Abstract: An instrument registers and tracks a portion of a patient's anatomy by an Augmented Reality (AR) device worn by a surgeon during a surgical procedure. The instrument may be attached to the patient's anatomy. The instrument may be a tripod with a platform. A target plate having front and back faces may be securely attached to the platform. A two-dimensional (2D) code detectable by the AR device may be presented on the front and back faces of the target plate. The 2D code may define a coordinate system having a known relationship to a coordinate system for the patient's anatomy, e.g., through a transformation matrix. The AR device may utilize the coordinate system for the detected 2D code and the transformation matrix to present holograms in predetermined positions relative to the patient's anatomy.

Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.

Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.