Patents by Inventor Douglas Hawks

Douglas Hawks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package with embedded components
    Patent number: 8304888
    Abstract: This document discusses, among other things, a semiconductor die package having a first and a second discrete components embedded into a dielectric substrate. An integrated circuit (IC) die is surface mounted on a first side of the dielectric substrate. The semiconductor die package includes a plurality of conductive regions on the second side of the dielectric substrate for mounting the semiconductor die package. A plurality of through hole vias couple the IC die to the first and second discrete components and the plurality of conductive regions.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: November 6, 2012
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Luke England, Douglas Hawks
  • INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED COMPONENTS
    Publication number: 20110147917
    Abstract: This document discusses, among other things, a semiconductor die package having a first and a second discrete components embedded into a dielectric substrate. An integrated circuit (IC) die is surface mounted on a first side of the dielectric substrate. The semiconductor die package includes a plurality of conductive regions on the second side of the dielectric substrate for mounting the semiconductor die package. A plurality of through hole vias couple the IC die to the first and second discrete components and the plurality of conductive regions.
    Type: Application
    Filed: December 22, 2009
    Publication date: June 23, 2011
    Applicant: Fairchild Semiconductor Corporation
    Inventors: Luke England, Douglas Hawks