Patents by Inventor Douglas A. Neidich
Douglas A. Neidich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7775804Abstract: Interposer assembly includes an insulating plate with slots extending through the thickness of the plate and a flat metal contacts confined in the slots.Type: GrantFiled: April 6, 2009Date of Patent: August 17, 2010Assignee: Amphenol CorporationInventors: Douglas A. Neidich, Paul R. Taylor
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Publication number: 20100087072Abstract: Interposer assembly includes an insulating plate with slots extending through the thickness of the plate and a flat metal contacts confined in the slots.Type: ApplicationFiled: April 6, 2009Publication date: April 8, 2010Inventors: Douglas A. Neidich, Paul R. Taylor
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Patent number: 6905343Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact includes a pair of laterally spaced contact points at the top and bottom of the plate. Sandwiching of the interposer assembly between two substrates brings the contact points on each spring arm into engagement with a pad, elastically bends the contacts and forms redundant high pressure wiped electrical connections between the contact points and pads.Type: GrantFiled: April 4, 2003Date of Patent: June 14, 2005Assignee: InterCon Systems, Inc.Inventor: Douglas A. Neidich
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Patent number: 6832917Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact is formed from a length of cylindrical preplated metal wire having a small diameter. Interposer assemblies with contacts formed from small diameter wire contacts have reduced contact inductance and permit reduction of the thickness of the dielectric plate and of the spacing between adjacent contacts on the plate.Type: GrantFiled: January 16, 2004Date of Patent: December 21, 2004Assignee: InterCon Systems, Inc.Inventor: Douglas A. Neidich
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Patent number: 6780056Abstract: A frame for holding an interposer or other circuit device sandwiched between a pair of circuit members includes an EMI shield surrounding the frame. Contact arms extend from the shield and engage the circuit members to electrically or thermally interconnect the EMI shield with the circuit members.Type: GrantFiled: July 31, 2003Date of Patent: August 24, 2004Assignee: InterCon Systems, Inc.Inventor: Douglas A. Neidich
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Patent number: 6730134Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact includes a pair of laterally spaced contact points at the top and bottom of the plate. Sandwiching of the interposer assembly between two substrates brings the contact points on each spring arm into engagement with a pad, elastically bends the contacts and forms redundant high pressure wiped electrical connections between the contact points and pads.Type: GrantFiled: July 2, 2001Date of Patent: May 4, 2004Assignee: InterCon Systems, Inc.Inventor: Douglas A. Neidich
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Patent number: 6672879Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.Type: GrantFiled: September 26, 2002Date of Patent: January 6, 2004Assignee: InterCon Systems, Inc.Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
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Patent number: 6607120Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.Type: GrantFiled: December 23, 1999Date of Patent: August 19, 2003Assignee: InterCon Systems, Inc.Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
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Publication number: 20030029907Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.Type: ApplicationFiled: September 26, 2002Publication date: February 13, 2003Inventors: Douglas A. Neidich, Grant R. Adams
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Publication number: 20030003784Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact includes a pair of laterally spaced contact points at the top and bottom of the plate. Sandwiching of the interposer assembly between two substrates brings the contact points on each spring arm into engagement with a pad, elastically bends the contacts and forms redundant high pressure wiped electrical connections between the contact points and pads.Type: ApplicationFiled: July 2, 2001Publication date: January 2, 2003Inventor: Douglas A. Neidich
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Patent number: 6488513Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts in the passages. The contacts have resilient upper and lower contact arms that deflect into upper and lower recesses of the plate when sandwiched between contact pads of overlying and underlying circuit members. The recesses are sized to accommodate solder connections between contact arms and contact pads.Type: GrantFiled: December 13, 2001Date of Patent: December 3, 2002Assignee: InterCon Systems, Inc.Inventors: Douglas A. Neidich, Donald W. Milbrand, Jr.
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Patent number: 6358063Abstract: An interposer assembly for forming electrical connections between opposed pairs of circuit members includes a plate and metal contacts for electrically connecting the circuit members. A gasket surrounds the plate and sealingly abuts the circuit members when the interposer assembly is sandwiched between the circuit members.Type: GrantFiled: June 28, 2000Date of Patent: March 19, 2002Assignee: InterCon Systems, Inc.Inventor: Douglas A. Neidich
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Patent number: 6315576Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.Type: GrantFiled: January 2, 2001Date of Patent: November 13, 2001Assignee: InterCon Systems, Inc.Inventor: Douglas A. Neidich
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Patent number: 6290507Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are loosely confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.Type: GrantFiled: June 28, 2000Date of Patent: September 18, 2001Assignee: InterCon Systems, Inc.Inventors: Douglas A. Neidich, John D. Walden
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Patent number: 6256879Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts is mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crownshaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.Type: GrantFiled: April 30, 1999Date of Patent: July 10, 2001Assignee: InterCon Systems, Inc.Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
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Patent number: 6217342Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts loosely confined in the passages. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.Type: GrantFiled: April 7, 1999Date of Patent: April 17, 2001Assignee: InterCon Systems, Inc.Inventors: Douglas A. Neidich, John D. Walden
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Patent number: 6176707Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts loosely confined in the passages. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.Type: GrantFiled: December 7, 1999Date of Patent: January 23, 2001Assignee: InterCon Systems, Inc.Inventors: Douglas A. Neidich, John D. Walden
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Patent number: 6036502Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.Type: GrantFiled: January 28, 1999Date of Patent: March 14, 2000Assignee: Intercon Systems, Inc.Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
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Patent number: 5899757Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts are mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crown-shaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.Type: GrantFiled: November 3, 1997Date of Patent: May 4, 1999Assignee: InterCon Systems, Inc.Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
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Patent number: 5882227Abstract: A controlled impedance block for connecting signal lines on a flexible cable to components on a circuit board includes a ground plane matrix surrounding adjacent signal lines. The matrix is formed from intersecting sets of ground blades with electrical connections between the blades at intersections and electrical connections with ground contact pins at intersections.Type: GrantFiled: September 17, 1997Date of Patent: March 16, 1999Assignee: Intercon Systems, Inc.Inventor: Douglas A. Neidich