Patents by Inventor Douglas G. Kleweno

Douglas G. Kleweno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications
    Patent number: 5232970
    Abstract: A ceramic-filled thermally-conductive composite for use in microelectronic applications includes a substantially homogeneous mixture of a solidified polymeric material and an adamantine-structured ceramic filler, such as aluminum nitride or boron nitride, wherein the solidified polymeric material is substantially continuous. The solidified polymeric material may be a material containing a predominant amount of a fusible semi-crystalline polyamide having a melting point of greater than about 250.degree. C. or a polybenzocyclobutene.
    Type: Grant
    Filed: January 10, 1992
    Date of Patent: August 3, 1993
    Assignee: The Dow Chemical Company
    Inventors: Jitka Solc, Douglas G. Kleweno
  • Rubber modified epoxy resins
    Patent number: 5108824
    Abstract: Epoxy resins have been reacted with a copolymer of a diunsaturated aliphatic compound and acrylonitrile or methacrylonitrile and a siloxane-containing polymer resulting in a rubber modified epoxy resin suitable for use in electrical and electronic component encapsulation formulations which provide such components with improved thermal shock performance. The rubber modified epoxy resins have improved flexural properties with minimal reduction in glass transition temperature.
    Type: Grant
    Filed: February 6, 1990
    Date of Patent: April 28, 1992
    Assignee: The Dow Chemical Company
    Inventors: Chun S. Wang, Douglas G. Kleweno