Abstract: Thermoelectric enhanced hybrid heat pump systems are provided herein. A compressor increases the pressure of refrigerant within tubing. A first heat exchanger is downstream of the compressor and changes enthalpy of first fluid flow through heat exchange with refrigerant. A second heat exchanger changes enthalpy of second fluid flow through heat exchange with refrigerant. A thermoelectric device is downstream of the first heat exchanger and reduces refrigerant temperature. Expansion valves are downstream of the thermoelectric device and first heat exchanger, respectively located on first and second sides of the thermoelectric device, and expand refrigerant and reduce refrigerant pressure while conserving refrigerant enthalpy. At least one valve reverses refrigerant flow within the tubing without changing compressor operation. A control system controls the thermoelectric device and at least one valve to switch the heat pump system from heating mode to cooling mode and from cooling mode to heating mode.

Abstract: Provided herein is a thermoelectric element that includes a cold end, a hot end, and a p-type or n-type material having a length between the hot end and the cold end. The p-type or n-type material has an intrinsic Seebeck coefficient (S), an electrical resistivity (?), and a thermal conductivity (?). Each of two or more of S, ?, and ? generally increases along the length from the cold end to the hot end. The thermoelectric element may be provided in single-stage thermoelectric devices providing enhanced maximum temperature differences. The single-stage thermoelectric devices maybe combined with one another to provide multi-stage thermoelectric devices with even further enhanced maximum temperature differences.

Abstract: Temperature controlled systems include at least one temperature controlled chamber or package for accommodating temperature-sensitive content. The system includes at least one solid state heat pump in thermal communication with the temperature controlled chamber or package. The system may include a thermal energy storage system in thermal communication with the solid state heat pump, an electrical energy source or an electrical storage system for providing electrical power to the at least one solid state heat pump, an electrical control/energy management system, and/or an input/output feature. The system maintains the temperature controlled chamber at a control temperature, and/or maintains different chambers at different control temperatures.

Abstract: Provided herein is a thermoelectric element that includes a cold end, a hot end, and a p-type or n-type material having a length between the hot end and the cold end. The p-type or n-type material has an intrinsic Seebeck coefficient (S), an electrical resistivity (?), and a thermal conductivity (?). Each of two or more of S, ?, and ? generally increases along the length from the cold end to the hot end. The thermoelectric element may be provided in single-stage thermoelectric devices providing enhanced maximum temperature differences. The single-stage thermoelectric devices maybe combined with one another to provide multi-stage thermoelectric devices with even further enhanced maximum temperature differences.

Abstract: Thermoelectric enhanced hybrid heat pump systems are provided herein. A compressor increases the pressure of refrigerant within tubing. A first heat exchanger is downstream of the compressor and changes enthalpy of first fluid flow through heat exchange with refrigerant. A second heat exchanger changes enthalpy of second fluid flow through heat exchange with refrigerant. A thermoelectric device is downstream of the first heat exchanger and reduces refrigerant temperature. Expansion valves are downstream of the thermoelectric device and first heat exchanger, respectively located on first and second sides of the thermoelectric device, and expand refrigerant and reduce refrigerant pressure while conserving refrigerant enthalpy. At least one valve reverses refrigerant flow within the tubing without changing compressor operation. A control system controls the thermoelectric device and at least one valve to switch the heat pump system from heating mode to cooling mode and from cooling mode to heating mode.

Abstract: Provided herein is a thermoelectric element that includes a cold end, a hot end, and a p-type or n-type material having a length between the hot end and the cold end. The p-type or n-type material has an intrinsic Seebeck coefficient (S), an electrical resistivity (?), and a thermal conductivity (?). Each of two or more of S, ?, and ? generally increases along the length from the cold end to the hot end. The thermoelectric element may be provided in single-stage thermoelectric devices providing enhanced maximum temperature differences. The single-stage thermoelectric devices maybe combined with one another to provide multi-stage thermoelectric devices with even further enhanced maximum temperature differences.

Abstract: Thermoelectric systems employing distributed transport properties to increase cooling and heating performance are provided herein. In some examples, a thermoelectric heat pump is provided that includes a distributed transport properties (DTP) thermoelectric (TE) couple including at least one DTP TE element. The at least one DTP TE element includes a TE material with a Seebeck coefficient, thermal conductivity, or electrical resistance varying within said DTP TE element such that when that DTP TE element is subjected to a fixed temperature differential and no current is flowing in a primary direction that produces heat pumping action, at least at one position within that DTP TE element there is a current that in steady state operation produces a lower temperature than the temperature at that position when no current is flowing.

