Patents by Inventor Douglas James Malcolm
Douglas James Malcolm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230253151Abstract: An inductor includes an air-core coil assembled with a T-shaped core and a composite magnetic material and resin mixture embedding the T-shaped core and the air-core coil. The air-core coil has: a coil member having a coil axis and first and second sides opposite to each other; and first and second leads that are integrally connected to the coil member. The first and second leads respectively have: first and second bent members at the first side; first and second ends at the second side; and first and second bottom extensions respectively connected between the first and second bent members and the first and second ends. The first and second bent members extend in a first direction parallel to the coil axis, the first and second ends extend in a second direction parallel to the coil axis, and the first and second bottom extensions extend perpendicular to the coil axis.Type: ApplicationFiled: April 17, 2023Publication date: August 10, 2023Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
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Patent number: 11657962Abstract: An inductor includes an air-core coil assembled with a T-shaped core and a composite magnetic material and resin mixture embedding the T-shaped core and the air-core coil. The air-core coil has: a coil member having a coil axis and first and second sides opposite to each other; and first and second leads that are integrally connected to the coil member. The first and second leads respectively have: first and second bent members at the first side; first and second ends at the second side; and first and second bottom extensions respectively connected between the first and second bent members and the first and second ends. The first and second bent members extend in a first direction parallel to the coil axis, the first and second ends extend in a second direction parallel to the coil axis, and the first and second bottom extensions extend perpendicular to the coil axis.Type: GrantFiled: September 24, 2021Date of Patent: May 23, 2023Inventors: Shinichi Sakamoto, Douglas James Malcolm
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Publication number: 20220013285Abstract: An inductor includes an air-core coil assembled with a T-shaped core and a composite magnetic material and resin mixture embedding the T-shaped core and the air-core coil. The air-core coil has: a coil member having a coil axis and first and second sides opposite to each other; and first and second leads that are integrally connected to the coil member. The first and second leads respectively have: first and second bent members at the first side; first and second ends at the second side; and first and second bottom extensions respectively connected between the first and second bent members and the first and second ends. The first and second bent members extend in a first direction parallel to the coil axis, the first and second ends extend in a second direction parallel to the coil axis, and the first and second bottom extensions extend perpendicular to the coil axis.Type: ApplicationFiled: September 24, 2021Publication date: January 13, 2022Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
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Patent number: 11158454Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of an Fe—Si—Cr alloy, a thermosetting resin, and a solvent into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: GrantFiled: August 12, 2020Date of Patent: October 26, 2021Inventors: Shinichi Sakamoto, Douglas James Malcolm
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Publication number: 20200373086Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of an Fe—Si—Cr alloy, a thermosetting resin, and a solvent into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: ApplicationFiled: August 12, 2020Publication date: November 26, 2020Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
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Patent number: 10777352Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.Type: GrantFiled: November 27, 2019Date of Patent: September 15, 2020Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
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Publication number: 20200098515Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.Type: ApplicationFiled: November 27, 2019Publication date: March 26, 2020Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
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Patent number: 10529485Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: GrantFiled: August 20, 2019Date of Patent: January 7, 2020Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
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Publication number: 20190371524Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: ApplicationFiled: August 20, 2019Publication date: December 5, 2019Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
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Patent number: 10431378Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: GrantFiled: April 16, 2019Date of Patent: October 1, 2019Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
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Publication number: 20190244753Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: ApplicationFiled: April 16, 2019Publication date: August 8, 2019Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
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Patent number: 10304624Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.Type: GrantFiled: October 6, 2017Date of Patent: May 28, 2019Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
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Publication number: 20190131050Abstract: An inductor having a monolithic core that has a void or space underneath. In some embodiments, the core comprises multiple core pieces; in other embodiments, the core comprises a unitary core piece. The void allows for other electrical components to be mounted underneath the inductor, on the PCB or other substrate to which the inductor is to be mounted. The inductor may have one or more coils, and each coil may be a single turn or a multi-turn coil. The coils can be embedded within the core once the inductor is assembled. The inductor may have an air gap within the core.Type: ApplicationFiled: August 29, 2018Publication date: May 2, 2019Inventors: Hamid DANESH pajooh nejad, Douglas James MALCOLM
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Patent number: 10148172Abstract: A power supply module is disclosed. The power supply module includes: a coil including a coil body and connecting ends; electronic components including at least an integrated circuit chip; a magnetic core which encloses the coil body, wherein at least one side of the magnetic core has a cavity provided therein, and the at least one electronic component is positioned in the cavity; a connector, which abuts against the side of the magnetic core having the cavity therein, covers the surface of the side, and is electronically connected to the coil and the electronic components. The power supply module is able to reduce the damage to the integrated circuit chip, decrease electromagnetic interferences and achieve an excellent cooling effect.Type: GrantFiled: February 26, 2013Date of Patent: December 4, 2018Assignee: Sumida Electric (H.K.) Company LimitedInventors: Douglas James Malcolm, Yanfei Liu, Guoping Zhang, Zhuo Wu, Hongnian Zhang, Xinliang Luo
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Patent number: 10080297Abstract: A power supply module and a method for manufacturing the same are disclosed. The power supply module includes: a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.Type: GrantFiled: April 30, 2014Date of Patent: September 18, 2018Assignee: Sumida Electric (H.K.) Company LimitedInventors: Zhuo Wu, Douglas James Malcolm, Yanfei Liu
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Patent number: 9907184Abstract: A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demolding the magnetic body from the mold cavity; and increasing the temperature of the demolded magnetic body by heating.Type: GrantFiled: September 4, 2015Date of Patent: February 27, 2018Assignee: SUMIDA ELECTRIC (H.K.) COMPANY LIMITEDInventors: Hongnian Zhang, Yanfei Liu, Douglas James Malcolm
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Publication number: 20180033551Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.Type: ApplicationFiled: October 6, 2017Publication date: February 1, 2018Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
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Patent number: 9818534Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.Type: GrantFiled: June 9, 2015Date of Patent: November 14, 2017Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
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Patent number: 9773607Abstract: A coil with variable inner diameter is disclosed. The coil includes a coil body consisting of a plurality of turns of winding, and a connecting terminal configured to be connected to an external device, wherein the winding is wound to form at least two different inner diameters. And an electronic module made from the coil with variable inner diameter is also disclosed. The electronic module includes: electronic components including at least an integrated circuit chip; a coil with variable inner diameter, including a coil body having at least two different inner diameters and a connecting terminal; a connector, configured to be electrically connected with the electronic component and the coil; and a magnetic conductor, configured to enclose in and around the coil body and the electronic component.Type: GrantFiled: April 30, 2014Date of Patent: September 26, 2017Assignee: Sumida Electric (H.K.) Company LimitedInventors: Hongnian Zhang, Douglas James Malcolm, Yanfei Liu
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Patent number: 9691537Abstract: A power supply module is disclosed. the power supply module includes a coil including a coil body and connecting terminals; an electronic component including at least an integrated circuit chip; a magnetic core configured to enclose in and around the coil body, wherein a recess is provided on at least one side surface of the magnetic core, the electronic components are located in the recess, and an opening is provided on at least one side wall of the recess; a connector configured to be tightly attached to and cover the side surface where the recess is provided, and be electrically connected with the coil and the electronic component; and a heat conducting material provided in the recess and configured to cover the electronic component.Type: GrantFiled: March 19, 2014Date of Patent: June 27, 2017Assignee: Sumida Electric (H.K.) Company LimitedInventors: Douglas James Malcolm, Yanfei Liu, Guoping Zhang