Patents by Inventor Douglas Jay Levack

Douglas Jay Levack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9960034
    Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: May 1, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Sandra Zheng, Mark James Smiley, Douglas Jay Levack, Ronald Dean Powell
  • Publication number: 20170084453
    Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.
    Type: Application
    Filed: December 5, 2016
    Publication date: March 23, 2017
    Inventors: Sandra Zheng, Mark James Smiley, Douglas Jay Levack, Ronald Dean Powell
  • Patent number: 9548199
    Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: January 17, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Sandra Zheng, Mark James Smiley, Douglas Jay Levack, Ronald Dean Powell
  • Publication number: 20160071725
    Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.
    Type: Application
    Filed: September 9, 2014
    Publication date: March 10, 2016
    Applicant: Texas Instruments Incorporated
    Inventors: Sandra Zheng, Mark James Smiley, Douglas Jay Levack, Ronald Dean Powell