Abstract: Provided herein is a thermoelectric element that includes a cold end, a hot end, and a p-type or n-type material having a length between the hot end and the cold end. The p-type or n-type material has an intrinsic Seebeck coefficient (S), an electrical resistivity (?), and a thermal conductivity (?). Each of two or more of S, ?, and ? generally increases along the length from the cold end to the hot end. The thermoelectric element may be provided in single-stage thermoelectric devices providing enhanced maximum temperature differences. The single-stage thermoelectric devices maybe combined with one another to provide multi-stage thermoelectric devices with even further enhanced maximum temperature differences.

Abstract: Thermoelectric systems employing distributed transport properties to increase cooling and heating performance are provided herein. In some examples, a thermoelectric heat pump is provided that includes a distributed transport properties (DTP) thermoelectric (TE) couple including at least one DTP TE element. The at least one DTP TE element includes a TE material with a Seebeck coefficient, thermal conductivity, or electrical resistance varying within said DTP TE element such that when that DTP TE element is subjected to a fixed temperature differential and no current is flowing in a primary direction that produces heat pumping action, at least at one position within that DTP TE element there is a current that in steady state operation produces a lower temperature than the temperature at that position when no current is flowing.

Abstract: A method includes preparing a thermoelectric material including p-type or n-type material and first and second caps including transition metal(s). A powder precursor of the first cap can be loaded into a sintering die, punches assembled thereto, and a pre-load applied to form a first pre-pressed structure including a first flat surface. A punch can be removed, a powder precursor of the p-type or n-type material loaded onto that surface, the punch assembled to the die, and a second pre-load applied to form a second pre-pressed structure including a second substantially flat surface. The punch can be removed, a powder precursor of the second cap loaded onto that surface, the first punch assembled to the die, and a third pre-load applied to form a third pre-pressed structure. The third pre-pressed structure can be sintered to form the thermoelectric material; the first or second cap can be coupled to an electrical connector.

Abstract: A thermoelectric generating unit includes a hot-side heat exchanger (HHX) including one or more discrete channels and substantially flat first and second cold-side plates. A first plurality of thermoelectric devices are between the first cold-side plate and a first side of the HHX; and a second plurality of thermoelectric devices can be between the second cold-side plate and a second side of the HHX. Fasteners can extend between the first and second cold-side plates at locations outside of the HHX channel(s). The fasteners can be disposed within gaps between the thermoelectric devices of the first plurality and within gaps between the thermoelectric devices of the second plurality. The fasteners can compress the first plurality of thermoelectric devices between the first cold-side plate and the first side of the HHX and can compress the second plurality of thermoelectric devices between the second cold-side plate and the second side of the HHX.

Abstract: Under one aspect, a structure includes a tetrahedrite substrate; a first contact metal layer disposed over and in direct contact with the tetrahedrite substrate; and a second contact metal layer disposed over the first contact metal layer. A thermoelectric device can include such a structure. Under another aspect, a method includes providing a tetrahedrite substrate; disposing a first contact metal layer over and in direct contact with the tetrahedrite substrate; and disposing a second contact metal layer over the first contact metal layer. A method of making a thermoelectric device can include such a method.

Abstract: A thermoelectric generator includes a tapered inlet manifold including first and second non-parallel sides; first and second pluralities of outlet manifolds; and thermoelectric generating units (TGUs) each including a hot-side heat exchanger (HHX) with inlet and outlet; a cold-side heat exchanger (CHX); and thermoelectric devices arranged between the HHX and CHX. The inlets of some of the HHXs receive exhaust gas from the first side of the tapered inlet manifold and the outlets of those HHXs are coupled to outlet manifolds of the first plurality of outlet manifolds. The inlets of other of the HHXs receive exhaust gas from the second side of the tapered inlet manifold and the outlets of those HHXs are coupled to outlet manifolds of the second plurality of outlet manifolds. The thermoelectric devices can generate electricity responsive to a temperature differential between the exhaust gas and the CHXs.

