Abstract: One embodiment pertains to a method for reviewing a potential defect on a substrate from one electron image. An image of an area containing the potential defect is obtained using a charged-particle apparatus. At least three image segments within the image are determined. The three segments are transformably identical to each other, and one of said three segments includes the potential defect. Another embodiment pertains to a method for reviewing a potential defect on a substrate by obtaining an electron-beam image of a relatively large field of view containing a first image segment. The first image segment is substantially smaller than the field of view and includes a location of the potential defect. A comparison image segment within the field of view is determined. The comparison image segment is transformably identical to the first image segment. Other embodiments and features are also disclosed.

Abstract: One embodiment pertains to a method for reviewing a potential defect on a substrate from one electron image. An image of an area containing the potential defect is obtained using a charged-particle apparatus. At least three image segments within the image are determined. The three segments are transformably identical to each other, and one of said three segments includes the potential defect. Another embodiment pertains to a method for reviewing a potential defect on a substrate by obtaining an electron-beam image of a relatively large field of view containing a first image segment. The first image segment is substantially smaller than the field of view and includes a location of the potential defect. A comparison image segment within the field of view is determined. The comparison image segment is transformably identical to the first image segment. Other embodiments and features are also disclosed.

Abstract: A particle beam system having a beam source for generating a particle beam and a vacuum air bearing. The beam source is mounted to a first side of the vacuum air bearing, with an active side of the vacuum air bearing disposed on an opposing second side of the vacuum air bearing. The active side is adapted to receive and retain a substrate. A beam port is formed completely through the vacuum air bearing from the first side to the second side. Means are provided for moving the substrate across the second side of the vacuum air bearing and positioning the substrate under the beam port. Means are also provided for sealing an interior of the beam source from exposure to atmosphere through the beam port.

Abstract: without substantially touching the surface, having annular rings forming annular orifices, one of the rings forming an air bearing portion and having passages through which a flow of a gas can be established in a first direction, where the flow of the gas is sufficient to create a cushion of air between the puck and the surface, and at least some of the orifices for drawing vacuums through the orifices in a second direction opposite to the first direction against the surface.

Abstract: The disclosure relates to a method and system of electron beam scanning for measurement, inspection or review. In accordance with one embodiment, the method includes a first scan on a region to collect first image data. The first image data is processed to determine information about a feature in the region. A scanning method is selected for imaging the feature. A second scan using the selected scanning method on the feature is then applied to collect second image data.

Abstract: One embodiment disclosed relates to a method for automated focusing of an electron image. An EF cut-off voltage is determined. In compensation for a change in the EF cut-off voltage, a focusing condition is adjusted. Adjusting the focusing condition may comprise, for example, adjusting a wafer bias voltage in correspondence to the change in cut-off voltage. Another embodiment disclosed relates to a method for automated focusing of an electron image in a scanning electron imaging apparatus. A focusing condition of a primary electron beam in a first image plane is varied so as to maximize an intensity of a secondary electron beam through an aperture in a second image plane.

Abstract: One embodiment disclosed relates to a Wien filter for a charged-particle beam apparatus. The charged-particle beam is transmitted through the Wien filter in a first direction. A magnetic field generation mechanism is configured to generate a magnetic field in a second direction which is perpendicular to the first direction, and an electrostatic field generation mechanism is configured to generate an electrostatic field in a third direction which is perpendicular to the first and second directions. The field generation mechanisms are further configured so as to have an offset between the positions of the magnetic and electrostatic fields along the first direction. Another embodiment disclosed relates to a Wien filter type device wherein the magnetic force is approximately twice in strength compared to the electrostatic force. Other embodiments are also disclosed.

Abstract: One embodiment disclosed relates to a scanning electron beam apparatus including an objective lens, scan deflectors, de-scan deflectors, an energy-filter drift tube, and a segmented detector. The objective lens may be an immersion lens configured with a high extraction field so as to preserve azimuthal angle discrimination of the electrons scattered from the specimen surface. The de-scan deflectors may be used to compensate for the scanning of the incident electron beam. The energy-filter drift tube is configured to align the scattered electrons according to polar angles of trajectory from the specimen surface.

Abstract: One embodiment disclosed relates to a method for automated focusing of an electron image. An EF cut-off voltage is determined. In compensation for a change in the EF cut-off voltage, a focusing condition is adjusted. Adjusting the focusing condition may comprise, for example, adjusting a wafer bias voltage in correspondence to the change in cut-off voltage. Another embodiment disclosed relates to a method for automated focusing of an electron image in a scanning electron imaging apparatus. A focusing condition of a primary electron beam in a first image plane is varied so as to maximize an intensity of a secondary electron beam through an aperture in a second image plane.

Abstract: The disclosure relates to a method and system of electron beam scanning for measurement, inspection or review. In accordance with one embodiment, the method includes a first scan on a region to collect first image data. The first image data is processed to determine information about a feature in the region. A scanning method is selected for imaging the feature. A second scan using the selected scanning method on the feature is then applied to collect second image data.

Abstract: A method and apparatus for generating an image of a specimen with a scanning electron microscope (SEM) is disclosed. The SEM (200) has a source unit (202 through 220) for directing an electron beam (203) substantially towards a portion of the specimen (222), a detector (224) for detecting particles (205) that are emitted from the specimen (222), and an image generator (234 through 242) for generating the image of the specimen (222) from the emitted particles (205). The image features are controlled by conditions under which the image is generated. The specimen is scanned under a first set of conditions (252) to generate a first image during a first image phase (302, 402). The specimen is then scanned under a second set conditions (254) during a setup phase (304, 404). The second set of conditions is selected to control charge on the specimen. The specimen is then scanned under the first set of conditions (252) to generate a second image during a second image phase (306, 406).

Abstract: A method and apparatus for generating an image of a specimen with a scanning electron microscope (SEM) is disclosed. The SEM has a source unit for directing an electron beam substantially towards a portion of the specimen, a detector for detecting particles that are emitted from the specimen, and an image generator for generating the image of the specimen from the emitted particles. The image features are controlled by conditions under which the image is generated. The specimen is scanned under a first set of conditions to generate a first image during a first image phase. The specimen is then scanned under a second set of conditions during a setup phase. The second set of conditions are selected to control charge on the specimen. The specimen is then scanned under the first set of conditions to generate a second image during a second image phase. The features of the second image are controlled by the first and second sets of conditions.