Patents by Inventor Douglas G. FOURNIER

Douglas G. FOURNIER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10244659
    Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: March 26, 2019
    Assignee: Apple Inc.
    Inventors: Daniel W. Jarvis, David A. Pakula, David J. Dunsmoor, Ian A. Spraggs, Lee E. Hooton, Marwan Rammah, Matthew D. Hill, Robert F. Meyer, James A. Bertin, Eric M. Bennett, Simon C. Helmore, Melissa A. Wah, Jon F. Housour, Douglas G. Fournier, Christopher S. Tomasetta
  • Publication number: 20190041909
    Abstract: An electronic disclosed herein may include a band formed from metal that combines with a bottom wall formed from a non-metal to form an enclosure that carries internal components. The electronic device may include a transparent cover and a display assembly partially covered by a border having a uniform dimension. The electronic device may include a vision system designed for facial recognition of a user of the electronic device. A bracket assembly may hold the vision system. The bracket assembly may not be affixed to the enclosure and may move relative to the enclosure. The electronic device may include a battery assembly having multiple battery components coupled together. The electronic device may further include a receiver coil for wireless charging of the battery assembly. The electronic device may include a circuit board assembly having stacked circuit boards. The electronic device may further include a dual camera assembly.
    Type: Application
    Filed: August 6, 2018
    Publication date: February 7, 2019
    Inventors: David A. PAKULA, Daniel W. JARVIS, Shimon ELKAYAM, Brandon R. GARBUS, Christopher S. GRAHAM, Karl Ruben F. LARSSON, Ashley E. FLETCHER, Jared M. KOLE, Eric S. JOL, Aaron A. ORO, Michael D. QUINONES, Gregory N. STEPHENS, Ian SPRAGGS, James A. BERTIN, Simon C. HELMORE, Melissa A. WAH, Matthew D. HILL, Jon F. HOUSOUR, Douglas G. FOURNIER, Christopher S. TOMASETTA
  • Publication number: 20180083322
    Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.
    Type: Application
    Filed: September 21, 2017
    Publication date: March 22, 2018
    Inventors: David A. PAKULA, Daniel W. JARVIS, Gregory N. STEPHENS, Ian A. SPRAGGS, James A. BERTIN, Eric M. BENNETT, Simon C. HELMORE, Melissa A. WAH, Matthew D. HILL, Jon F. HOUSOUR, Douglas G. FOURNIER, Christopher S. TOMASETTA
  • Publication number: 20180081481
    Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.
    Type: Application
    Filed: September 21, 2017
    Publication date: March 22, 2018
    Inventors: Douglas G. FOURNIER, James R. KROGDAHL, Daniel W. JARVIS, Edward S. HUO, Lee E. HOOTON, Srikanth V. THIRUPPUKUZHI, Garrett R. OWOC, Michael NGO, David A. PAKULA, Robert F. MEYER
  • Publication number: 20180084680
    Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.
    Type: Application
    Filed: September 21, 2017
    Publication date: March 22, 2018
    Inventors: Daniel W. JARVIS, David A. PAKULA, David J. DUNSMOOR, Ian A. SPRAGGS, Lee E. HOOTON, Marwan RAMMAH, Matthew D. HILL, Robert F. MEYER, James A. BERTIN, Eric M. BENNETT, Simon C. HELMORE, Melissa A. WAH, Jon F. HOUSOUR, Douglas G. FOURNIER, Christopher S. TOMASETTA
  • Patent number: D832266
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: October 30, 2018
    Assignee: Apple Inc.
    Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Daniele De Iuliis, Markus Diebel, Douglas G. Fournier, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Daniel W. Jarvis, Duncan Robert Kerr, Robert F. Meyer, David A. Pakula, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Ian Spraggs, Christopher J. Stringer, Joe Sung Ho Tan, Tang Yew Tan, Clement Tissandier, Eugene Antony Whang, Rico Zörkendörfer
  • Patent number: D832267
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: October 30, 2018
    Assignee: Apple Inc.
    Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Daniele De Iuliis, Markus Diebel, Ashley E. Fletcher, Douglas G. Fournier, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Daniel W. Jarvis, Duncan Robert Kerr, Robert F. Meyer, David A. Pakula, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Christopher J. Stringer, Joe Sung Ho Tan, Tang Yew Tan, Clement Tissandier, Eugene Antony Whang, Rico Zörkendörfer