Abstract: A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.

Abstract: A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.

Abstract: A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.

Abstract: An apparatus for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The apparatus enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1-4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

Abstract: A method for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The method is implemented via an apparatus that enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1-4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

Abstract: A method includes placing a circuit board on a test sheet so that conductive pins on an underside of the circuit board are in electrically conductive contact with electrically conductive contact pads on an upper surface of the test sheet. The test sheet includes connectors at a periphery of the test sheet. The connectors couple the test sheet to test signal generating devices. The method further includes applying test signals to the circuit board via the test sheet. Other embodiments are described and claimed.

Abstract: A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.