Abstract: A built-up gas turbine component is prepared by providing a gas turbine component having a component surface and being made of a component base metal having a component base metal composition. A buildup tape is supplied having a net metallic buildup composition different from the component base metal composition. The buildup tape includes a first metallic constituent having a first melting point, and a second metallic constituent having a second melting point. The first metallic constituent and second metallic constituent together have the net metallic buildup composition. A nonmetallic binder binds together the first metallic constituent and the second metallic constituent. The buildup tape is applied to the component surface and heated to a brazing temperature greater than the first melting point and less than the second melting point.

Abstract: A built-up gas turbine component is prepared by providing a gas turbine component having a component surface and being made of a component base metal having a component base metal composition. A buildup tape is supplied having a net metallic buildup composition different from the component base metal composition. The buildup tape includes a first metallic constituent having a first melting point, and a second metallic constituent having a second melting point. The first metallic constituent and second metallic constituent together have the net metallic buildup composition. A nonmetallic binder binds together the first metallic constituent and the second metallic constituent. The buildup tape is applied to the component surface and heated to a brazing temperature greater than the first melting point and less than the second melting point.

Abstract: An article having a layer of metal thermally sprayed over a substrate with a roughened interface at the surface of the substrate applied by a thermal spray process, such as the HVOF process. The interface has a predetermined cleanliness level so that after a diffusion heat treatment, the applied layer has an extended life in severe gas turbine service due to improved adhesion of the layer to the substrate. When the article is used for high temperature applications such as turbine shrouds and encounters significant levels of stress, the strength of the interface can be a factor in the life of the coating.

Abstract: The present invention relates to an improved system and method for cooling electronic devices. The present system is particularly adapted for cooling computer equipment. The system comprises a sealed enclosure which houses one or more heat generating electronic devices; a blower; and a heat exchanger. The sealed enclosure may be pressurized with a gas medium such as dry nitrogen up to a pressure of approximately two atmospheres. The elevated pressure increases the gas density, effectively increasing the mass flow rate and heat carrying capacity of the gas. The blower is also a constant volume device such that it can move the same volume of gas regardless of density. Accordingly, for a given heat load, the size of the blower may be reduced. Or, alternatively, a given blower can cool a device having a higher heat load. Finally, by pressurizing the enclosure, the present invention eliminates the need to size a forced air cooling system based on high elevation requirements.

Abstract: A heat sink is disclosed having an elongate, porous metal structure, including multiple sets of thermally conductive members. The members, which are interwoven, direct heat away from a heat producing component. The elongate structure of the matrix structure can be formed in a variety of predetermined forms, including a coiled structure or an elliptically coiled structure. Alternatively, the matrix structure is plated for added thermal conductivity between the sets of members. In addition, air flow is directed over the heat sink for added convection of heat. The heat sink is fabricated using a mesh of thermally conductive material such as copper or aluminum and can be provided with a plurality of protuberances. The heat sink is thermally bonded to the heat producing component. Alternatively, the heat sink has a ledge for sealing with a duct.A method for cooling a heat producing component is also disclosed.

Abstract: The cooling of electronic modules on a circuit board is improved by the use of heat sinks comprising a plurality of longitudinal fins projecting from the modules. Individual tubes communicating with an air plenum fit around and part way along each heat sink. Air drawn from or forced into the plenum causes air flow within the tubes and along the fins to cool them and the modules to which they are attached.

Abstract: A circuit board is provided with a plurality of groups of connectors, so disposed and arranged in respect to each other that each group is capable of receiving a chip carrier. A fluid conduit, carrying a coolant, extends through each group so that when the contacts of a chip carrier are assembled to a group of connectors, a circuit chip, having a heat dissipating bar, is in close contact with the conduit. Conductors on each chip make electrical contact to the contacts on the chip carrier. A clip fastener is fastened to the carrier and includes bias means to bias the chip so that electrical connection is established between the chip contacts and the carrier contacts and thermal connection is established between the heat dissipating bar and the conduit.