Abstract: A fingerprint image capture system comprises an electro-optical material which captures a static fingerprint image and an apparatus for converting the static fingerprint image into an electronic signal. The image capture system includes an electrode for contacting a finger, and a bias supply for creating an electric field where epidermal ridges contact the electro-optical material. A transistor array senses charge or optical density variations in the electro-optical material to create an electronic representation of the fingerprint image. An initialization electrode places the electro-optical material into a uniform condition prior to acquisition of the fingerprint image. A physical artifact of the fingerprint image can be archived by removing the electro-optical material from the system following the fingerprint image acquisition.

Abstract: A fingerprint image capture system comprises an electro-optical material which captures a static fingerprint image and an apparatus for converting the static fingerprint image into an electronic signal. The image capture system includes an electrode for contacting a finger, and a bias supply for creating an electric field where epidermal ridges contact the electro-optical material. A transistor array senses charge or optical density variations in the electro-optical material to create an electronic representation of the fingerprint image. An initialization electrode places the electro-optical material into a uniform condition prior to acquisition of the fingerprint image. A physical artifact of the fingerprint image can be archived by removing the electro-optical material from the system following the fingerprint image acquisition.

Abstract: A fingerprint image capture system comprises an electro-optical material which captures a static fingerprint image and an apparatus for converting the static fingerprint image into an electronic signal. The image capture system includes an electrode for contacting a finger, and a bias supply for creating an electric field where epidermal ridges contact the electro-optical material. A transistor array senses charge or optical density variations in the electro-optical material to create an electronic representation of the fingerprint image. An initialization electrode places the electro-optical material into a uniform condition prior to acquisition of the fingerprint image. A physical artifact of the fingerprint image can be archived by removing the electro-optical material from the system following the fingerprint image acquisition.

Abstract: A system for securing a fingerprint identification artifact comprises an electro-optical material which captures a static fingerprint image and an electrode array for encoding a security code onto the electro-optical material. The security code can be encrypted to prevent unauthorized reading and can further incorporate biometric data based upon the acquired fingerprint, an iris scan, or other attributes unique to an individual. The identification artifact so created can be removed from the system for archival or for use in verifying identity.

Abstract: A fingerprint image capture system comprises an electro-optical material which captures a static fingerprint image and an apparatus for converting the static fingerprint image into an electronic signal. The image capture system includes an electrode for contacting a finger, and a bias supply for creating an electric field where epidermal ridges contact the electro-optical material. A transistor array senses charge or optical density variations in the electro-optical material to create an electronic representation of the fingerprint image. An initialization electrode places the electro-optical material into a uniform condition prior to acquisition of the fingerprint image. A physical artifact of the fingerprint image can be archived by removing the electro-optical material from the system following the fingerprint image acquisition.

Abstract: A fingerprint image capture system comprises an electro-optical material which captures a static fingerprint image and an apparatus for converting the static fingerprint image into an electronic signal. The image capture system includes an electrode for contacting a finger, and a bias supply for creating an electric field where epidermal ridges contact the electro-optical material. A transistor array senses charge or optical density variations in the electro-optical material to create an electronic representation of the fingerprint image. An initialization electrode places the electro-optical material into a uniform condition prior to acquisition of the fingerprint image. A physical artifact of the fingerprint image can be archived by removing the electro-optical material from the system following the fingerprint image acquisition.

Abstract: A fingerprint image capture system comprises an electro-optical material which captures a static fingerprint image and an apparatus for converting the static fingerprint image into an electronic signal. The image capture system includes an electrode for contacting a finger, and a bias supply for creating an electric field where epidermal ridges contact the electro-optical material. A transistor array senses charge or optical density variations in the electro-optical material to create an electronic representation of the fingerprint image. An initialization electrode places the electro-optical material into a uniform condition prior to acquisition of the fingerprint image. A physical artifact of the fingerprint image can be archived by removing the electro-optical material from the system following the fingerprint image acquisition.

Abstract: Disclosed are tactile keys and methods for their production and use. The tactile key may include a substrate; a conductive layer disposed on at least one region of the substrate; a porous layer disposed on at least a portion of the conductive layer; an insulating layer disposed on regions of the substrate that surround the conductive layer and the porous layer to form a well, the well having sidewalls defined by the insulating layer, and a bottom surface at least partially defined by the porous layer; an electroactive polymer composition disposed in the well; and a flexible layer having a conductive coating on at least a portion of a surface facing the electroactive polymer composition, the flexible layer covering the well and at least a portion of the insulating layer surrounding the well. When the tactile key is depressed, an electric field is activated causing the electroactive polymer composition to move towards the flexible layer to provide a tactile feedback.

Abstract: Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.

Abstract: Disclosed are tactile keys and methods for their production and use. The tactile key may include a substrate; a conductive layer disposed on at least one region of the substrate; a porous layer disposed on at least a portion of the conductive layer; an insulating layer disposed on regions of the substrate that surround the conductive layer and the porous layer to form a well, the well having sidewalls defined by the insulating layer, and a bottom surface at least partially defined by the porous layer; an electroactive polymer composition disposed in the well; and a flexible layer having a conductive coating on at least a portion of a surface facing the electroactive polymer composition, the flexible layer covering the well and at least a portion of the insulating layer surrounding the well. When the tactile key is depressed, an electric field is activated causing the electroactive polymer composition to move towards the flexible layer to provide a tactile feedback.

Abstract: Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.

Abstract: Some embodiments can include a method of manufacturing first electronic device(s) and second electronic device(s), the method including: providing a carrier substrate having a first side and a second side, a first substrate bonded to the first side of the carrier substrate, and a second substrate bonded to the second side of the carrier substrate; depositing at least one layer of a first material over the first substrate while the first substrate is bonded to the first side of the carrier substrate to create a portion of the first electronic device(s); and depositing at least one layer of a second material over the second substrate while the second substrate is bonded to the second side of the carrier substrate to create a portion of the second electronic device(s). In many embodiments, the first substrate and/or the second substrate includes a flexible substrate. Other related systems and methods are also disclosed.

Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Abstract: Some embodiments include a method of providing an electronic device structure. Other embodiments for related methods and electronic device structures are also disclosed.

Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Abstract: Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.

Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.

Abstract: Flexible substrates can be temporarily attached to a rigid carrier for processing a surface thereof by depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier, contacting the flexible substrate and the rigid carrier at the one or more contact points; and exposing the one or more contact points to a temperature of between 219° C. and 1000° C. and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material. Examples of suitable joining materials include, but are not limited to soldering or brazing materials. Such supported substrates can be used for preparing flexible displays comprising at least one electronic component and/or circuit on a surface of the flexible display.

Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.