Abstract: A server memory device provides highspeed storage to a computer system. The server memory device has a connector that can make electrical coupling with the computer system. The server memory device includes two memory modules, each with one or more memory chips. Each memory module is coupled and bonded with an interposer. Each interposer is coupled and bonded with the server memory device connector. The connector and interposers provide a high-density interconnect that connects two memory modules to a computer system. The server memory device has a form factor that uses a single unit (1 U) of a server rack, doubling the memory capacity provided to the computer system through a single unit (1 U) equipment rack.

Abstract: An apparatus is described. The apparatus includes a power management integrated circuit (PMIC) to generate a supply voltage for a memory module. The PMIC is to perform a measurement during bring-up of the memory module of a worst case current draw of the memory module and/or corresponding droop in the supply voltage. The PMIC is to apply a step-up to the supply voltage in accordance with the measurement in response to detection by the PMIC of a surge in the memory module's current draw during operation of the memory module.

Abstract: A cooling system includes a cooling fluid bypass to direct cooling fluid around a processor device to a memory module shadowed by the processor device from the cooling fluid flow. The fluid bypass allows the system to direct cooling fluid to the shadowed memory module that has not been used to cool the processor. There are various configurations, allowing the bypassing of different amounts of cooling fluid, allowing system designers to balance a tradeoff between processor heat and memory module heat.

Abstract: Apparatus and methods for conductive memory module notch and connector-to-motherboard pins for power or ground. A memory module includes a conductive notch that is coupled to either one or more ground planes in respective layers in the memory module's PCB or to a power rail formed on one or more layers in the PCB. A memory module connector includes a notch pin that is configured to mate with the conductive notch when the memory module is installed in the connector. The connector is mounted to a motherboard or the like and the notch pin is coupled to either power (e.g., Vin) or ground in the motherboard. When coupled to power, Vin is supplied to the memory module via the notch pin/conductive notch. When coupled to ground on the motherboard, at least a portion of the ground planes in the PCB are coupled to ground via the notch pin/conductive notch.

Abstract: Compression Attached Memory Module (CAMM) connector pin with multi-spring (dual bend direction) levers and associated connectors. The connector pin comprises an upper cantilevered spring member coupled to an upper portion of a body and a lower cantilevered spring member coupled to a lower portion of the body. Each of the upper and lower cantilevered spring members include at least one forward bending lever and a backward bending lever. The upper cantilevered spring member may have a pair of arms merging to form an upper unified spring member having a nose and looping backwards over the arms and having an apex. A lower cantilevered spring may have a pair of legs merging to form a lower unified spring member having a nose and looping backwards under the legs and having a bottom. When compressed the forward and backward bending levers counteract one another in the horizontal plane, reducing horizontal displacement.

Abstract: A server memory device provides highspeed storage to a computer system. The server memory device has a connector that can make electrical coupling with the computer system. The server memory device includes two memory modules, each with one or more memory chips. Each memory module is coupled and bonded with an interposer. Each interposer is coupled and bonded with the server memory device connector. The connector and interposers provide a high-density interconnect that connects two memory modules to a computer system. The server memory device has a form factor that uses a single unit (1U) of a server rack, doubling the memory capacity provided to the computer system through a single unit (1U) equipment rack.

Abstract: Power consumption for refresh of memory devices on a memory module is reduced by each memory device on the memory module to one of a plurality of sub channels on the memory module. Each sub channel has a thermal sensor that monitors the temperature of the DRAM chips in the region. The refresh rate is increased only for the memory devices in the sub channel in which the memory devices operate above a predefined high temperature. This results in a reduction in power required by the memory module for refresh and an increase in the maximum bandwidth of the memory module.

Abstract: An apparatus is described. The apparatus includes a power management integrated circuit (PMIC) to generate a supply voltage for a memory module. The PMIC is to perform a measurement during bring-up of the memory module of a worst case current draw of the memory module and/or corresponding droop in the supply voltage. The PMIC is to apply a step-up to the supply voltage in accordance with the measurement in response to detection by the PMIC of a surge in the memory module's current draw during operation of the memory module.

Abstract: A memory controller includes a sensor poller and a proportional integral controller (PIC) coupled to the sensor poller. The sensor poller is to obtain a temperature and a power of a memory module (MM) operated by the controller, and the PIC is to: dynamically set at least one bandwidth limit for the MM, based, at least in part, on a relationship between a temperature of the MM, a power of the MM and a bandwidth of the MM. The dynamically set bandwidth limit defines the power of the MM at which the MM operates for a predetermined temperature limit. A system includes a memory controller and a dual in-line memory module (DIMM) operated by it.

Abstract: Embodiments include devices, systems, and methods relating to removing heat from a memory module in a connector. One embodiment relates to a memory module connector comprising a first arm, a second arm, and a body portion positioned between the first arm and the second arm, the body portion configured to accept a memory module therein. The memory module connector includes a structure coupled to the first arm and configured to be electrically coupled to a printed circuit board. The memory module connector also includes a heat spreader coupled to the first arm, the heat spreader configured to be brought into thermal contact with a memory module component. Other embodiments are described and claimed.

