Abstract: A method of using a laser to achieve direct patterning of resistive or electrically conductive materials in the fabrication of miniature electronic components entails aligning with a patterned array-carrying major surface a laser beam that has a sufficient spot size and energy distribution to remove selected portions of resistive or conductive material that has been applied to the substrate. The major surface carrying the resistive or conductive material and the laser beam are moved relative to each other such that the laser beam ablates, or otherwise removes, selected portions of the resistive or conductive material. Thus preferred embodiments of the method form an array of multiple, mutually spaced-apart resistive or conductive material regions whose side and end margins have improved dimensional precision.