Patents by Inventor Douglas Jay Mathews

Douglas Jay Mathews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip semiconductor package with integral shield and antenna
    Patent number: 7049682
    Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: May 23, 2006
    Assignees: Amkor Technology, Inc., Tyco Electronics Logistics AG
    Inventors: Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan
  • Multi-chip semiconductor package with integral shield and antenna
    Patent number: 6686649
    Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: February 3, 2004
    Assignees: Amkor Technology, Inc., Tyco Electronics Logistics AG
    Inventors: Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan