Abstract: A connector comprises multiple electrically-conductive pins coupled along a line and a press-fit edge connector body intersected by a slot configured for insertion of the multiple pins. Multiple contacts are contained within the press-fit edge connector body and configured to engage and respectively electrically connect to the multiple pins. A web extends across the slot, separating the multiple pins and the multiple contacts into respective different-sized portions whereby the pin plurality is prevented from reversed installation.

Abstract: An industrial sensing network includes a plurality of sensors, each sensor being configured to monitor at least one condition associated with equipment deployed in an industrial complex. The sensing network also includes at least one fixed aggregator configured to gather data collected by one or more of the plurality of sensors and relay the data to a user. The aggregator includes a local communication arrangement configured for communication with other devices deployed within the complex, an external communication arrangement configured for communication with devices external to the complex, a self-contained power source configured to power the aggregator, a processor programmed to at least partially process data, and a storage arrangement configured to at least temporarily store data. At least one sensor is configured to at least partially process sensor measurements into data prior to transmission to the aggregator.

Abstract: A pump monitoring system includes a monitoring device configured for attachment to a cable harness of a pump, a strain gauge configured to measure dynamic loading of at least one cable of the cable harness as the pump operates, a wireless transmitter configured to transmit the dynamic loading measurement, and an external device configured to receive the transmitted dynamic loading measurement.

Abstract: A low electro-magnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electro-magnetic radiation emissions from the integrated circuit package by increasing the electrical impedance of the EMI transmission path between the integrated circuit package and the electronic chassis, thus reducing the capacitive coupling and RFI concerns of conductive heat dissipation. The heat sink of the present invention may also include fins that are external to the electronic chassis for greater heat dissipation by means of external air convection.

Abstract: A low electromagnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electromagnetic radiation emissions from the integrated circuit package by increasing the electrical impedance of the EMI transmission path between the integrated circuit package and the electronic chassis, thus reducing the capacitive coupling and RFI concerns of conductive heat dissipation. The heat sink of the present invention may also include fins that are external to the electronic chassis for greater heat dissipation by means of external air convection.

Abstract: A low electro-magnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electro-magnetic radiation emissions from the integrated circuit package by increasing the electrical impedance of the EMI transmission path between the integrated circuit package and the electronic chassis, thus reducing the capacitive coupling and RFI concerns of conductive heat dissipation. The heat sink of the present invention may also include fins that are external to the electronic chassis for greater heat dissipation by means of external air convection.