Abstract: An article comprising a graphite part coated with a pyrolytic graphite (pG) for increased mechanical strength of at least 25% over an uncoated graphite part. In connector applications for use in a semiconductor processing assembly such as a heater, the pG coated component is overcoated with at least a protective layer of an electrically insulating material, and wherein part of the pG coated graphite part is exposed (uncoated with the protective layer) for providing electrical connections to the assembly.

Abstract: A wafer processing device or apparatus, i.e., a heater or an electrostatic chuck, comprises a planar support platen, a support shaft having centrally located bore, and a pair of electrical conductors located in the shaft. In one embodiment, the electrical conductors are concentrically located within the bore of the shaft, with the first electrical lead being in the form of a pyrolytic graphite rod and separated from the outer second graphite electrical lead by means of a pyrolytic boron nitride (pBN) coating. In a second embodiment, the support platen and the support shaft are formed from a single unitary body of graphite. In yet another embodiment of the device of the invention, the connection posts comprise a carbon fiber composite and the exposed ends of the electrical connectors are coated with a protective ceramic paste for extended life in operations.

Abstract: A heat treatment apparatus for use in batch heating/wafer processing is provided, which comprises a process chamber for receiving a wafer boat, at least a heating element comprising a substrate body configured to form an electrical heating circuit for at least one heating zone and encapsulated in a continuous overcoat layer, a heat reflector comprising a heat reflective surface disposed on the heating element, and the heating element has a ramp rate of at least 1° C. per second for heating the wafers in the wafer boat.

Abstract: An article comprising a graphite part coated with a pyrolytic graphite (pG) for increased mechanical strength of at least 25% over an uncoated graphite part. In connector applications for use in a semiconductor processing assembly such as a heater, the pG coated component is overcoated with at least a protective layer of an electrically insulating material, and wherein part of the pG coated graphite part is exposed (uncoated with the protective layer) for providing electrical connections to the assembly.

Abstract: A heat treatment apparatus for use in batch heating/wafer processing is provided, which comprises a process chamber for receiving a wafer boat, at least a heating element comprising a substrate body configured to form an electrical heating circuit for at least one heating zone and encapsulated in a continuous overcoat layer, a heat reflector comprising a heat reflective surface disposed on the heating element, and the heating element has a ramp rate of at least 1° C. per second for heating the wafers in the wafer boat.

Abstract: A wafer processing device or apparatus, i.e., a heater or an electrostatic chuck, comprises a planar support platen, a support shaft having centrally located bore, and a pair of electrical conductors located in the shaft. In one embodiment, the electrical conductors are concentrically located within the bore of the shaft, with the first electrical lead being in the form of a pyrolytic graphite rod and separated from the outer second graphite electrical lead by means of a pyrolytic boron nitride (pBN) coating. In a second embodiment, the support platen and the support shaft are formed from a single unitary body of graphite. In yet another embodiment of the device of the invention, the connection posts comprise a carbon fiber composite and the exposed ends of the electrical connectors are coated with a protective ceramic paste for extended life in operations.

Abstract: A flash evaporator vaporization vessel for flash evaporating metal under conditions of repeated thermal cycling having a graphite body and an outer layer of pyrolytic boron nitride having a density above 2.15 gm/cc and preferably between 2.19 gm/cc and 2.2 gm/cc.