Abstract: Disclosed are composite filaments for 3D printing. The filaments typically have high strength, an appropriate resorption rate, and high biocompatibility. The filaments generally contain a matrix formed of a blend containing a bioresorbable polymer and an inorganic component. The filaments can be used to produce customized scaffolds for repairing bone defects following implantation in the site of the defect. The shape and size of the scaffold can be configured to fit in and conform to the bone defect. The scaffolds are especially useful in repairing critical sized bone defect, such as a critical sized bone defect in a weight-bearing long bone.

Abstract: One or more techniques and/or systems are disclosed for a luminescent film that can be used with a biometric imager, which can be used to scan biometric markers, and/or to interact with the device. Upon contacting a device surface, an image of at least a portion of the touch object can be captured and used in conjunction with identification of the user and/or for input to the device. The systems or techniques, described herein, may be integrated into a portion of a device, and may comprise a luminescent layer, comprising quantum dots, that can emit photons upon contact, and an image capture component that can generate data indicative of an image of at least a portion of the touch object.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.

Abstract: In some embodiments, the present invention is directed to a method for chemically modifying 7-substituted coumarins to produce polymerizable monomers that are used to prepare photoresponsive materials. In one embodiment, 7-hydroxy-coumarin (umbelliferone) is so modified. The present invention also relates to the photoresponsive linear polymers, copolymers, and hybrid network materials produced from the polymerizable monomers, and the method for their preparation.

Abstract: Aerogel monoliths are treated with silanes or transition metal-containing reagents by chemical vapor deposition. This treatment improves the mechanical strength of the aerogel while maintaining their high surface area, low density, and porosity. When silane containing reagents are used, the transparency is generally maintained.