Abstract: Techniques are provided for x-ray sensing for intraoral tomography. A methodology implementing the techniques according to an embodiment includes detecting an x-ray pulse based on energy received at one or more pixels of a pixel array. The method also includes integrating the energy received at each of the pixels of the array of pixels, in response to the detection, wherein the energy received at each of the pixels is associated with the x-ray pulse. The method further includes multiplexing readouts of analog signals from the array of pixels into two or more parallel channels. The method further includes simultaneously converting (or otherwise in parallel) the analog signals of each of the channels into digital signals and storing the digital signals in memory as frames of data. The method may further include, for example, transmitting the frames of data from the memory, over a Universal Serial Bus, to an imaging system.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract: A structure of a hybrid MEMS structure is provided wherein a plate comprises a thin actuatable layer of conductive silicon, such as a MEMS actuatable element, and a thicker handle layer of conductive silicon to provide structural integrity which are separated by a thin oxide, together forming an SOI wafer. This plate is mounted to a substrate, typically ceramic, with the thin actuatable layer facing the substrate and separated by an air gap that is formed by creating, on the substrate, insulator standoffs which come in contact with the plate. A suitable dielectric material useful as a standoff on the substrate is a footrest that permits high aspect ratios.

Abstract: In an array apparatus, each MEMS element, comprising an actuatable element and a supportive handle, is mounted over a plurality of electrodes wherein the air gap is controlled by the thickness of the electrodes and not primarily by the structure of the handle. The structure of electrostatic actuation electrodes in specific embodiments is disclosed. While the invention is primarily a technique for reducing the air gap without unduly limiting the thickness of the handle, the invention may also be used to establish an air gap greater than the thickness of the handle.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of substrate, such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes disposed in substantial alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout and the electrodes are oversized such that in combination with the ceramic assembly are configured to allow for placement of the vias within a tolerance of position relative to electrodes such that contact is not lost therebetween at the time of manufacturing.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of substrate, such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes disposed in substantial alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout and the electrodes are oversized such that in combination with the ceramic assembly are configured to allow for placement of the vias within a tolerance of position relative to electrodes such that contact is not lost therebetween at the time of manufacturing.