Abstract: A method and structure for suppressing EMI, especially cross talks among electrical cables, is incorporated in a semiconductor test system, thereby achieving high test reliability and high test speed at low cost. The noise suppression structure includes an electrical cable, a ferrite core attached to the electrical cable to suppress noise among adjacent cables, and means for attaching the ferrite core around the electrical cable. Another aspect is a method for producing the noise suppression structure in the foregoing.

Abstract: A pin block structure formed with a pogo-pin block and a pogo-cap for mounting pogo-pins wherein the contact pins can be easily replaced or changed the positions in the pin block structure. The pogo-pin block includes a plurality of pogo-holes provided through the body of the pogo-pin block for inserting the pogo-pins therethrough, and connecting holes provided between each of the pogo-holes for connecting the spaces of the pogo-holes therethrough. The connecting holes are formed such that the pogo-pins and cables of the pogo-pins can freely pass from one pogo-hole to another pogo-hole through the connecting hole. The pogo-cap is attached to the pogo-pin block after mounting the pogo-pins on the pogo-pin block.

Abstract: A substrate (17) is probed after the planarity between a chuck (16) (or the substrate (17)) and a surface of the probing system (20), such as the bottom surface of the interface (28) or test head (22), has been checked. In one method, a measuring tool (30) having a sensor (36) is placed on a chuck (16) of the probing system (20). A distance between a sensor (36) and a surface within the probing system (20) is measured using the sensor (36). The surface is relatively flat. The sensor (36) remains spaced apart from the surface during the measuring. The measuring tool (30) is removed from the chuck (16). The substrate (17) is placed over the chuck (16) after removing the measuring tool (30) and is probed using the probing system (20). Alternatively, more than one sensor (36) can be used. Further, the sensor(s) (66, 76) could be integrated into the chuck (16), interface (28), or test head (22), thereby not requiring a separate measuring tool (30). Additionally, the method can be automated.