate the bulb during operation of the lamp, and a plurality of structures formed on an outer surface of the bulb adapted to enhance cooling of the bulb. In some cases the structures are distributed in accordance with a temperature profile of the bulb to provide a relatively more uniform bulb temperature during operation. Some structures include protrusions which are distributed around the entire surface of the bulb. Some structures include protrusions which are distributed around the entire surface of the bulb except in the region of the bulb equator. Some structures include a plurality of ribs attached to an outer surface of the bulb, wherein the ribs are aligned transverse to a plane of the equator of the bulb.

Abstract: An integrated high brightness electrodeless lamp includes a lamp base defining two or more compartments housing components of the lamp, wherein at least one compartment provides an opening in the lamp base, a cover fitted to the lamp base, and an optics assembly positioned in the opening in the lamp base, wherein the lamp base, the cover, and the optics assembly provide an RF sealed system. The lamp components include an RF source providing RF energy for the lamp, an aperture bulb assembly including an electrodeless envelope containing a discharge forming fill which emits light when excited by RF energy, and an excitation structure for coupling RF energy from the RF source to the discharge forming fill. The optics assembly may be mounted in the opening in the lamp base with a twist lock mounting structure.

Abstract: An electrodeless discharge lamp includes a pair of opposed couplers aligned along an axis, a stationary light transmissive envelope positioned between the pair of opposed couplers, the envelope having an interior length along the axis which is greater than a maximum interior dimension of the envelope orthogonal to the axis, a light emitting fill disposed inside the envelope, the fill including at least one fill substance selected from the group of sulfur, selenium, and tellurium in a concentration of at least 1 mg/cc for each selected fill substance, and a power source connected to the couplers, wherein power applied to the couplers from the power source is effective to initiate and sustain a stable light emitting discharge from the fill. For example, the envelope may be capsule shaped or have the shape of a prolate ellipsoid. The lamp operates at low power and is stable without rotation.