Abstract: An improved die-mounting paddle for mechanical stress reduction in plastic integrated circuit packages. The paddle, which is incorporated in a leadframe, comprises multiple, coplanar floating sub-paddles, each of which is attached to a support beam by a flexible coil, thus allowing a large die to remain firmly attached to each of the pads, in spite of differences in the coefficients of expansion between the leadframe paddle metal and the die that might well result in bonding wire breakage or die breakage if a conventional single large paddle were utilized.