Abstract: Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.

Abstract: Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.

Abstract: Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.

Abstract: Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.

Abstract: A packaged integrated circuit having a die with multiple transistors selected from the group consisting of multiple logic, linear and analog linear transistors is provided. The die is attached to a die pad with one or more peripheral leads physically isolated from the die pad, one or more leads integrally connected to the die pad, bond wires, and an encapsulant-formed package body. A lip formed by a vertically recessed lower surface is present on two opposing sides and one end of each physically isolated lead, but not on the surfaces of the integrally connected lead(s). Manufacturing the package includes: providing a leadframe having the die pad and leads connected to a frame; mounting the die to the die pad; electrically connecting, with bond wires, the die to the physically isolated lead(s), but not to the integrally connected lead(s); applying an encapsulant to the leadframe that underfills the lips to lock the physically isolated leads in place; and cutting the leads and die pad from the frame.