Abstract: Thermoelectric structures include a flexible substrate; a plurality of conductive shunts; and a plurality of thermoelectric legs that are in thermal and electrical communication with the thermoelectric legs via thermal and electrical paths. In some embodiments, the paths are through apertures in the flexible substrate, and the flexible substrate can be substantially out of the thermal and electrical paths. Some embodiments include a circuit board coupled to the flexible substrate, and a bend in the flexible substrate can be disposed between the plurality of conductive shunts and the circuit board. In some embodiments, a plurality of perforations are defined through the flexible substrate and can be configured to rupture responsive to a temperature condition that otherwise would damage one or more of the thermal and electrical paths, said rupture inhibiting such damage. Other embodiments, and methods, are provided.

Abstract: A method includes preparing a thermoelectric material including p-type or n-type material and first and second caps including transition metal(s). A powder precursor of the first cap can be loaded into a sintering die, punches assembled thereto, and a pre-load applied to form a first pre-pressed structure including a first flat surface. A punch can be removed, a powder precursor of the p-type or n-type material loaded onto that surface, the punch assembled to the die, and a second pre-load applied to form a second pre-pressed structure including a second substantially flat surface. The punch can be removed, a powder precursor of the second cap loaded onto that surface, the first punch assembled to the die, and a third pre-load applied to form a third pre-pressed structure. The third pre-pressed structure can be sintered to form the thermoelectric material; the first or second cap can be coupled to an electrical connector.

Abstract: A method includes preparing a thermoelectric material including p-type or n-type material and first and second caps including transition metal(s). A powder precursor of the first cap can be loaded into a sintering die, punches assembled thereto, and a pre-load applied to form a first pre-pressed structure including a first flat surface. A punch can be removed, a powder precursor of the p-type or n-type material loaded onto that surface, the punch assembled to the die, and a second pre-load applied to form a second pre-pressed structure including a second substantially flat surface. The punch can be removed, a powder precursor of the second cap loaded onto that surface, the first punch assembled to the die, and a third pre-load applied to form a third pre-pressed structure. The third pre-pressed structure can be sintered to form the thermoelectric material; the first or second cap can be coupled to an electrical connector.

Abstract: A method includes preparing a thermoelectric material including p-type or n-type material and first and second caps including transition metal(s). A powder precursor of the first cap can be loaded into a sintering die, punches assembled thereto, and a pre-load applied to form a first pre-pressed structure including a first flat surface. A punch can be removed, a powder precursor of the p-type or n-type material loaded onto that surface, the punch assembled to the die, and a second pre-load applied to form a second pre-pressed structure including a second substantially flat surface. The punch can be removed, a powder precursor of the second cap loaded onto that surface, the first punch assembled to the die, and a third pre-load applied to form a third pre-pressed structure. The third pre-pressed structure can be sintered to form the thermoelectric material; the first or second cap can be coupled to an electrical connector.

Abstract: Thermoelectric device with a multi-leg package and method thereof. The thermoelectric device includes a first ceramic base structure including a first surface and a second surface, and a first plurality of pads including one or more first materials thermally and electrically conductive. The first plurality of pads are attached to the first surface. Additionally, the thermoelectric device includes a second plurality of pads including the one or more first materials. The second plurality of pads are attached to the second surface and arranged in a mirror image with the first plurality of pads. Moreover, the thermoelectric device includes a plurality of thermoelectric legs attached to the first plurality of pads respectively. Each pad of the first plurality of pads is attached to at least two first thermoelectric legs of the plurality of thermoelectric legs.

Abstract: A thermoelectric system includes a first plurality of thermoelectric elements and a second plurality of thermoelectric elements. The thermoelectric system further includes a plurality of heat transfer devices. Each heat transfer device has a first side in thermal communication with two or more thermoelectric elements of the first plurality of thermoelectric elements and a second side in thermal communication with one or more thermoelectric elements of the second plurality of thermoelectric elements, so as to form a stack of thermoelectric elements and heat transfer devices. The two or more thermoelectric elements of the first plurality of thermoelectric elements are in parallel electrical communication with one another, and the two or more thermoelectric elements of the first plurality of thermoelectric elements are in series electrical communication with the one or more thermoelectric elements of the second plurality of thermoelectric elements.

Abstract: A method for increasing adhesion between a security element (e.g., a security strip or band) and a fibrous sheet material such as paper is provided. Also provided by way of this invention is a security element laminated to one or more activatable adhesive films, a fibrous sheet material having such a laminated structure contained on or within a surface thereof, or at least partially embedded therein, and a document (e.g., a security document such as a banknote) made from such a fibrous sheet material.