Abstract: A universal metal working kit is described. The kit has a plurality of interchangeable elements that combine with a master bushing to perform different workpiece locating and holding functions and objectives.

Abstract: The level of vapor generated by heaters located in boiling electronic liquid contained in a vessel is maintained at a first level below the path of travel of work product and is elevated to a second level above the work product to process the work product. After a selected processing time the vapor level is lowered to the lower level so that the work product will not be overheated.

Abstract: A processing vessel has two adjacent tanks each holding different electronic liquids. When heated the first will generate saturated vapor having a temperature below the liquidus temperature of eutectic solder and the second, when heated, will generate saturated vapor having a temperature above the liquidus temperature of eutectic solder. Work product is sequentially passed through these vapors and is first preheated and then reflowed.

Abstract: A vapor phase system for soldering of a workpiece. A vessel for containing an electronic liquid which is heated to generate a zone of saturated vapor. A first inclined throat communicates with the vessel and a solder pot is located within the vessel. The solder pot including a reservoir for containing molten solder, a second throat aligned with the first throat and communicating at one end with molten solder contained in the reservoir means and communicating at the other end with the saturated vapor, molten solder contained in the reservoir means is pumped through the second throat and is captured by the reservoir and a conveyor carries work product through the first throat, through the saturated vapor and into the second throat whereby the work product will become immersed in the molten solder contained within the second throat.

Abstract: A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

Abstract: A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

Abstract: A single vapor system for soldering, fusing, or brazing includes vertically disposed chambers which provide a draining and drying zone above a vapor processing zone. Draining occurs in the upper zone with no additional heat being added in vapor recovery. A sealing system is utilized which is actuated by the carrier elevator as an article-carrying basket is moved into and out of the zones. The sealing system includes a moveable top cover resting on the top of the article-carrying basket, with the top cover being left at the top of the draining and drying zone to seal the top of this zone when the basket is lowered to the bottom of this zone. A moveable bottom plate is raised by pulleys and weights, spring returns or other means to the bottom of the draining and drying zone such that the bottom plate seals the bottom of this zone, isolating the zones one from the other.

Abstract: A solder leveling system for use in vapor phase soldering of printed wiring boards. A transport system operating in a near-horizontal mode moves the board to be solder coated through a vapor zone in a chamber having a solder pot which has a throat in line with the plane of the transport system. The near-horizontal movement through the vapor and into and out of the solder pot prevents solder sag and permits control of the thickness of solder deposited on the opposing board surfaces. Leveling nozzles are positioned in a vapor-filled chamber astride the transport system between the solder pot and the chamber throat. Perpendicular nozzle offset distance from the board and nozzle angle are adjustable. Preferably one nozzle projects a stream normal to the board, with the other nozzle projecting a grazing stream for clearing through holes. A nozzle flow rate corresponding to a predetermined energy threshold provides reliable hole clearing.