Abstract: Power consumption for refresh of memory devices on a memory module is reduced by each memory device on the memory module to one of a plurality of sub channels on the memory module. Each sub channel has a thermal sensor that monitors the temperature of the DRAM chips in the region. The refresh rate is increased only for the memory devices in the sub channel in which the memory devices operate above a predefined high temperature. This results in a reduction in power required by the memory module for refresh and an increase in the maximum bandwidth of the memory module.

Abstract: A decoupling system includes a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber. The deflection plate includes one or more vacuum pores extending through the deflection plate. A peeling flange is coupled with a remainder of the deflection plate at a compliant joint. A die profile opening extends from the compliant joint around the peeling flange in the shape of a die profile. The die profile opening separates the peeling flange from the remainder of the deflection plate. The peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media. In the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate. In the peeling configuration the peeling flange is deflected, and at least a portion of the flange is spaced from the remainder of the deflection plate.

Abstract: Embodiments include devices, systems, and methods relating to removing heat from a memory module in a connector. One embodiment relates to a memory module connector comprising a first arm, a second arm, and a body portion positioned between the first arm and the second arm, the body portion configured to accept a memory module therein. The memory module connector includes a structure coupled to the first arm and configured to be electrically coupled to a printed circuit board. The memory module connector also includes a heat spreader coupled to the first arm, the heat spreader configured to be brought into thermal contact with a memory module component. Other embodiments are described and claimed.

Abstract: An apparatus is provided which comprises: a first heat spreader surface, a second heat spreader surface, and a plurality of heat spreading fins on, and extending substantially perpendicularly from, the first and second heat spreader surfaces, wherein the plurality of heat spreading fins are arranged substantially parallel to one another in a plurality of substantially linear columns, wherein the columns of heat spreading fins are separated by gap regions wider than the heat spreading fins, and wherein the columns of heat spreading fins on the first heat spreader surface are sited to line up with gap regions between columns of heat spreading fins on the second heat spreader surface when the first and second heat spreader surfaces are aligned. Other embodiments are also disclosed and claimed.

Abstract: In embodiments, a memory controller includes a sensor poller and a proportional integral controller (PIC) coupled to the sensor poller. The sensor poller is to obtain a temperature and a power of a memory module (MM) operated by the controller, and the PIC is to: dynamically set at least one bandwidth limit for the MM, based, at least in part, on a relationship between a temperature of the MM, a power of the MM and a bandwidth of the MM. In embodiments, the dynamically set bandwidth limit defines the power of the MM at which the MM operates for a predetermined temperature limit. In embodiments, a system includes a memory controller and a dual in-line memory module (DIMM) operated by it.

Abstract: An apparatus is provided which comprises: a first heat spreader surface, a second heat spreader surface, and a plurality of heat spreading fins on, and extending substantially perpendicularly from, the first and second heat spreader surfaces, wherein the plurality of heat spreading fins are arranged substantially parallel to one another in a plurality of substantially linear columns, wherein the columns of heat spreading fins are separated by gap regions wider than the heat spreading fins, and wherein the columns of heat spreading fins on the first heat spreader surface are sited to line up with gap regions between columns of heat spreading fins on the second heat spreader surface when the first and second heat spreader surfaces are aligned. Other embodiments are also disclosed and claimed.

Abstract: A decoupling system includes a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber. The deflection plate includes one or more vacuum pores extending through the deflection plate. A peeling flange is coupled with a remainder of the deflection plate at a compliant joint. A die profile opening extends from the compliant joint around the peeling flange in the shape of a die profile. The die profile opening separates the peeling flange from the remainder of the deflection plate. The peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media. In the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate. In the peeling configuration the peeling flange is deflected, and at least a portion of the flange is spaced from the remainder of the deflection plate.

Abstract: Embodiments of an apparatus, system, method and techniques are described for an improved volumetric resistance blower and rotor. An apparatus may comprise, for example a motor, a casing having one or more inlets and one or more outlets, and a cylindrical rotor to create a volumetric resistance inside the casing, at least a portion of the rotor comprising a porous material. Other embodiments are described.

Abstract: In one embodiment a hinge assembly comprises a first hinge pin rotatable about a first axis, a first gear coupled to the first hinge pin and rotatable about the first axis, a second hinge pin rotatable about a second axis substantially parallel to the first axis, a second gear coupled to the second hinge pin and rotatable about the second axis, at least one connecting member to be coupled to the first hinge pin and the second hinge pin to hold the first hinge pin at a fixed distance from the second hinge pin such that the first gear is engaged with the second gear. At least one of the first gear or the second gear comprises a variable radius. Other embodiments may be described.

Abstract: In one embodiment a blower comprises a case comprising a first surface, a second surface opposite the first surface, and a side wall extending between portions of the first surface and the second surface, wherein the side wall comprises an air inlet and an air outlet, an impeller disposed in the case and rotatable about an axis of rotation extending through a hub, wherein the impeller comprises a plurality of blades which define a gap with the hub, wherein portions of the side wall are disposed at least a first distance from the axis of rotation and the impeller is to define a circumferential airflow path within the case, wherein the impeller is to create an airflow in the circumferential airflow path between the air inlet and the air outlet, and a feature disposed in the gap to impede recirculation of air in the case.