Abstract: A method and apparatus for thermally processing material on a low-temperature substrate using pulsed light from a flash lamp is disclosed. Material is conveyed past the flash lamp. The pulses of light are formed by Pulse Width Modulation to tailor the shape of the pulses to generate a thermal gradient in the substrate that enables the material to be heated beyond the maximum working temperature of the substrate without damage. Its shaped pulse rate is synchronized to the conveyance speed of a conveyance system. By using the information from a feedback sensor, the thermal gradient is recalculated to alter the shape of the pulses in real time for optimizing subsequent curings in real time without powering down the curing apparatus. The combined pulse shaping and synchronization allow a temperature profile to be tailored in the sample that is uniformly cured in the conveyance direction.

Abstract: An apparatus for curing thin films is disclosed. The apparatus includes a computer control system, a conveyance system, a flashlamp controller, and a flashlamp. The curing apparatus also includes a high average power, low-inductance cable connected between the flashlamp controller and the flashlamp. The low-inductance cable is smaller in diameter and is more flexible than the prior art and includes at least one liquid cooling line and multiple forward and return path wires interleaved in a regular hexagonal closed packed configuration such that every wire is adjacent to at least one cooling line and at least one wire of opposite polarity.

Abstract: An apparatus for curing thin films is disclosed. The apparatus includes a computer control system, a conveyance system, a flashlamp controller, and a flashlamp. The curing apparatus also includes a high average power, low-inductance cable connected between the flashlamp controller and the flashlamp. The low-inductance cable is smaller in diameter and is more flexible than the prior art and includes at least one liquid cooling line and multiple forward and return path wires interleaved in a regular hexagonal closed packed configuration such that every wire is adjacent to at least one cooling line and at least one wire of opposite polarity.

Abstract: A curing apparatus is disclosed. The curing apparatus includes a flash lamp and a lamp housing for containing the flash lamp with the flash lamp's longitudinal axis in parallel with the direction of motion of a moving substrate irradiated by the flash lamp. The lamp housing is capable of attaching to a second lamp housing to form a concatenated lamp housing having a common reflector cavity. The second lamp housing also holds a second flash lamp with the second flash lamp's longitudinal axis in parallel with the direction of the moving substrate under the second flash lamp.

Abstract: A method and apparatus for thermally processing material on a low-temperature substrate using pulsed light from a flash lamp is disclosed. Material is conveyed past the flash lamp. The pulses of light are formed by Pulse Width Modulation to tailor the shape of the pulses to generate a thermal gradient in the substrate that enables the material to be heated beyond the maximum working temperature of the substrate without damage. Its shaped pulse rate is synchronized to the conveyance speed of a conveyance system. By using the information from a feedback sensor, the thermal gradient is recalculated to alter the shape of the pulses in real time for optimizing subsequent curings in real time without powering down the curing apparatus. The combined pulse shaping and synchronization allow a temperature profile to be tailored in the sample that is uniformly cured in the conveyance direction.

Abstract: A method and apparatus for thermally processing material on a low-temperature substrate using pulsed light from a flash lamp is disclosed. Material is conveyed past the flash lamp. The pulses of light are formed by Pulse Width Modulation to tailor the shape of the pulses to generate a thermal gradient in the substrate that enables the material to be heated beyond the maximum working temperature of the substrate without damage. Its shaped pulse rate is synchronized to the conveyance speed of a conveyance system. By using the information from a feedback sensor, the thermal gradient is recalculated to alter the shape of the pulses in real time for optimizing subsequent curings in real time without powering down the curing apparatus. The combined pulse shaping and synchronization allow a temperature profile to be tailored in the sample that is uniformly cured in the conveyance direction.

Abstract: A curing apparatus is disclosed. The curing apparatus includes a flash lamp and a lamp housing for containing the flash lamp with the flash lamp's longitudinal axis in parallel with the direction of motion of a moving substrate irradiated by the flash lamp. The lamp housing is capable of attaching to a second lamp housing to form a concatenated lamp housing having a common reflector cavity. The second lamp housing also holds a second flash lamp with the second flash lamp's longitudinal axis in parallel with the direction of the moving substrate under the second flash lamp.

Abstract: An apparatus for curing thin films is disclosed. The apparatus includes a computer control system, a conveyance system, a flashlamp controller, and a flashlamp. The curing apparatus also includes a high average power, low-inductance cable connected between the flashlamp controller and the flashlamp. The low-inductance cable is smaller in diameter and is more flexible than the prior art and includes at least one liquid cooling line and multiple forward and return path wires interleaved in a regular hexagonal closed packed configuration such that every wire is adjacent to at least one cooling line and at least one wire of opposite polarity.

Abstract: A method and apparatus for thermally processing material on a low-temperature substrate using pulsed light from a flash lamp is disclosed. Material is conveyed past the flash lamp. The pulses of light are formed by Pulse Width Modulation to tailor the shape of the pulses to generate a thermal gradient in the substrate that enables the material to be heated beyond the maximum working temperature of the substrate without damage. Its shaped pulse rate is synchronized to the conveyance speed of a conveyance system. By using the information from a feedback sensor, the thermal gradient is recalculated to alter the shape of the pulses in real time for optimizing subsequent curings in real time without powering down the curing apparatus. The combined pulse shaping and synchronization allow a temperature profile to be tailored in the sample that is uniformly cured in the conveyance direction.

Abstract: An electrical connector includes first and second conducting members that are pivotally attached to each other. A portion of the first and second conducting members distal to the pivotal attachment form an electrical contact with the electrode. The first and second conducting member, when operable connected to electric power source, provide parallel current paths for an electric current form the power source to the electrode. Further, the first and second conducting members are configured to provide additional forces at the contact with the electrode in response to magnetic field effects of the current flow Lorentz force), the additional forces having at least a predetermine value when a value of the electric current has a preselected value. For example, the predetermined value of the additional forces may be determined, using known properties of electrical contacts, so as to ensure that the contact does not fail when the current reaches the preselected value.

Abstract: A reaction vessel and a method for efficiently producing and collecting nanoparticles in the reaction vessel using cyclonic gas flow. Gas is injected through an inlet tangentially positioned relative to the axis of the vessel to cause the gas to form an outer helical vortex flow and an inner helical vortex flow within the vessel. A reaction synthesizer is operated within the inner helical vortex to produce nanoparticles and larger byproduct particles from precursor materials. The double helical vortex conveys the byproduct particles to an outlet for collection responsive to the cyclonic flow and gravity and an outlet downstream of the inner helical vortex collects the nanoparticles. The vortices formed in the reaction vessel minimize buildup on walls of the reaction vessel and provide a way to rapidly move the synthesized nanoparticles out of the reaction vessel.