Abstract: A packaged semiconductor chip includes a semiconductor sub strate having formed thereon: radio-frequency (RF) input and output contact pads, DC contact pads, and first and second amplifier stages. An input of the first amplifier stage is coupled with the RF input contact pad. An input and an output of the second amplifier stage are respectively coupled to an output of the first amplifier stage and the RF output contact pad. The DC contact pads and the input of the first amplifier stages are connected via an input bias coupling path. The outputs of the amplifier stages are connected via an output bias coupling path. The chip further includes a lead frame having RF input and output pins electrically coupled to the RF input and output contact pads, and input bias pins electrically coupled to the DC contact pad.

Abstract: An active millimeter wave simulator for missile seeker evaluations wherein a missile seeker generates seeker signals and transmits them in the direction of an array of active antenna elements. Range timing signals are delayed in a time delay circuit to simulate a range between the missile seeker and a target. The seeker signals as received by the active antenna elements are supplied to a millimeter wave spectrum analyzer for determination of their frequency. A computer receives the determined frequency and controls a millimeter wave source to generate simulated target response signals with that same frequency but delayed in accordance with the time delay signal. The computer controls a master target control circuit to select a triad of antennas in the antenna array and to generate a phase center in the triad generating the target response signals. The millimeter wave spectrum analyzer further determines the frequency of the target response signals.