Abstract: A facet joint surgical tool for treating a facet joint synovial cyst includes rotatable members disposed side-by-side through a minimally invasive sheath and rotatable to reconfigure distal end portions between a facet joint penetration configuration with a tissue piercing tip and a facet joint retraction configuration. Facet joint synovial cysts located to an anterior side of the facet joint are treated by a posterior approach with access to the cyst through the facet joint retracted by the surgical tool. Facet joint synovial cysts located to a posterior side of the facet joint are treated by direct access from a posterior approach.

Abstract: A facet joint surgical tool for treating a facet joint synovial cyst includes rotatable members disposed side-by-side through a minimally invasive sheath and rotatable to reconfigure distal end portions between a facet joint penetration configuration with a tissue piercing tip and a facet joint retraction configuration. Facet joint synovial cysts located to an anterior side of the facet joint are treated by a posterior approach with access to the cyst through the facet joint retracted by the surgical tool. Facet joint synovial cysts located to a posterior side of the facet joint are treated by direct access from a posterior approach.

Abstract: A facet joint surgical tool for treating a facet joint synovial cyst includes rotatable members disposed side-by-side through a minimally invasive sheath and rotatable to reconfigure distal end portions between a facet joint penetration configuration with a tissue piercing tip and a facet joint retraction configuration. Facet joint synovial cysts located to an anterior side of the facet joint are treated by a posterior approach with access to the cyst through the facet joint retracted by the surgical tool. Facet joint synovial cysts located to a posterior side of the facet joint are treated by direct access from a posterior approach.

Abstract: Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

Abstract: Semiconductor tests that use an interposer, and associated systems and methods. In one embodiment, an apparatus for testing semiconductor dies includes a wafer translator having a wafer-side positioned to face toward a device under test, and an inquiry-side facing away from the wafer side. A wafer translator chuck is configured to carry the wafer translator and the wafer-side of the wafer translator in a curved orientation.

Abstract: Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

Abstract: Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

Abstract: Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies includes a semiconductor wafer translator having a wafer-side positioned to face toward a device under test, and an inquiry-side facing away from the wafer-side. The apparatus also includes a flexible arm peripherally connected to the wafer translator, and an evacuation opening within the flexible arm or within the wafer translator. The evacuation opening is open to a flow of a gas in a first position of the flexible arm, and closed to a flow of the gas in a second position of the flexible arm.

Abstract: Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for adjusting a wafer translator for testing semiconductor dies includes the semiconductor wafer translator having a wafer translator substrate with a wafer-side configured to face the dies. A plurality of wafer-side contact structures is carried by the wafer-side of the wafer translator. The apparatus also includes a shaping wafer having a shaping wafer substrate, and a plurality of cavities in the shaping wafer substrate. The wafer-side contact structures are shaped by contacting surfaces of the cavities of the shaping wafer substrate.

Abstract: Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies on a wafer includes a wafer translator having a wafer-side facing toward the wafer, and an inquiry-side facing away from the wafer-side. The wafer has an active side facing the translator. The apparatus includes a peripheral seal configured to seal a space between the wafer translator and the wafer, and a valve in a fluidic communication with the space between the wafer translator and the wafer.

Abstract: Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

Abstract: A facet joint surgical tool for treating a facet joint synovial cyst includes rotatable members disposed side-by-side through a minimally invasive sheath and rotatable to reconfigure distal end portions between a facet joint penetration configuration with a tissue piercing tip and a facet joint retraction configuration. Facet joint synovial cysts located to an anterior side of the facet joint are treated by a posterior approach with access to the cyst through the facet joint retracted by the surgical tool. Facet joint synovial cysts located to a posterior side of the facet joint are treated by direct access from a posterior approach.

Abstract: Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems apply liquid etchant in a precise manner at the edge bevel region of the wafer, so that the etchant is applied on to the front edge, the side edge and the back edge. The etchant thus does not flow or splatter onto the active circuit region of the wafer. An edge bevel removal embodiment involving that is particularly effective at obviating streaking, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.

Abstract: An apparatus and its method of use by an observer to visually determine what, if any, distortions are introduced by unexpected curvature in a personal vanity mirror. The apparatus remains simple to operate and is convenient for casual use. By providing a familiar reference pattern against which to compare the image reflected by a mirror, the observer can make more well-informed decisions.

Abstract: Apparatus for controlling the electrical functions in a plurality of different locations of a vehicle comprises a plurality of electrical control units connected to a data bus (23) and distributed throughout the vehicle. All control units are identical and all are programmed to carry out all the electrical functions of the vehicle. Each unit incorporates means to detect the resistance at the point at which it is connected into the circuitry and to compare that resistance with the stored table of resistance and to select on the basis of that comparison the program for operation appropriate to the particular location in which the unit is disposed. In this way only one unit needs to be certified and units may be switched from location to location to provide a "get you home" service should one of the units fail in a particularly critical location.