Abstract: A method for texturing substrate surfaces and a substrate product, such as for computer disk drives. Microbump textured substrates are produced having a Rp value of about 20-200 Å and a ratio of Rmax:Rp of about 1.4 or less. In an exemplary embodiment, a microbump textured substrate is produced having colloidal particles on a surface thereof at a density of at least about 25 particles per 25 &mgr;m2, wherein the surface topography includes a Rp value of about 20-200 Å, a micro-roughness Rq of about 10 Å or less, and a ratio of Rmax:Rp of about 1.4 or less. An exemplary method includes first providing a substrate surface having a surface micro-roughness Rq of about 10 Å or less and depositing colloidal particles on the surface to provide a Rp value of about 20-200 Å and a ratio of Rmax:Rp of about 1.4 or less. In a further exemplary embodiment, the method increases the micro-roughness Rq, but to a value that is still less than about 10 Å with Rmax:Rp still of about 1.

Abstract: A method for texturing substrate surfaces and a substrate product, such as for computer disk drives. Microbump textured substrates are produced having a Rp value of about 20-200 Å and a ratio of Rmax:Rp of about 1.4 or less. In an exemplary embodiment, a microbump textured substrate is produced having colloidal particles on a surface thereof at a density of at least about 25 particles per 25 &mgr;m2, wherein the surface topography includes a Rp value of about 20-200 Å, a micro-roughness Rq of about 10 Å or less, and a ratio of Rmax:Rp of about 1.4 or less. An exemplary method includes first providing a substrate surface having a surface micro-roughness Rq of about 10 Å or less and depositing colloidal particles on the surface to provide a Rp value of about 20-200 Å and a ratio of Rmax:Rp of about 1.4 or less. In a further exemplary embodiment, the method increases the micro-roughness Rq, but to a value that is still less than about 10 Å with Rmax:Rp still of about 1.

Abstract: An enclosure for heat generating electronic components establishes an airflow path for cooling air. Air is forced through the enclosure by powered air movers, one of which is mounted at the air inlet to the enclosure, and the other of which is mounted at the outlet. Preferably only one air mover is used at a time. In the event of failure of the air mover being used, the remaining air mover begins operation. The total cooling airflow passes through both air movers, and thus the air movers may thus be said to be arranged in series with respect to the airflow. Because the air movers are mounted in series with respect to the airflow, the airflow pattern is substantially the same regardless of which air mover is currently operating. Thus, hot spots which may result when one fan in a fan bank fails are avoided. In the preferred embodiment, the enclosure houses a redundant array of independent disks (RAID) of a computer system.