Patents by Inventor Douglas Gordon Ivey

Douglas Gordon Ivey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6245208
    Abstract: A relatively stable, weakly acidic, non-cyanide electroplating solution for deposition of Au—Sn alloys over a range of compositions. The solution consists of Au and Sn chloride salts, as well as ammonium citrate as a buffering agent and sodium sulphite and L-ascorbic acid as stabilizers. Preliminary electroplating experiments with the developed solution indicate that uniform, homogeneous deposits can be achieved over a range of compositions, including the technologically important eutectic and near euctectic values.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: June 12, 2001
    Assignee: Governors of the University of Alberta
    Inventors: Douglas Gordon Ivey, Wenzhen Sun