Patents by Inventor Douglas Dopp

Douglas Dopp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRESS RELIEF IN SEMICONDUCTOR WAFERS
    Publication number: 20170148747
    Abstract: Methods for compensating for warpage in a semiconductor structure comprising an epitaxial layer grown on a semiconductor substrate. The methods include forming a buffer layer on the epitaxial layer and forming a compensating layer on the buffer layer; forming a buffer layer on the semiconductor substrate and forming a compensating layer on the buffer layer; and forming grooves in the epitaxial layer.
    Type: Application
    Filed: August 31, 2016
    Publication date: May 25, 2017
    Inventors: Kevin Chi-Wen Chang, Wojciech Krystek, Douglas Dopp, David Hensley, William Wilkinson