Patents by Inventor Douglas Lee Stahl

Douglas Lee Stahl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7539184
    Abstract: A reconfigurable interconnect/switch for selectably coupling network devices, media, and switch fabric. The reconfigurable interconnect/switch enables network devices, such as network processor units (NPUs) to selectively communicate with other NPUs, media (via a media interface), and switch fabric (via a switch fabric interface), thus providing flexibility in the use of network line cards and the like. Embodiments of the switching/routing scheme may be employed to support network devices having separate media and/or switch fabric interfaces, as well as network devices having selectable media switch fabric (MSF) interfaces that share signal lines.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: May 26, 2009
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Douglas Lee Stahl, David R. Formisano
  • Patent number: 7502882
    Abstract: An Advanced Mezzanine Card (AMC) adapter may be used to connect a non-AMC mezzanine card to an AMC carrier. The AMC adapter may include a card edge connector configured to be connected to an AMC connector on the AMC carrier and one or more mezzanine connectors configured to be connected to the non-AMC mezzanine card. The AMC adapter may also include a bridge to convert between communication protocols used by the non-AMC mezzanine card and the AMC carrier. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: March 10, 2009
    Assignee: Intel Corporation
    Inventors: Douglas Lee Stahl, David R. Formisano, Andy Saffarian, Marwan Khoury
  • Patent number: 7172432
    Abstract: A stacked multiple connection module that provides multiple times the input/output (I/O) signal capacity of a single connection module. In one embodiment, a stacked dual connection module includes first and second circuit boards with respective edge connectors maintained at a parallel offset and configured to couple to a mating two slotted stacked edge connector. A connection means is provided to couple signals between the first and second circuit boards, such that components mounted on the first and/or second circuit board are enabled to access I/O signals via both of the edge connectors, thus doubling I/O signal capacity. In one embodiment, the stacked dual connection module comprises an Advanced Mezzanine Card (AdvancedMC) module having edge connectors configured to mate with an AdvancedMC connector.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: February 6, 2007
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Douglas Lee Stahl, Steven DeNies, Jay Gilbert, Jacek Budny, Gerard Wisniewski