Patents by Inventor Douglas J. Chaput

Douglas J. Chaput has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variable thickness stamper for creation of flat molded substrates
    Patent number: 6961950
    Abstract: The invention is directed toward techniques for creating molded substrates for use in various different data storage media. The molded substrates have improved thickness profiles that can improve media quality, and in some cases facilitate higher data storage densities. In many cases, the improved thickness profile is a thickness profile that has improved flatness. Mechanical flatness or optical flatness can be achieved. In particular, optical flatness is desirable for substrates used in holographic data storage media having a sandwiched construction.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: November 1, 2005
    Assignee: Imation Corp.
    Inventors: Donald J. Kerfeld, Douglas J. Chaput, Jathan D. Edwards, Chad R. Sandstrom
  • Variable thickness stamper for creation of flat molded substrates
    Publication number: 20030043731
    Abstract: The invention is directed toward techniques for creating molded substrates for use in various different data storage media. The molded substrates have improved thickness profiles that can improve media quality, and in some cases facilitate higher data storage densities. In many cases, the improved thickness profile is a thickness profile that has improved flatness. Mechanical flatness or optical flatness can be achieved. In particular, optical flatness is desirable for substrates used in holographic data storage media having a sandwiched construction.
    Type: Application
    Filed: September 4, 2001
    Publication date: March 6, 2003
    Applicant: Imation Corp.
    Inventors: Donald J. Kerfeld, Douglas J. Chaput, Jathan D. Edwards, Chad R. Sandstrom